• Journal of Korean Society of Water and Wastewater
• /
• v.10 no.3
• /
• pp.115-132
• /
• 1996

The present problems concerning the control of generation, storage, collection, transfer and transport, processing and disposal of the municipal waste are serious. And the transportation of the municipal waste is recently a important part of solid waste treatment and disposal. The waste pneumatic transportation system is expected to be an effective method for use in solving that problems. In this study, pneumatic transportation system was applied to 2,000-5,000 households of public/group housing for economic and technical analysis on the basis of data for working and operation. The proper equipment must be selected through economic and technical analysis for generation and properties of waste because the equipment in facilities of system is various. And the efficient operation method should be studied on the basis of information on the record of oeration. As the wet food waste clogs the pipeline, it is necessary to examine under the actual condition. The maximum unit waste generation rate based on the assumption that each household is comprised of 3.20 people is determined $2,340g/household{\cdot}day$, and it is included the 50% increase of seasonal and daily change.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.23 no.2
• /
• pp.159-165
• /
• 1999

Experimental studies have been performed to observe the basic phenomena of waste bed combustion in MSW incinerator. A reduced scale apparatus was utilized to simulate the combustion behavior in real plant with 1-dimensional transient behavior at the experimental setup, which uses wet cubic wood with ash content as simulated waste. LHV (lower heating value) of solid fuel, fuel particle size and flow rate of combustion air were taken as important parameters of the bed combustion. For the quantitative analysis, FPR (flame propagation rate), TBT (total burn-out time) and PBT (particle burn-out time) was defined. LHV represent the capability of heat release of the fuel, so that a higher LHV results in faster reaction rate of the fuel bed, which is shown by higher FPR. Fuel particle size is related with surface area per unit mass as well as heat and mass transfer coefficient. As the particle size increases the FPR decreases owing to decreasing specific surface area. Air injection supplies oxygen to the reaction zone. However oversupply of combustion air increases convection cooling of the bed and possibly extinguishes the flame.

• Journal of the Korean Society of Food Science and Nutrition
• /
• v.19 no.2
• /
• pp.121-126
• /
• 1990

Internal mass transfer during osmotic concentration of apples in sugar solutions was exami-ned as a function of concentration temperature and immersion time of those solutions using moisture loss sugar gain molality and rate parameter. Influence of osmotic concentration processes on browning reaction was also evaluated compared to control In creasin the concen-tration and temperature of sugar solutions increased moistrue loss sugar gain molality and rate parameter. Water loss was rapid early in the process and then levelled off, The same phenomena were occurred on sugar gain only in higher concentration(60$^{\circ}$ brix). IN lower concentration (30$^{\circ}$brix) sugar gain was gradually increased during whole process. Moisture loss during osmotic concentration using a sugar solution(60$^{\circ}$ brix 6$0^{\circ}C$) with 180min immer-sion time was 45.79% Effect of osmotic concentration befor air dried to 4% M.C(wet basis) on browning reaction was significant. Minimum browning reaction during air drying was carried out using a pretreatment such as osmotic concentration in sugar solution(60$^{\circ}$brix 45$^{\circ}C$) with 150min immersion time(O.D=0.01) compared to control(O.D=0.17)

• Laser Solutions
• /
• v.17 no.4
• /
• pp.20-23
• /
• 2014

In printed electronics, printing rolls are used to transfer electronic ink onto a flexible substrate. Generally printing rolls are patterned in microscale by the indirect laser method. Since based on the wet etch process, the indirect method is neither environment-friendly nor suitable for making a printing roll with patterns narrower than $20{\mu}m$. In this paper, we have directly engraved micro-patterns into a Zn-coated metal specimens using a picosecond laser in order both to engrave $10{\mu}m$-wide patterns and to improve the pattern profile. Experiments showed that it is possible to engrave $10{\mu}m$-wide patterns with an a rectangular-shaped profile which is necessary for the dimensionally accurate printing.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.04a
• /
• pp.57-64
• /
• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.1
• /
• pp.51-59
• /
• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.229.2-229.2
• /
• 2014

Graphene, an allotrope of carbon, is a two-dimensional material having a unique electro-mechanical property that shows significant change of the electrical conductance under the applied strain. In addition of the extraordinary mechanical strength [1], graphene becomes a prospective candidate for pressure sensor technology [2]. However, very few investigations have been carried out to demonstrate characteristics of graphene sensor as a device form. In this study, we demonstrate a pressure sensor using graphene double layer as an active channel to generate electrical signal as the response of the applied vertical pressure. For formation of the active channel in the pressure sensor, two single graphene layers which are grown on Cu foil (25 um thickness) by the plasma enhanced chemical vapor deposition (PECVD) are sequentially transformed to the poly-di-methyl-siloxane (PDMS) substrate. Dry and wet transfer methods are individually employed for formation of the double layer graphene. This sensor geometry results a switching characteristic which shows ~900% conductivity change in response to the application of pulsed pressure of 5 kPa whose on and off duration is 3 sec. Additionally, the functional reliability of the sensor confirms consistent behavior with a 200-cycle test.

• Journal of Biosystems Engineering
• /
• v.39 no.2
• /
• pp.96-100
• /
• 2014

Purpose: The objective of this study was to develop a classification index and the grade levels for a five-grade energy efficiency classification of agricultural dryers in Korea. Methods: The classification index and the grade levels were determined by using the performance test data published by the FACT over the last eight years to reflect a state of the art technology for agricultural dryers in Korea. The five grades were designed to have the classified dryers distributed normally over the grades with 15% for the $1^{st}$ grade, 20% for the $2^{nd}$ grade, 30% for the $3^{rd}$ grade, 20% for the $4^{th}$ grade and 15% for the $5^{th}$ grade. Results: The classification index was defined as the total amount of fuel and electrical energy consumed per 1% of the wet basis moisture content evaporated from a unit mass of grain or agricultural crops during the drying process: 1 MT of paddy rice for grain dryers and 1 kg of red pepper for agricultural crop dryers as the standard mass. Conclusions: The grade levels for the five-grade energy efficiency classification of grain dryers, kerosene dryers, and electric dryers were proposed in terms of the classification index value.

• Journal of the Korean Society of Clothing and Textiles
• /
• v.32 no.1
• /
• pp.157-165
• /
• 2008

Transient thermal response of five types of underwear(cotton jersey, wool jersey, nylon jersey, cotton mesh and polyester mesh) for a protective coverall is evaluated using a sweating thermal manikin. Experimental protocol for transient thermal response of the sweating thermal manikin was also proposed. As results, it was found that steady state thermal response from sweating thermal manikin was not sensitive enough to evaluate thermal comfort of the experimental garments. However, when half time is used as an index of the heat flux change in transient thermal response, difference was found among underwear materials. Half time of cotton was the shortest and heat transfer of cotton was the fastest followed by polyester mesh, cotton jersey, nylon jersey and wool jersey. Dynamic thermal response of wool underwear was quite different from that of cotton underwear. Wool shows quite less heat flow at the initial stage, however, moisture permeability of wool was higher than cotton at the later stage. It was difficult to distinguish surface temperature difference visually using thermogram taken right before the completion of dry and wet test in steady state thermal response.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2013.05a
• /
• pp.135-136
• /
• 2013

본 연구에서는 ripple 구조의 ZnO 박막을 역 구조 태양전지 내에서의 전자 수집층 으로 사용하였으며, $P3HT/IC_{60}BA$와 PEDOT을 각각 active layer와 정공 수집층 으로 사용하였다. zinc acetate의 농도 조절을 통해 다양한 두께와 roughness를 갖는 ripple 구조의 ZnO를 합성할 수 있었으며, hot plate위에서의 온도 조절을 통해 저온에서의 ZnO ripple를 합성할 수 있었다. 다른 농도를 사용해 합성한 ZnO ripple들 보다 0.6M의 zinc acetate를 사용하였을 때 가장 높은 power conversion efficiency (PCE) 와 external quantum efficiency (EQE)를 보여주었다. AFM과 SEM 분석을 통해 0.6M의 zinc acetate조건에서는 표면적이 가장 넓으면서도 다른 농도를 사용 하였을 때에 비해 상대적으로 ripple의 깊이가 더 깊은 표면을 갖는 ZnO가 생성됨을 알 수 있었다. 이는 상대적으로 넓은 surface area를 갖는 ZnO ripple과 active layer 계면사이에서 보다 용이한 charge transfer가 이루어 질수 있기 때문이다.