• Journal of the Korean Wood Science and Technology
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• v.35 no.5
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• pp.67-75
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• 2007

As a part of abating the formaldehyde emission of urea-formaldehyde (UF) resin adhesive by lowering formaldehyde to urea (F/U) mole ratio, this study was conducted to investigate properties of UF resin adhesive with different F/U mole ratios. UF resin adhesives were synthesized at different F/U mole ratios of 1.6, 1.4, 1.2, and 1.0. Properties of UF resin adhesives measured were non-volatile solids content, pH level, viscosity, water tolerance, specific gravity, gel time and free formaldehyde content. In addition, a linear relationship between non-volatile solids content and sucrose concentration measured by a refractometer was established for a faster determination of the non-volatile solids content of UF resin. As F/U mole ratio was lowered, non-volatile solids content, pH, specific gravity, water tolerance, and gel time increased while free formaldehyde content and viscosity were decreased. These results suggested that the amount of free formaldehyde strongly affected the reactivity of UF resin. Lowering F/U mole ratio of UF resin as a way of abating formaldehyde emission consequently requires improving its reactivity.

• Journal of the Korean Wood Science and Technology
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• v.26 no.4
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• pp.92-97
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• 1998

Four urea-formaldehyde (UF) resins were synthesized as a particleboard (PB) binder with the four different initial formaldehyde/urea mole ratio and the final mole ratio of 1.15. The UF resins were characterized according to the standard method of resin adhesive analysis. PBs were manufactured using liquid UF resins at 5 minutes press time and 6% resin solids levels on an ovendry particle weight basis. A total of 20 PBs was fabricated for 5 panel replication per UF resin types. The panels were tested for physical strength properties per the procedure ASTM D 1037. The formaldehyde emission levels from the PBs bonded with the UF resins were tested according to 2-hour desiccator test method ASTM D 5582. There were no significant differences among UF resin types for internal bond strength of PBs. But there were significant differences among UF resin types for formaldehyde emission level of PBs. The results showed that the formaldehyde emission level was influenced by the UF resin types without reducing the adhesive performance.

• Journal of the Korean Wood Science and Technology
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• v.36 no.2
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• pp.63-72
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• 2008

As a part of abating formaldehyde emission of urea-formaldehyde (UF) resin adhesive, this study was conducted to investigate chemical structures of UF resin adhesives with different formaldehyde/urea (F/U) mole ratios, using carbon-13 nuclear magnetic resonance ($^{13}C$-NMR) spectroscopy. UF resin adhesives were synthesized at four different F/U mole ratios such as 1.6, 1.4, 1.2, and 1.0 for the analysis. The analysis $^{13}C$-NMR spectroscopy showed that UF resin adhesives with higher F/U mole ratios (i.e., 1.6 and 1.4) had two distinctive peaks, indicating the presence of dimethylene ether linkages and methylene glycols, a dissolved form of free formaldehyde. But, these peaks were not detected at the UF resins with lower F/U mole ratios (i.e., 1.2 and 1.0). These chemical structures present at the UF resins with higher F/U mole ratios indicated that UF resin adhesive with higher F/U mole ratio had a greater contribution to the formaldehyde emission than that of lower F/U mole ratio. Uronic species were detected for all UF resins regardless of F/U mole ratios.

• Journal of Korean Society of Forest Science
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• v.60 no.1
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• pp.37-44
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• 1983

Thermoplastic aceton-formaldehyde resin adhesive was added as a modifier for urea-formaldehyde resin adhesive and its effects on plywood smear strength and wood failure were investigated. The results are summarized as follows: 1) The plywood shear strength and wood failure showed the highest values at $120^{\circ}C$ of hot plate temperature, but the values decreased according to the rise of addition ratio of aceton resin. 2) The variation of molar ratio of aceton resin had no effect on plywood shear strength and wood failure. 3) The plywood bonded by the addition of aceton resin showed lower values than those of urea resin bonding plywoods in shear strength and wood failure. Therefore, aceton resin was inadequate as a modifier of urea resin adhesive.

• Journal of the Korean Wood Science and Technology
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• v.33 no.2 s.130
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• pp.29-39
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• 2005

Formaldehyde emissions from wood-based panels bonded with pine and wattle tannin-based adhesives, urea-formaldehyde resin (UF), melamine-formaldehyde resin (MF), and co-polycondensed resin of urea-melamine-formaldehyde (UMF) were measured by the Japanese standard method using a desiccator (JIS A 1460) and the EN 120 (European Committee For Standardization, 1991) method using the perforator value. In formaldehyde emission, all particleboards made using the wattle tannin-based adhesive with three different hardeners, paraformaldehyde, hexamethylenetetramine, and tris(hydroxyl)nitromethan (TN), satisfied the requirements of grade $E_1$. But only those made using the pine tannin-based adhesive with the hexamine as hardener met the grade $E_1$ requirements. Hexamine was effective in reducing formaldehyde emission in tannin-based adhesives when used as the hardener. While the UF resin showed a desiccator value of $7.1mg/{\ell}$ and a perforator value of 12.1 mg/100 g, the MF resin exhibited a desiccator value of $0.6mg/{\ell}$ and a perforator value of 2.9 mg/100 g. According to the Japanese Industrial Standard and the European Standard, the formaldehyde emission level of the MDF panels made with UF resin in this study came under grade $E_2$. The formaldehyde emission level was dramatically reduced by the addition of MF resin. The desiccator and perforator methods produced proportionally equivalent results. Gas chromatography, a more sensitive and advanced method, was also used. The samples for gas chromatography were gathered during the experiment involving the perforator method. The formaldehyde contents measured by gas chromatography were directly proportional to the perforator values.

• Journal of the Korean Wood Science and Technology
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• v.8 no.2
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• pp.1-5
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• 1980

This study is carried out to determine the scavenging effect of resorcinol added into the urea formaldehyde resin on the formaldehyde release of plywood, as the preliminary study of using the phenolic substances. The method for formaldehyde determination used in this report is the improved chromotropic acid determination. The results are summarized as follows: 1. Resorcinol added into the urea formaldehyde adhesive acts as a good scavenger. 4 percent of resorcinol reduced the formaldehyde release to less than half content. 2. Adding resorcinol gave better glue shear strength than that of control, showing the peak of the shear strength, at 2 percent and decreased to the same strength as control along its content of 4 percent. 3. Moisture content of air dried plywood met the standard very well.

• Journal of the Korean Wood Science and Technology
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• v.26 no.4
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• pp.50-55
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• 1998

This study was carried out to develop low density board made of rice hull which needs proper use. Urea formaldehyde adhesive(UF) was used. The raw materials were the mixtures of the rice hulls from IllFum, DongGin, ChuChong, etc. The physical and mechanical properties of rice hull insulation board were examined. The results are as follows : For the thickness of 15mm of the low density rice hull board bonded with UF resin, proper manufacturing conditions were $171^{\circ}C$ of hot pressing temperature with thickness bar for optimum density, 12 percent of resin solid contents of rice hull ovendry weight, and 20 minutes of hot pressing time. These conditions meet Korean standards(KS 3201-1982) in relation to free formaldehyde emission, bending strength, water absorption and heat resistance.

• Journal of Korean Society of Forest Science
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• v.96 no.1
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• pp.54-57
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• 2007

Urea-formaldehyde (UF) resin was formulated similarly to plywood resin in the laboratory. The synthesized UF resin adhesive was mixed with extender, filler and acid catalyst. The mixture contained 56.1% total solids and 43.9% water. The mixes was used to bond five Com-Ply types using Korean wood species. The Com-Ply made were tested for shear strength and wood failure according to KS F 3101 ordinary plywood as well as for bending strength per KS F 3104 particleboard. The performance test results showed good strength properties for all Com-Ply types made in this study. This result represented that the UF resin adhesive mix was adequate for bonding Com-Ply with domestic wood species.

• Journal of the Korean Wood Science and Technology
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• v.51 no.1
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• pp.14-22
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• 2023

Economical use of larix (larch) boards (grade 3) in industries is lower than that of imported hardwood; thus, studies have been conducted toward performance improvement of larix boards. Herein, flexural modulus of larix board samples laminated with wood adhesives polyurethane resins, poly (vinyl acetate) resins, phenol-resorcinol-formaldehyde resins, melamine-formaldehyde resins, and urea-formaldehyde resins was compared with that of the samples bonded with adhesives reinforced with mesh-type basalt fibers. Moreover, the flexural moduli of the laminated samples bonded by mesh-type basalt fibers were compared with those of reinforced samples. The results showed that boards laminated with polyurethane and urea-formaldehyde resin adhesives had higher flexural modulus than those without the lamination. In particular, the increase in the flexural modulus was relatively significant for the 2- and 3-ply board structures laminated with polyurethane adhesives compared to those with reinforcement. The 3-ply board structure without reinforcement had the highest flexural modulus when the urea-formaldehyde resin adhesive was used.

• Journal of the Korean Wood Science and Technology
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• v.45 no.2
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• pp.223-231
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• 2017

This work was conducted to investigate on the effect of urea-formaldehyde (UF) resin viscosity on plywood adhesion. The viscosity of UF resin was controlled either by adjusting the condensation reaction during its synthesis to obtain different target viscosities (100, 200 and 300 mPa.s) at two levels of formaldehyde/urea (F/U) mole ratios (1.0 and 1.2) or by adding different amounts (10, 20 and 30%) of wheat flour into the resins for the manufacture of plywood. When the viscosity of UF resin increased by the condensation reaction, the adhesion strength of plywood bonded with UF resin of 1.2 F/U mole ratio consistently increased, while those bonded with the 1.0 F/U mole ratio resin slightly decreased, suggesting a difference in the adhesion in plywood. However, the adhesion strength of plywood decreased as the viscosity increased by adding wheat flour, regardless of F/U mole ratio. The manipulation of UF resin viscosity by adjusting the condensation reaction was much more efficient than by adding wheat flour in improving the adhesion performance of plywood. These results indicated that a way of controlling the viscosity of UF resin adhesives has a great influence to their adhesion in plywood.