• Title/Summary/Keyword: x-ray cross-sectional image

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Analysis of X-ray image qualities-accuracy of shape and clearness of image-using X-ray digital tomosynthesis

  • Roh, Young Jun;Kang, Sung Taek;Kim, Hyung Cheol;Kim, Sung-Kwon
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.572-576
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    • 1997
  • X-ray laminography and DT(digital tomosynthesis) that can form a cross-sectional image of 3-D objects promise to be good solutions for inspecting interior defects of industrial products. The major factors of the digital tomosynthesis that influence on the quality of x-ray cross-sectional images are also discussed. The quality of images acquired from the DT system varies according to image synthesizing methods, the number of images used in image synthesizing, and X-ray projection angles. In this paper, a new image synthesizing method named 'log-root method' is proposed to get clear and accurate cross-sectional images, which can reduce both artifact and blurring generated by materials out of focal plane. To evaluate the quality of cross-sectional images, two evaluating criteria: (1) shape accuracy and (2) clearness in the cross-sectional image are defined. Based on this criteria, a series of simulations were performed, and the results show the superiority of the new synthesizing method over the existing ones such as averaging and minimum method.

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A new X-ray cross-sectional image system for solder joint inspection of double-sided PCB (양면 PCB의 납땜부 검사를 위한 새로운 X선 단층영상 시스템)

  • 강성택;정재훈;조형석
    • 제어로봇시스템학회:학술대회논문집
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    • 1996.10b
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    • pp.117-120
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    • 1996
  • In this paper, a new approach to acquire the cross-sentional image for automatic solder joint inspection of double-sided PCB using X-ray source is presented. We designed the apparatus with fixed X-ray source to realize the cross-sectional image by tunning object and detector synchronously. The cross-sectional images are captured at several view angle of X-ray source, the geometric image distortions caused by view angle and the shape of image intensifier are compensated. The precision variation of cross-sectional image by the change of view angle was investigated. Also we acquired the cross-sectional image to the solder joint of double-sided PCB and reconstructed the shape of solder joint.

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Analysis of X-ray image Qualities -accuracy of shape and clearness of image using X-ray digital tomosynthesis (디지털 영상 합성에 의한 X선 단층 영상의 형상 정확도와 선명도 분석)

  • Roh, Yeong-Jun;Cho, Hyung-Suck;Kim, Hyeong-Cheol;Kim, Sung-Kwon
    • Journal of Institute of Control, Robotics and Systems
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    • v.5 no.5
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    • pp.558-567
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    • 1999
  • X-ray laminography and DT(digital tomosynthesis) that can form a cross-sectional image of 3-D objects promis to be good solutions for inspecting interior defects of industrial products. DT is a kind of laminography technique and the difference is in the fact that it synthesizes the several projected images by use of the digitized memory and computation. The quality of images acquired from the DT system varies according to image synthesizing methods, the number of images used in image synthesizing, and X-ray projection angles. In this paper, a new image synthesizing method named 'log-root method' is proposed to get clear and accurate cross-sectional images, which can reduce both artifact and blurring generated by materials out of focal plane. To evaluate the quality of cross-sectional images, two evaluating criteria : (1) shape accuracy and (2) clearness of the cross-sectional images are defined. Based on these criteria, a series of simulations are performed, and the results show the superiority of the new synthesizing method over the existing ones such as averaging and minimum methods.

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The analysis and design of X-ray cross sectional imaging system for PCB solder joint inspection (PCB 납땜 검사를 위한 X선 단층 영상 시스템의 해석 및 설계)

  • 노영준;강성택;김형철;김성권
    • 제어로봇시스템학회:학술대회논문집
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    • 1996.10b
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    • pp.109-112
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    • 1996
  • The more integrated and smaller SMD are needed, new solder joints packaging technologies are developed in these days such as BGA(Ball Grid Array), Flip Chip, J-lead etc. But, it's unable to inspect solder joints in those devices by visual inspection methods, because they are hided by it's packages. To inspect those new SMD packages, an X-ray system for acquiring a cross-sectional image of a arbitrary plane is necessary. In this paper, an analysis for designing X-ray cross sectional imaging system is presented including the way for correcting the distortion of image intensifier. And we show computer simulation of that system with a simple PCB model to show it's usefulness in applying PCB solder joint inspection.

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Defect Detection of Brazing Joint in Heat Exchanger Using X-ray Image (X-선을 이용한 열교환기 브레이징 접합부 결함 검출)

  • Kim, Jin-Young;Seo, Sang-Woo
    • Journal of Institute of Control, Robotics and Systems
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    • v.17 no.10
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    • pp.1044-1050
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    • 2011
  • The quality of brazing joints is one of the most important factors that have an effect on the performance of the brazing joint-based heat exchangers with the growing use in industry recently. Therefore, it is necessary to inspect the brazing joints in order to guarantee the performance of the heat exchangers. This paper presents a non-destructive method to inspect the brazing joints of the heat exchangers using X-ray. Firstly, X-ray cross-sectional images of the brazing joints are obtained by using CT (Computerized Tomography) technology. Cross-sectional image from CT is more useful to detect the inner defects than the traditional transmitted X-ray image. Secondly, the acquired images are processed by an algorithm proposed for the defect detection of brazing joint. Finally, two types of brazing joint are examined in a series of experiments to detect the defects in brazing joints. The experimental results show that the proposed algorithm is effective for defect detection of the brazing joints in heat exchangers.

Type Classification and Shape Display of Brazing Defect in Heat Exchanger (열교환기 브레이징 결함의 유형 분류 및 형상 디스플레이)

  • Kim, Jin-Young
    • Journal of Institute of Control, Robotics and Systems
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    • v.19 no.2
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    • pp.171-176
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    • 2013
  • X-ray cross-sectional image-based inspection technique is one of the most useful methods to inspect the brazing joints of heat exchanger. Through X-ray cross-sectional image acquisition, image processing, and defect inspection, the defects of brazing joints can be detected. This paper presents a method to judge the type of detected defects automatically, and to display them three-dimensionally. The defect type is classified as unconnected defect, void, and so on, based on location, size, and shape information of defect. Three-dimensional display which is realized using OpenGL (Open Graphics Library) will be helpful to understand the overall situation including location, size, shape of the defects in a test object.

Assessment of Cancellous Bone of Mandible by Multifunctional Panoramic X-Ray Machine (다기능 파노라마 방사선촬영장치를 이용한 하악해면골질의 평가)

  • Ko Jae-Kyung;Kim Jae-Duk
    • Imaging Science in Dentistry
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    • v.30 no.1
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    • pp.16-22
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    • 2000
  • Purpose : To evaluate the bone densities measured on copper-equivalent image of cross sectional view of mandibular edentulous premolar area obtained by multifuctional panoramic x-ray machine, PM 2002 CC with transversal slicing system. Materials and Methods: Panoramic cross sectional views with 8 mm focal layer of aluminum step and blocks, of hydroxyapatite (RA) step, 6 HA blocks and copper step wedge having 0.03 mm thickness of each step, and of 3 bone blocks cutted by 8 mm thickness mesiodistally and a dry mandible with copper step wedge were taken by using transversal slicing system in PM 2002 Cc. All reference-equivalent images were made and analyzed by NIH image program. Results: The average copper-equivalent value of cancellous bone of bone blocks on the panoramic cross sectional view was 0.026 ± 0.020 mm Cu. The calculated average bone density was 0.38g/cm². There was no significant difference (P>0.1) between the bone densities on intraoral digital view and on the panoramic digital cross sectional view. Conclusion: The copper-equivalent image of panoramic digital cross sectional view obtained by PM 2002 CC with very thin copper step wedge was supposed to be useful to measure the bone density of cancellous bone of mandible at the premolar edentulous area.

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Center Determination for Cone-Beam X-ray Tomography

  • Narkbuakaew, W.;Ngamanekrat, S.;Withayachumnankul, W.;Pintavirooj, C.;Sangworasil, M.
    • 제어로봇시스템학회:학술대회논문집
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    • 2004.08a
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    • pp.1885-1888
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    • 2004
  • In order to render 3D model of the bone, the stack of cross-sectional images must be reconstructed from a series of X-ray radiographs, served as the projections. In the case where the distance between x-ray source and detector is not infinite, image reconstruction from projection based on parallel-beam geometry provides an error in the cross-sectional image. In such case, image reconstruction from projection based on conebeam geometry must be exercised instead. This paper is devoted to the determination of detector center for SART conebeam Technique which is critically effect the performance of the resulting 3D modeling.

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Hybrid Neural Network Based BGA Solder Joint Inspection Using Digital Tomosynthesis (하이브리드 신경회로망을 이용한 디지털 단층 영상의 BGA 검사)

  • Ko, Kuk-Won;Cho, Hyung-Suck;Kim, Jong-Hyeong;Kim, Hyung-Cheol
    • Journal of Institute of Control, Robotics and Systems
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    • v.7 no.3
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    • pp.246-254
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    • 2001
  • In this paper, we described an approach to the automation of visual inspection of BGA solder joint defects of surface mounted components on printed circuit board by using neural network. Inherently, the BGA solder joints are located underneath its own package body, and this induces a difficulty of taking good image of the solder joints by using conventional imaging systems. To acquire the cross-sectional image of BGA sol-der joint, X-ray cross-sectional imaging method such as laminography and digital tomosynthesis has been cur-rently utilized. However, the cross-sectional image obtained by using laminography or DT methods, has inher-ent blurring effect and artifact. This problem has been a major obstacle to extract suitable features for classifi-cation. To solve this problem, a neural network based classification method is proposed int his paper. The per-formance of the proposed approach is tested on numerous samples of printed circuit boards and compared with that of human inspector. Experimental results reveal that the method provides satisfactory perform-ance and practical usefulness in BGA solder joint inspection.

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Basic Physical Principles and Clinical Applications of Computed Tomography

  • Jung, Haijo
    • Progress in Medical Physics
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    • v.32 no.1
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    • pp.1-17
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    • 2021
  • The evolution of X-ray computed tomography (CT) has been based on the discovery of X-rays, the inception of the Radon transform, and the development of X-ray digital data acquisition systems and computer technology. Unlike conventional X-ray imaging (general radiography), CT reconstructs cross-sectional anatomical images of the internal structures according to X-ray attenuation coefficients (approximate tissue density) for almost every region in the body. This article reviews the essential physical principles and technical aspects of the CT scanner, including several notable evolutions in CT technology that resulted in the emergence of helical, multidetector, cone beam, portable, dual-energy, and phase-contrast CT, in integrated imaging modalities, such as positron-emission-tomography-CT and single-photon-emission-computed-tomography-CT, and in clinical applications, including image acquisition parameters, CT angiography, image adjustment, versatile image visualizations, volumetric/surface rendering on a computer workstation, radiation treatment planning, and target localization in radiotherapy. The understanding of CT characteristics will provide more effective and accurate patient care in the fields of diagnostics and radiotherapy, and can lead to the improvement of image quality and the optimization of exposure doses.