• 제목/요약/키워드: various hygrothermal loading

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Three-dimensional and free-edge hygrothermal stresses in general long sandwich plates

  • Ahmadi, Isa
    • Structural Engineering and Mechanics
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    • 제65권3호
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    • pp.275-290
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    • 2018
  • The hygrothermal stresses in sandwich plate with composite faces due to through the thickness gradient temperature and (or) moisture content are investigated. The layer-wise theory is employed for formulation of the problem. The formulation is derived for sandwich plate with general layer stacking, subjected to uniform and non-uniform temperature and moisture content through the thickness of the plate. The governing equations are solved for free edge conditions and 3D stresses are investigated. The out of plane stresses are obtained by equilibrium equations of elasticity and by the constitutive law and the results for especial case are compared with the predictions of a 3D finite element solution in order to study the accuracy of results. The three-dimensional stresses especially the free edge effect on the distribution of the stresses is studied in various sandwich plates and the effect of uniform and non-uniform thermal and hygroscopic loading is investigated.

Fracture Analysis of Electronic IC Package in Reflow Soldering Process

  • Yang, Ji-Hyuck;Lee, Kang-Yong;Lee, Taek sung;Zhao, She-Xu
    • Journal of Mechanical Science and Technology
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    • 제18권3호
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    • pp.357-369
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    • 2004
  • The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

A refined vibrational analysis of the FGM porous type beams resting on the silica aerogel substrate

  • Mohammad Khorasani;Luca Lampani;Abdelouahed Tounsi
    • Steel and Composite Structures
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    • 제47권5호
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    • pp.633-644
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    • 2023
  • Taking a look at the previously published papers, it is revealed that there is a porosity index limitation (around 0.35) for the mechanical behavior analysis of the functionally graded porous (FGP) structures. Over mentioned magnitude of the porosity index, the elastic modulus falls below zero for some parts of the structure thickness. Therefore, the current paper is presented to analyze the vibrational behavior of the FGP Timoshenko beams (FGPTBs) using a novel refined formulation regardless of the porosity index magnitude. The silica aerogel foundation and various hydrothermal loadings are assumed as the source of external forces. To obtain the FGPTB's properties, the power law is hired, and employing Hamilton's principle in conjunction with Navier's solution method, the governing equations are extracted and solved. In the end, the impact of the various variables as different beam materials, elastic foundation parameters, and porosity index is captured and displayed. It is revealed that changing hygrothermal loading from non-linear toward uniform configuration results in non-dimensional frequency and stiffness pushing up. Also, Al - Al2O3 as the material composition of the beam and the porosity presence with the O pattern, provide more rigidity in comparison with using other materials and other types of porosity dispersion. The presented computational model in this paper hopes to help add more accuracy to the structures' analysis in high-tech industries.

Influences of hygrothermal environment and fiber orientation on shear correction factor in orthotropic composite beams

  • Soumia Benguediab;Fatima Zohra Kettaf;Mohammed Sehoul;Fouad Bourada;Abdelouahed Tounsi;Mohamed Benguediab
    • Coupled systems mechanics
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    • 제12권2호
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    • pp.151-165
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    • 2023
  • In this study, a simple method for the determination of the shear correction factor for composites beam with a rectangular cross section is presented. The plane stress elasticity assumption is used after simplifications of the expression of the stress distribution in the beam. The different fiber orientation angle and volume fraction are considered in this work. The studied structure is subjected to various loading type (thermal and hygrothermal). The numerical results obtained show that there is a dependence of the shear coefficient on the orientation of the fibers. The evolution of the shear correction factors depends not only on the orientation of the fibers and also on the volume fraction and the environment. the advantage of this developed formula of the shear correction factor is to obtain more precise results and to consider several parameters influencing this factor which are neglected if the latter is constant.

리플로 납땜 공정에서 플라스틱 IC 패키지의 습기 및 열로 인한 파손문제 해석 (Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process)

  • 이강용;이택성;이경섭
    • 대한기계학회논문집A
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    • 제20권4호
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    • pp.1347-1355
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    • 1996
  • The purpose of this paper is to evaluate the delamination and fracture integrity of the IC plastic package under hygrothermal loading by stress analysis and fracture mechanics approaches. The plastic SOJ package with a dimpled diepad under the reflow slodering process of IR heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal design values of variables to prevent the delamination and fracture of IC package are obtained. In this study, FDM program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.

On transient hygrothermal vibration of embedded viscoelastic flexoelectric/piezoelectric nanobeams under magnetic loading

  • Shariati, Ali;Ebrahimi, Farzad;Karimiasl, Mahsa;Vinyas, M.;Toghroli, Ali
    • Advances in nano research
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    • 제8권1호
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    • pp.49-58
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    • 2020
  • This paper investigates the vibration characteristics of flexoelectric nanobeams resting on viscoelastic foundation and subjected to magneto-electro-viscoelastic-hygro-thermal (MEVHT) loading. In this regard, the Nonlocal strain gradient elasticity theory (NSGET) is employed. The proposed formulation accommodates the nonlocal stress and strain gradient parameter along with the flexoelectric coefficient to accurately predict the frequencies. Further, with the aid of Hamilton's principle the governing differential equations are derived which are then solved through Galerkin-based approach. The variation of the natural frequency of MEVHT nanobeams under the influence of various parameters such as the nonlocal strain gradient parameter, different field loads, power-law exponent and slenderness ratio are also investigated.

Vibration characteristics of advanced nanoplates in humid-thermal environment incorporating surface elasticity effects via differential quadrature method

  • Ebrahimi, Farzad;Heidari, Ebrahim
    • Structural Engineering and Mechanics
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    • 제68권1호
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    • pp.131-157
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    • 2018
  • In this study, Eringen nonlocal elasticity theory in conjunction with surface elasticity theory is employed to study nonlinear free vibration behavior of FG nano-plate lying on elastic foundation, on the base of Reddy's plate theory. The material distribution is assumed as a power-law function and effective material properties are modeled using Mori-Tanaka homogenization scheme. Hamilton's principle is implemented to derive the governing equations which solved using DQ method. Finally, the effects of different factors on natural frequencies of the nano-plate under hygrothermal situation and various boundary conditions are studied.

Elastic buckling performance of FG porous plates embedded between CNTRC piezoelectric patches based on a novel quasi 3D-HSDT in hygrothermal environment

  • Yujie Zhang;Zhihang Guo;Yimin Gong;Jianzhong Shi;Mohamed Hechmi El Ouni;Farhan Alhosny
    • Advances in nano research
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    • 제15권2호
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    • pp.175-189
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    • 2023
  • The under-evaluation structure includes a functionally graded porous (FGP) core which is confined by two piezoelectric carbon nanotubes reinforced composite (CNTRC) layers. The whole structure rests on the Pasternak foundation. Using quasi-3D hyperbolic shear deformation theory, governing equations of a sandwich plate are driven. Moreover, face sheets are subjected to the electric field and the whole model is under thermal loading. The properties of all layers alter continuously along with thickness direction due to the CNTs and pores distributions. By conducting the current study, the results emerged in detail to assess the effects of different parameters on buckling of structure. As instance, it is revealed that highest and lowest critical buckling load and consequently stiffness, is due to the V-A and A-V CNTs dispersion type, respectively. Furthermore, it is revealed that by porosity coefficient enhancement, critical buckling load and consequently, stiffness reduces dramatically. Current paper results can be used in various high-tech industries as aerospace factories.