• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.42 no.3
• /
• pp.7-13
• /
• 2010

KOptimization and control of wet-end process provide a key solution to improve paper quality and production efficiency at the same time. Wet-end of paper machine is to determine three important influencing factors of papermaking i.e., retention, drainage and formation. Good formation of paper could be made at the cost of deteriorated retention or drainage. In the same manner increase of retention aid could cause the bad formation of paper. It is very important to find a proper retention chemical which may satisfy one of three factors without the sacrifice of other two. Laboratory scale analyzing or screening chemical additives of wet-end was reported in this study based on RDA sheet molding. Different from the conventional test method, simultaneous consideration of three important wet-end properties could be made by RDA and consequently more reliable prediction of actual paper machine wet-end could be expected.

• 제어로봇시스템학회:학술대회논문집
• /
• 2005.06a
• /
• pp.1309-1312
• /
• 2005

A multi-chemical supply system is developed and applied to a wet station, which uses the multi-chemical process in one bath. To control the concentration of two chemicals, control logic of a supply pump is programmed using the programable logic controller (PLC). By using the multi-chemical supply system, wet station with single bath is applied to cleaning process using multi chemicals such as buffed oxide etchant (BOE) and standard clean 1 (SC-1). The concentration of each chemical is measured in the bath to verify the multi-chemical supply system. The control range in the each chemical concentration is measured to 1.33weight% in NH4OH and 0.23weight% in H2O2. The multi-chemical supply system can be movable and usable as an independent module of fixed wet station. By simply midifying the PLC, a multi-chemical supply system can be developed for a wet station.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.667-667
• /
• 2013

Optimizing morphology of the front surface with three dimensional structures (3D) in solar cell is essential element for not only effectivelight harvesting but also carrier collection and separation without the cost burden in process. We designed a three-dimensionally ordered front surface with wet chemical etching. Wet chemical etching is a proper way to have three dimensional structures. The method efficiently transmits the incident light at the front surface to a Si absorber and has competitive price in manufacturing when comparing with reactive ion etching (RIE) to have three dimensional structures. This indicates that optimized front surface with three dimensional structures by wet chemical etching will bring effective light management in solar cells.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.683-686
• /
• 2009

We report inverted white OLEDs fabricated by full wet processes. We utilized inverted structure OLEDs since the structure was better for the realization of full wet fabrication of OLEDs. It was found that the performance of inverted OLEDs is comparable to that of conventional OLEDs. In this presentation, we will discuss in detail a few important issues on the full wet fabrication of OLEDs.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
• /
• 2006.04a
• /
• pp.307-311
• /
• 2006

Chemical analyses were conducted for Nakdong River water and riverbank filtrate in Daesan-Myeon area, Changwon City in 2005. Chemical components show different trends in wet season (June, July, August and September) and dry season (the other months). The patterns of chemical variation are classified into four types. Chemical components belonging Type I, as Na and $HCO_3$, show decrease in concentration during wet season and increase in concentration during dry season for both Nakdong River water and the riverbank filtrate. Chemical components belonging Type II, as Mg and $SO_4$, show decrease in concentration during wet season and increase in concentration during dry season for Nakdong River water while show the opposite trend for the riverbank filtrate. Chemical components belonging Type III, as Cl and $NO_3$, show increase in concentration from the start of wet season and high concentration during dry season for both Nakdong River water and the riverbank filtrate. Chemical components belonging Type IV, as Fe, show increase in concentration during wet season and decrease in concentration during dry season for both Nakdong River water and the riverbank filtrate.

• KSBB Journal
• /
• v.22 no.4
• /
• pp.244-248
• /
• 2007

The treatment of a model wastewater containing high concentration, 10 $g/{\ell}$, of phenol in an integrated wet oxidation-aerobic biological treatment was investigated. Partial wet oxidation under mild operating conditions was capable of converting the original phenol to biodegradable organic acids such as maleic acid, formic acid and acetic acid, the solution of which was subjected to the subsequent aerobic biological treatment. The wet oxidation was carried out at 150$^{\circ}C$ and 200$^{\circ}C$ and the initial pH of 1 to 12. The high temperature of 200$^{\circ}C$ and the acidic initial condition in the wet oxidation led to effluents of which biodegradability was higher in the subsequent biological oxidation process, as assessed by chemical oxygen demand (COD) removal. Homogeneous catalyst of $CuSO_4$ was also used for increasing the oxidation rate in the wet oxidation at 150$^{\circ}C$ and initial pH of 3.0. However, the pretreatment with the catalytic wet oxidation resulted in effluents which were less biodegradable in the aerobic biological process compared to those out of the non-catalytic wet oxidation at the same operating conditions.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1997.10a
• /
• pp.935-938
• /
• 1997

Recently, the minimum line width shows a tendency to decrease and the multi-level increase in semiconductor. Therefore, a planarization technique is needed and chemical mechanical polishing(CMP) is considered as one of the most suitable process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as micro-scratches, abrasive contaminations, and non-uniformity of polished wafer edges. Wet etching include of Spin-etching can improve he defects of CMP. It uses abrasive-free chemical solution instead of slurry. On this study, ILD(INterlayer-Dielectric) was removed by CMP and wet-etching methods in order to investigate the superiority of wet etching mechanism. In the thin film wafer, the results were evaluated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU). And pattern step height was also compared for planarization characteristics of the patterned wafer.

• Journal of Plant Biology
• /
• v.7 no.2
• /
• pp.1-8
• /
• 1964

Cha, Jong Whan (Dept. of Biology, Graduate School, Dong Kuk Univ.) The changes of chemical properties of forest soils in dry and wet seasons. Kor. Jour. Bot. VII(2): 1-8, 1964. Soil selected for the present investigation was collected from a mountain of the Forestry Experiment Station of the vicinity of Seoul. The forest communities studied were three forest and a unplanted soils. The soil samples were obtained from each forest type during dry and wet seasons. And these samples were collected from four horizons of all communities respectively. It was showed that exchangeable hydrogen was increased by rainfall, and total exchangeable base decreased in the same way. The content of nitrogen is washed away by rainfall, especially ammonium nitrogen was highly significant between dry and wet season. On the contrary, organic matter and available phosphorus were of no significant difference between dry and wet seasons. The values of pH appeared a different response in dry and wet seasons according to the plant communities. The needle-leaved forest soils showed more acidity than the broad-leaved forest soils, and the least acidity in open places. All nutrients in soil studied gradually decreased down the profiles. According to statistical analyses of the soil components among all soil horizons, total exchangeable bases in wet season indicated only significant at 1%. Exchangeable hydrogen and organic matter of the soil in dry season was particularly very low with increased depth in the profile. The fertility level of most forested soils selected for the present investigation is low according to chemical tests for available nutrient elements.

• Proceedings of the Polymer Society of Korea Conference
• /
• 2006.10a
• /
• pp.354-354
• /
• 2006

Alginic acid-silica hydrogel films was prepared for testing as protective coating materials for PTFE OD membranes. Unprotected hydrophobic membranes are subject to wet-out when contacted by surface-active agents. Films were characterised using SEM, XRD, DSC, mechanical strength measurements, and water-swelling measurements. In OD trials using coated membranes, no wet-out occurred over the 15 h duration of three consecutive 5 h OD trials using orange oil-water mixtures. In the case of detergent solutions, the coating afforded protection to the membrane for 4-5 h. In a separate trial, no wet-out occurred when the coated side of the membrane was placed in contact with 1.2 wt % orange oil for 72 hours.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.11a
• /
• pp.19-20
• /
• 2006

Two methods that can reduce reflectance in solar cells are surface texturing and anti-reflection coating. Wet chemical etching is a typical method that surface texturing of multi-crystalline silicon. Wet chemical etching methods are the acid texturization of saw damage on the surface of multi-crystalline silicon or double-step chemical etching after KOH saw damage removal too. These methods of surface texturing are realized by chemical etching in acid solutions HF-$HNO_3$-$H_2O$. In this solutions we can reduce reflectance spectra by simple process etching of multi-crystalline silicon surface. We have obtained reflectance of 27.19% m 400~1100nm from acidic chemical etching after KOH saw damage removal. This result is about 7% less than just saw damage removal substrate. The surface morphology observed by microscope and scanning electron microscopy (SEM).