• Title/Summary/Keyword: wire breakage

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Surgical Treatment for Acute Acromioclavicular Joint Dislocation (급성 견봉쇄골관절 탈구의 수술적 치료)

  • Kim Jeong Hwan;Kim Chong Kwan;Lee Saeng Guk;Kim Young O;Park Jae Kyu;Yoon Jong Ho
    • Clinics in Shoulder and Elbow
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    • v.4 no.1
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    • pp.17-23
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    • 2001
  • There has been considerable controversy concerning the methods for treatment of dislocation of the acromioclavicular joint, especially in grade III injury. The authors have treated 24 cases of the complete dislocation of the acromioclavicular joint from January 1990 to July 2000. We performed 14 cases of coracoclavicular wiring operation, 10 cases of modified Phemister operation and compared the results and complication of wiring operation with modified Phemister. The clinical results in modified phemister operation were excellent in 8 cases(80%), good in 1 case(l0%), fair 1 case(10%). In wiring operation, excellent is 11 case(78%), good is 2 case(14%), fair is 1 case(14%). The complications of modified Phemister operation were breakage and migration of K-wire in 2 cases. In wiring operation, breakage of wire was in 2 cases but migration was not showed. We prefered coracoclavicular wiring operation for dislocation of acromioclavicular joint of active young adults because of the following advantages: 1) violation of acromioclavicular joint can be avoided but rotation of the clavicle was not restricted. 2) The operation is simple to perform. 3) Postoperative immobilization is minimal. 4) Removal of the wire is easy because wire was not migrated when breakage of wire was occured.

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A study on the machining of micro-extruding die using micro-drilling (마이크로 드릴링을 이용한 미세압출다이 가공에 관한 연구)

  • 민승기;제태진;이응숙;이동주
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.04a
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    • pp.161-166
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    • 2003
  • The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\phi50\mu m$ micro-drill which is coated with diamond is used for drilling of super micro-hole sizes. For the machining of taper parts of entrance and exit, drill having $\phi50\mu\textrm{mm}$ inclination angle $20^{\circ}$and angle $30^{\circ}$ is used. This is useful for anti tool-breakage and excessive too-wear in drilling process. After micro-drilling, the polishing process by diamond abrasive and polishing wood s carried out for increasing surface roughness.

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A study on the micro-hole machining for micro-extruding die (극세선용 압출다이의 미세구멍 가공기술 연구)

  • 민승기;제태진;이응숙;이동주
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.202-205
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    • 2002
  • The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\Phi$ 50${\mu}{\textrm}{m}$ micro-drill which is coated with diamond is used for drilling of super micro-hole sues. For the machining of taper parts of entrance and exit, drill having $\Phi$ 9mm inclination angle 20$^{\circ}$ is used. This is useful for anti tool-breakage in drilling process. After micro-drilling, the polishing process by abrasive is carried out for increasing surface roughness.

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Uniform deformation and Critical Current properties of 500 m class Bi-2223/Ag HTS tapes (500 m급 Bi-2223/Ag 고온초전도 선재의 균일 가공 및 임계전류 특성)

  • 이동훈;양주생;최정규;윤진국;황선역;김상철;하홍수;하동우;오상수
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2003.02a
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    • pp.85-87
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    • 2003
  • Intermediate annealing was carried out during wire drawing for uniform deformation of 500 m class Bi-2223/Ag HTS tapes. Wire drawing force was measured to evaluate the uniformity of wire deformation along the length. To prevent sausage and filament breakage of wire, drawing stress was controlled below 200 MPa by using intermediate annealing process. Thickness and width of the rolled tapes was measured 0.23 mm and 4.1 mm with low deviation $\pm$ 0.08 mm and $\pm$ 0.09 mm, respectively. The critical current of the 500 m tapes was measured 33.7 A $\pm$ 3.7 A by continuous critical current measurement system.

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Application of Acoustic Emission Technique for Bridge Cable Monitoring (교량 케이블 적용 강연선 모니터링을 위한 음향방출 기법 검토)

  • Kim, Ga-Young;Seo, Dong-Woo
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.22 no.4
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    • pp.121-125
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    • 2018
  • This paper presents the assessment of 7-wire strand monitoring using acoustic emission technique for bridges. 7-wire strand is widely used construction materials to provide additional tensile force to bridges. PSC (PreStressed Concrete) bridge and cable-stayed bridge are representatives for such cases. However, as the bridge aging progresses recently, corrosion problems of strand are emerging. For this reason, various NDT (Non-Destructive Test) methods for cable inspection are being studied and applied to the field. One of the NDT methods, acoustic emission technique, is known as an effective technique to detect cable damage and breakage. In this study, to evaluate the applicability of acoustic emission technique to bridges, acoustic emission signals according to damage of the strand were acquired and analyzed by tensile test. Moreover, The optimal AE sensor type was selected for field application. As a result, it is considered that the acoustic emission technique will be able to detect corrosion breakage and signs of rupture.

Ultrasonic guided wave approach incorporating SAFE for detecting wire breakage in bridge cable

  • Zhang, Pengfei;Tang, Zhifeng;Duan, Yuanfeng;Yun, Chung Bang;Lv, Fuzai
    • Smart Structures and Systems
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    • v.22 no.4
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    • pp.481-493
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    • 2018
  • Ultrasonic guided waves have attracted increasing attention for non-destructive testing (NDT) and structural health monitoring (SHM) of bridge cables. They offer advantages like single measurement, wide coverage of acoustical field, and long-range propagation capability. To design defect detection systems, it is essential to understand how guided waves propagate in cables and how to select the optimal excitation frequency and mode. However, certain cable characteristics such as multiple wires, anchorage, and polyethylene (PE) sheath increase the complexity in analyzing the guided wave propagation. In this study, guided wave modes for multi-wire bridge cables are identified by using a semi-analytical finite element (SAFE) technique to obtain relevant dispersion curves. Numerical results indicated that the number of guided wave modes increases, the length of the flat region with a low frequency of L(0,1) mode becomes shorter, and the cutoff frequency for high order longitudinal wave modes becomes lower, as the number of steel wires in a cable increases. These findings were used in design of transducers for defect detection and selection of the optimal wave mode and frequency for subsequent experiments. A magnetostrictive transducer system was used to excite and detect the guided waves. The applicability of the proposed approach for detecting and locating wire breakages was demonstrated for a cable with 37 wires. The present ultrasonic guided wave method has been found to be very responsive to the number of brokenwires and is thus capable of detecting defects with varying sizes.

A Study on Cutting Force during Multi Wire Sawing of Silicon Wafers for Solar Cells (태양전지용 실리콘 웨이퍼의 멀티 와이어 쏘잉 시 절삭저항력에 관한 연구)

  • Hwang, In-Hwan;Park, Sang-Hyun;An, Kuk-Jin;Kwun, Geon-Dae;Lee, Chan-Jong
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.15 no.3
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    • pp.66-71
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    • 2016
  • Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

Analysis of the Inner Degradation Pattern by Clustering Algorism at Distribution Line (군집화 알고리즘을 이용한 배전선로 내부 열화 패턴 분석)

  • Choi, Woon-Shik;Kim, Jin-Sa
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.1
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    • pp.58-61
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    • 2016
  • Degradation in power cables used in distribution lines to the material of the wire, manufacturing method, but also the line of the environment, generates a variety of degradation depending upon the type of load. The local wire deterioration weighted wire breakage accident can occur frequently, causing significant proprietary damage can lead to accidents and precious. In this study, the signal detected by the eddy current aim to develop algorithms capable of determining the signals for the top part and at least part of the signal by using a signal processing technique called K-means algorithm.

Design of the Supporting Structure of a Wire Saw for the Solar Cell Wafer (태양전지 웨이퍼용 Wire Saw안정화를 위한 지지구조 개선)

  • Yi, Il Hwan;Ro, Seung Hoon;Kim, Dong Wook;Park, In Kyu;Kil, Sa Geun;Kim, Young Jo
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.3
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    • pp.59-64
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    • 2018
  • In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.

Design Alterations of a Squaring & Grinding Machine for the Solar Cell Wafer to Suppress Vibrations (Solar Cell Wafer용 Squaring & Grinding Machine의 진동 억제를 위한 설계 변경)

  • Shin, Ho Beom;Ro, Seung Hoon;Yoon, Hyun Jin;Kil, Sa Geun;Kim, Young Jo;Kim, Geon Hyeong;Han, Dae Sung
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.3
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    • pp.47-52
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    • 2017
  • Solar cell industry requires high technologies to stabilize apparatuses for the wafer manufacturing. Vibrations of squaring & grinding machines are one of the most critical factors for causing residual stresses of ingots, which are the main reasons of the breakage in the following processes such as wire sawing, cleaning, and modularity. In this study, the structure of a squaring & grinding machine has been analyzed through experiments and computer simulations to figure out the ways to suppress the vibrations effectively, and further to minimize the breakage of wafers. The result shows that simple design changes of applying a few ribs can improve the stability of the machine.

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