• Journal of Welding and Joining
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• 제26권3호
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• pp.67-73
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• 2008

Fatigue life evaluation of welded structures in a range of high cycles is one of the most difficult problems since extremely small plastic deformation and damage occur during the loading cycles. Moreover, it is very difficult to identify the strong non-linearities of welding, inducing residual stress. In this paper, numerical fatigue test method for welded structures was developed using continuum damage mechanics with inherent strain. Recently, continuum damage mechanics, which can simulate both crack initiation at the micro-scale level and crack propagation at the meso-scale level, has been adopted in the fracture related problem. In order to consider the residual stresses in the welded strictures, damage calculation in conjunction with welding, inducing inherent strain, was proposed. The numerical results obtained from the damage calculation were compared to experimental results.

• 한국정밀공학회지
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• 제18권8호
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• pp.71-78
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• 2001

In GMA(Gas Metal Arc)Welding, the weld size that is a locally melted area of a workpiece is one of the most important considerations in determining the strength of a welded structure. Variations in the weld power and the welding heat flux may affect the weld pool formation and ultimately the size of the weld. Therefore, an accurate prediction of the weld size requires a precise analysis of the weld thermal cycle. In this study, a model which can estimate the weld bead geometry and a method for thermal analysis, including the model, are suggested. In order to analyze the weld bead geometry, a mathematical model was developed with transformed coordinates to apply to the horizontal fillet joints. A heat flow analysis was performed with a two dimensional finite element model that was adopted for computing the base metal melting zone. The reliability of the proposed model and the thermal analysis was evaluated through experiments, and the results showed that the proposed model was very effective for predicting the weld bead shape and good correspondence in melting zone of the base metal.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.151-155
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• 2002

In GMA(Gas Metal Arc)Welding, the weld size that is a locally melted area of a workpiece is one of the most important considerations in determining the strength of a welded structure. Variations in the weld power and the welding heat flux may affect the weld pool formation and ultimately the size of the weld. Therefore, an accurate prediction of the weld size requires a precise analysis of the weld thermal cycle. In this study, a model which can estimate the weld bead geometry and a method for thermal analysis, including the model, are suggested. In order to analyze the weld bead geometry, a mathematical model was developed with transformed coordinates to apply to the horizontal fillet joints. A heat flow analysis was performed with a two dimensional finite element model that was adopted for computing the base metal melting zone. The reliability of the proposed model and the thermal analysis was evaluated through experiments, and the results showed that the proposed model was very effective for predicting the weld bead shape and good correspondence in melting zone of the base metal.

• Journal of Welding and Joining
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• 제5권3호
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• pp.53-61
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• 1987

Post weld heat treatment(PWHT) is usually carried out to remove the residual stress and to improve the microstructure and mechanical properties of welded joints. By the way, welding structure transformed owing to PWHT and reheating for repair loads the random cycles fatigue as offshore welding structure of constant low cycle fatigue as pressure vessel, and then, pre-existing flaws or cracks exist in a structural component and those cracks grow under cyclic loading. Therefore, the effects of PWHT and stress ratio on fatigue crack growth behaviors were studied on the three regions such as HAZ, sub-critical HAZ and deposit metal of welded joints in SM53 steel. Fatigue crack growth behavior of as-weld depended on microstructure and fatigue crack growth rate of HAZ was the lowest at eac region, but after PWHT it was somewhat higher than that of as-wel. In case of applying the stress($10kg/mm^2$) during PWHT, fatigue crack growth resistance tended to increase in the overall range of .DELTA.K.

• Journal of Welding and Joining
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• 제14권2호
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• pp.46-56
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• 1996

HAZ impact toughness of Ti-oxide steel was investigated and compared to that of a conventional Ti-nitride steel. Toughness variations of each steel with weld peak temperatures and cooling rates were interpreted with microstructural transformation characteristics. In contrast to Ti-nitride steel showing continuous decrease in HAZ toughness with peak temperature, Ti-oxide steel showed increase in HAZ toughness above $1400^{\circ}C$ peak temperature. The HAZ microstructure of the Ti-oxide steel is characterized by the formation of intragranular ferrite plate, which was found to start from Ti-oxide particles dispersed in the matrix of the steel. Large austenite grain size above $1400^{\circ}C$ promoted intragranular ferrite plate formation in Ti-oxide steel while little intragranular ferrite plate was formed in Ti-nitride steel because of dissolution of Ti-nitrides. Ti-oxides in the Ti-oxide steel usually contain MnS and have crystal structures of TiO and/or $Ti_2O_3$.

• 한국안전학회지
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• 제21권5호
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• pp.17-21
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• 2006

In this study, SPCC cross-tension type specimens produced under various spot welding conditions were tensile and fatigue tested. Decrease of 2 kA in normal current condition of 10 kA caused a large amount of reduction in both static joining strength and fatigue life. And 2 kA increase resulted in increase of static joining strength and an increase in low cycle regime but a decrease in high cycle regime, revealing the fact that fatigue strength rather than static joining strength would be a major factor during design process in view of the body endurance. As a results of estimating the fatigue lifetimes of various types of spot weld specimens. equivalent stress intensity factor is the proper parameter for predicting the lifetimes of various types of specimens. which can be expressed as ${\Delta}K_{eq}(N/nm^{1.5})=11550N^{-0.36}_{f}$.

• Journal of Welding and Joining
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• 제17권3호
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• pp.90-95
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• 1999

The increase in high speed, multi-function and high I/O pin semiconductor devices highly demands high pin count, very thin, and high density packages. BGA is one of the solutions, but the package has demerits in package reliability, surface mounting problems due to the PCB warpage and solder joint crack related with TCE mismatch between the materials. On this study to verify the thermal fatigue lifetime of the solder joint FEM and experiments were performed after surface mounting BGA with different solder composition and reliability conditions. FEM showed optimum composition of Ag3.2-Sn96.5 and under the composition minimum creep deformation of the solder joint was calculated, and the thermal fatigue lifetime was improved. In view of temperature cycle condition, the conditions of $-65^{\circ}C$to $150^{\circ}C$ showed minimum lifetime and t was 1/3 of $0^{\circ}C$ to $125^{\circ}C$ condition. Test board was prepared and solder joint crack was verified. Until 1000cycle on soder joint crack was observed.

• Journal of Welding and Joining
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• 제16권4호
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.206-208
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• 2006

The reliability of BGA (ball grid array) package with OSP (organic surface preservative) surface finish under thermal cycle was investigated by using SEM (scanning electron microscopy), EDS(energy dispersive spectroscopy), image tool and ball shear test. The IMCs (intermetallic compounds) were increased with increasing number of thermal cycles. However, the shear strengths of solder ball were decreased with increasing number of thermal cycles. The order of solders which had the highest shear strength as follow: Sn-3.5wt%Ag-0.7wt%Cu, Sn-0.7wt%Cu, Sn-37wt%Pb.

• 전기학회논문지
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• 제60권11호
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• pp.2017-2020
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• 2011

Flicker, which is also known as voltage fluctuation, is an electromagnetic phenomenon generated by large scale nonlinear loads, such as arc furnaces and welding machines. Since a severe and continuous flicker can cause to some damages to electrically sensitive loads as well as human's visual irritations, it needs to be appropriately managed by being accurately measured, quantified and assessed. In Korea, an equivalent 10-Hz flicker index, shortly ${\Delta}V10$, is used to determine the permission limit of flicker. This paper presents an efficient calculation of the flicker index by using a half-cycle sliding window and a recursive method, showing a concrete calculating procedure of ${\Delta}V10$ from the viewpoint of signal processing.