• Title/Summary/Keyword: zener diode

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Automatic Power Switching Unit (비상 전원용 초소형 스위칭 모듈 관한 연구)

  • Kang, Ey-Goo;Ann, Byoung-Sup;Nam, Tae-Jin;Kim, Bum-June;Lee, Young-Hon;Chung, Hun-Suk
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.82-82
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    • 2009
  • 현재 국내에는 많은 가구들이 전기를 사용하고 있다. 아파트, 주택에 들어가는 전기 시스템들이 많이 발전하였지만 뜻하지 않은 사고로 인해 정전이 되는 경우가 있다. 정전시에는 아파트 같은 경우는 비상등, 엘리베이터 등 최소한의 장치만이 작동하도록 되어있다. 그러므로 각 세대에는 전기가 들어가지 않는다. 우리나라 경우에는 태풍이나 여름 같은 경우에는 전기를 많이 사용하기 때문에 발전기가 과부화 걸리는 현상이 생기기도 한다. 장기간 정전시에 가장 문제가 되는 기기는 냉장고, 전등이 될 것이다. 냉장고 같은 경우는 음식들이 상하게 되고, 전등 같은 경우에는 밤에 활동하는데 지장을 주게 된다. 따라서 본 논문에서는 정전시에는 자동적으로 비상발전기의 전원을 사용하고, 상시에는 다시 한전의 전원을 사용하게 하는 초소형 자동 스위칭 전원 모듈을 설계 제작한 논문이다. 설계된 스위칭 모듈에 대해서 시뮬레이션한 결과 예상한대로 비상시에 자동적으로 스위칭되는 결과를 알 수 있었다.

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Process Capability Optimization of Ball Bonding Using Response Surface Analysis in Light Emitting Diode(LED) Wire Bonding (반응 표면 분석법을 이용한 Light Emitting Diode(LED) wire bonding 용 Ball Bonding 공정 최적화에 관한 연구)

  • Kim, Byung-Chan;Ha, Seok-Jae;Yang, Ji-Kyung;Lee, In-Cheol;Kang, Dong-Seong;Han, Bong-Seok;Han, Yu-Jin
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.4
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    • pp.175-182
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    • 2017
  • In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

Abnormal Voltage Detection Circuit with Single Supply Using Threshold of MOS-FET for Power Supply Input Stage (FET 문턱전압 특징을 이용한 전원입력단용 단일전원 이상전원 검출회로)

  • Won, Joo Ho;Ko, Hyoungho
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.11
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    • pp.107-113
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    • 2016
  • All circuits in power input can only use the power provided by an external power supply. General electronic circuits use a secondary supply generated by a converter using a primary power in the power input. But protection and detection circuit for over-voltage circuit or under-voltage in power input have to use that input power because there is no other supply in power input. Therefore, previous electronics for satellite can protect only over-voltage using a zener diode, and can't detect over-voltage and under-voltage events, and provide a detection capability for over-voltage and under-voltage only for secondary supply. The proposed circuit can detect over-voltage and under-voltage using a single supply for the primary power input, +28V, with the threshold characteristics for MOS-FET, and the accuracy for a detection circuit is increased by 2.5%.

Design of a Low-Voltage $Constant-g_m$ Rail-to-Rail CMOS Op-amp (저전압 $Constant-g_m$ Rail-to-Rail CMOS 증폭회로 설계)

  • 이태원;이경일;오원석;박종태;유창근
    • Journal of the Korean Institute of Telematics and Electronics C
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    • v.35C no.2
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    • pp.22-28
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    • 1998
  • A $g_m$-control technique using a new electronic zener diode (EZD) for CMOS rail-torail input stages is presented. A regulated CMOS inverter is used as an EZD to obtain a constant-$g_m$ input stage. The turn-off characteristic of the proposed EZD is better than that of the existing EZD using two complementarey diodes, and thus, better $g_m$-control can be achieved. With this input stage, a 3V constant-$g_m$ rail-to-rail CMOS op-amp has been designed and fabricated using a $0.8\mu\extrm{m}$single-poly, double-metal CMOS process. Measurements results show that the $g_m$ variation is about 6% over the entire input common-mode range, and the op-amp has a dc gain of 88dB and a unity-gain frequency of 4MHz for $C_L=20pF, R_L=10k\Omega$

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Passive Transient Voltage Suppression Devices for 42-Volt Automotive Electrical Systems

  • Shen, Z.John
    • Journal of Power Electronics
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    • v.2 no.3
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    • pp.171-180
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    • 2002
  • New 42-volt automotive electrical systems can provide significant improvements in vehicle performance and fuel economy. It is crucial to provide protection against load dump and other overvoltage transients in 42-volt systems. While advanced active control techniques are generally considered capable of providing such protection, the use of passive transient voltage suppression (TVS) devices as a secondary or supplementary protection means can significantly improve design flexibility and reduce system costs. This paper examines the needs and options for passive TVS devices for 42-volt applications. The limitations of the commonly available automotive TVS devices, such as Zener diodes and metal oxide varistors (MOV), are analyzed and reviewed. A new TVS device concept, based on power MOSFET and thin-film polycrystalline silicon back-to-back diode technology, is proposed to provide a better control on the clamp voltage and meet the new 42-volt specification. Both experimental and modeling results are presented. Issues related to the temperature dependence and energy absorbing capability of the new TVS device are discussed in detail. It is concluded that the proposed TVS device provides a cost-effective solution for load dump protection in 42-volt systems.

Lightning Surge Response Characteristics of Non-tripping Type Earth Leakage Breakers for Impulse (충격파 부동작형 누전차단기의 뇌써지 응답 특성)

  • Lee, J.B.;Myung, S.H.;Cho, Y.G.;Chang, S.H.;Kim, J.S.;Kil, G.S.
    • Proceedings of the KIEE Conference
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    • 2002.07c
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    • pp.1688-1690
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    • 2002
  • The unpredictable threat of lightning surge is ever increasing in today's low-voltage power supplies. Thus Surge protection devices for AC mains are more widely used. The false-tripping of the earth leakage breaker (ELB) can be caused by the installation of surge protection devices with MOV. In order to examine the cause of malfunction, the malfunction characteristics of ELBs applied by lightning surge were investigated experimentally. As a result, all of them brought about malfunctions under 7 kV of the impulse voltage. The suitable position of MOV and use of zener diode were suggested to eliminate the problems.

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A High-speed Level-shifter Circuit for Display Panel driver (디스플레이 구동을 위한 고속 레벨-쉬프터 회로)

  • Park, Won-ki;Cha, Cheol-ung;Lee, Sung-chul
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.657-658
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    • 2006
  • A Novel level-shifter circuit for Display Panel Driver is presented. A Proposed level-shifter is for the high speed and high-voltage driving capability. In order to achieve this purpose, the proposed level-shifter restricts and separates the Vgs of the output driver's pull-up PMOS and pull-down NMOS with Zener diode. And a speed-up PMOS transistor is introduced to reduce delay. The control signal of speed-up PMOS was designed by bootstrapping method to minimize the gate to source (Vgs) voltage to avoid Vgs breakdown.

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Improved ZVT(Zero Voltage Transition) Boost Converter (개선된 ZVT 부스트 컨버터)

  • Lee Il-Oun;Lee Dong-Young;Cho Bo-Hyung
    • Proceedings of the KIPE Conference
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    • 2001.07a
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    • pp.673-676
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    • 2001
  • In this paper, the improved zero-voltage transition(ZVT) PWM boost converter using an inductor feedback technique is proposed. The improved circuit uses a low-voltage zener diode to reduce the turn-off witching loss of the auxiliary witch and EMI noise. Using this technique, soft-witching for the auxiliary switch is guaranted at wide line and load ranges and some of the energy circulating in the auxiliary circuit is fed to the load Since the active switches are turned on and off softly, the witching losses and EMI noise are reduced significantly and the higher efficiency of the system is achieved. In this paper, the modes of converter operation are explained and analyzed, design guidelines are given, and experimental results of 1kW, 100kHz prototype system are presented.

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Process Capability Optimization of a LED Die Bonding Using Response Surface Analysis (반응표면분석법을 이용한 LED Die Bonding 공정능력 최적화)

  • Ha, Seok-Jae;Cho, Yong-Kyu;Cho, Myeong-Woo;Lee, Kwang-Cheol;Choi, Won-Ho
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.10
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    • pp.4378-4384
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    • 2012
  • In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. This paper focuses on the process optimization of a LED die bonding, which attaches small zener diode chip on PLCC LED package frame, using response surface analysis. Design of experiment (DOE) of 5 factors, 3 levels and 5 responses are considered, and the results are investigated. As the results, optimal conditions those satisfy all response objects can be derived.

Protection Effects of Surge Protective Devices According to Types of system Groundings (전원계통의 접지방식에 따른 서지보호기의 보호효과)

  • 이복희;이동문;강성만;이수봉
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.17 no.6
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    • pp.66-71
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    • 2003
  • Electronic equipments made from integrated circuits and small-sized semiconductors is protected by surge protective devices(SPDs) such as ZnO varistors, Zener diode and gas discharge tube from lightning overvoltages. However the clamping voltage of SPDs is greatly influenced by the method of installing the SPDs. In this paper, the protective effects of SPDs according to types of system groundings were experimentally investigated. The separate grounding is a particularly undesirable way to install SPDs. The effectiveness of the common grounding point for ZnO varistors is more pronounced than that for gas discharge tubes. The common grounding at the terminal of SPDs is recommended as a best method of installing SPDs.