• 제목/요약/키워드: uniform size

검색결과 1,480건 처리시간 0.028초

Surface Treatment Effect on Electrochemical characteristics of Al Alloy for ship

  • 이승준;김성종
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2017년도 춘계학술대회 논문집
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    • pp.149-149
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    • 2017
  • Aluminum alloys have poor corrosion resistance compared to the pure aluminum due to the additive elements. Thus, anodizing technology artificially generating thick oxide films are widely applied nowadays in order to improve corrosion resistance. Anodizing is one of the surface modification techniques, which is commercially applicable to a large surface at a low price. However, most studies up to now have focused on its commercialization with hardly any research on the assessment and improvement of the physical characteristics of the anodized films. Therefore, this study aims to select the optimum temperature of sulfuric electrolyte to perform excellent corrosion resistance in the harsh marine environment through electrochemical experiment in the seawater upon generating porous films by variating the temperatures of sulfuric electrolyte. To fabricate uniform porous film of 5083 aluminum alloy, we conducted electro-polishing under the 25 V at $5^{\circ}C$ condition for three minutes using mixed solution of ethanol (95 %) and perchloric (70 %) acid with volume ratio of 4:1. Afterward, the first step surface modification was performed using sulfuric acid as an electrolyte where the electrolyte concentration was maintained at 10 vol.% by using a jacketed beaker. For anode, 5083 aluminum alloy with thickness of 5 mm and size of $2cm{\times}2cm$ was used, while platinum electrode was used for cathode. The distance between the two was maintained at 3 cm. Anodic polarization test was performed at scan rate of 2 mV/s up to +3.0 V vs open circuit potential in natural seawater. Surface morphology was compared using 3D analysis microscope to observe the damage behavior. As a result, the case of surface modification showed a significantly lower corrosion current density than that without modification, indicating excellent corrosion resistance.

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부양가스증발응축법으로 제조된 Ti-Ni 합금 나노분말의 특성 연구 (A study on the Particulate Properties of Ti-Ni alloy Nanopowders Prepared by Levitational Gas Condensation Method)

  • 한병선;엄영랑;이민구;김길무;이창규
    • 한국분말재료학회지
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    • 제13권6호
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    • pp.396-400
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    • 2006
  • The Ti-Ni alloy nanopowders were synthesized by a levitational gas condensation (LGC) by using a micron powder feeding system and their particulate properties were investigated by x-ray diffraction (XRD), transmission electron microscopy (TEM) and Brunauer-Emmett-Teller (BET) method. The starting Ti and Ni micron powders $150{\mu}m$ were incorporated into the micron powder feeding system. An ingot type of the Ti-Ni ahoy was used as a seed material for the levitation and evaporation reactions. The collected powders were finally passivated by oxidation. The x-ray diffraction experiments have shown that the synthesized powders were completely alloyed with Ti and Ni and comprised of two different cubic and monoclinic crystalline phases. The TEM results showed that the produced powders were very fine and uniform with a spherical particle size of 18 to 32nm. The typical thickness of a passivated oxide layer on the particle surface was about 2 to 3 nm. The specific surface area of the Ti-Ni alloy nanopowders was $60m^2/g$ based on BET method.

반응 용기법을 이용한 InP/ZnS 양자점 합성과정에서 InP 코어의 성장기구 (Growth mechanism of InP and InP/ZnS synthesis using colloidal synthesis)

  • 서한욱;정다운;이빈;현승균;김범성
    • 한국분말재료학회지
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    • 제24권1호
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    • pp.6-10
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    • 2017
  • This study investigates the main growth mechanism of InP during InP/ZnS reaction of quantum dots (QDs). The size of the InP core, considering a synthesis time of 1-30 min, increased from the initial 2.56 nm to 3.97 nm. As a result of applying the proposed particle growth model, the migration mechanism, with time index 7, was found to be the main reaction. In addition, after the removal of unreacted In and P precursors from bath, further InP growth (of up to 4.19 nm (5%)), was observed when ZnS was added. The full width at half maximum (FWHM) of the synthesized InP/ZnS quantum dots was found to be relatively uniform, measuring about 59 nm. However, kinetic growth mechanism provides limited information for InP / ZnS core shell QDs, because the surface state of InP changes with reaction time. Further study is necessary, in order to clearly determine the kinetic growth mechanism of InP / ZnS core shell QDs.

Low-temperature Epitaxial Growth of a Uniform Polycrystalline Si Film with Large Grains on SiO2 Substrate by Al-assisted Crystal Growth

  • Ahn, Kyung Min;Kang, Seung Mo;Moon, Seon Hong;Kwon, HyukSang;Ahn, Byung Tae
    • Current Photovoltaic Research
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    • 제1권2호
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    • pp.103-108
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    • 2013
  • Epitaxial growth of a high-quality thin Si film is essential for the application to low-cost thin-film Si solar cells. A polycrystalline Si film was grown on a $SiO_2$ substrate at $450^{\circ}C$ by a Al-assisted crystal growth process. For the purpose, a thin Al layer was deposited on the $SiO_2$ substrate for Al-assisted crystal growth. However, the epitaxial growth of Si film resulted in a rough surface with humps. Then, we introduced a thin amorphous Si seed layer on the Al film to minimize the initial roughness of Si film. With the help of the Si seed layer, the surface of the epitaxial Si film was smooth and the crystallinity of the Si film was much improved. The grain size of the $1.5-{\mu}m$-thick Si film was as large as 1 mm. The Al content in the Si film was 3.7% and the hole concentration was estimated to be $3{\times}10^{17}/cm^3$, which was one order of magnitude higher than desirable value for Si base layer. The results suggest that Al-doped Si layer could be use as a seed layer for additional epitaxial growth of intrinsic or boron-doped Si layer because the Al-doped Si layer has large grains.

Adhesive bonding using thick polymer film of SU-8 photoresist for wafer level package

  • Na, Kyoung-Hwan;Kim, Ill-Hwan;Lee, Eun-Sung;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • 센서학회지
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    • 제16권5호
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    • pp.325-330
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    • 2007
  • For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

Sarcocystosis among Wild Captive and Zoo Animals in Malaysia

  • Latif, Baha;Vellayan, Subramaniam;Omar, Effat;Abdullah, Suliman;Desa, Noryatimah Mat
    • Parasites, Hosts and Diseases
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    • 제48권3호
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    • pp.213-217
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    • 2010
  • Sarcocystis sp. infection was investigated in 20 necropsied captive wild mammals and 20 birds in 2 petting zoos in Malaysia. The gross post-mortem lesions in mammals showed marbling of the liver with uniform congestion of the intestine, and for birds, there was atrophy of the sternal muscles with hemorrhage and edema of the lungs in 2 birds. Naked eye examination was used for detection of macroscopic sarcocysts, and muscle squash for microscopic type. Only microscopically visible cysts were detected in 8 animals and species identification was not possible. Histological examination of the sections of infected skeletal muscles showed more than 5 sarcocysts in each specimen. No leukocytic infiltration was seen in affected organs. The shape of the cysts was elongated or Circular, and the mean size reached $254{\times}24.5{\mu}m$ and the thickness of the wall up to $2.5{\mu}m$. Two stages were recognized in the cysts, the peripheral metrocytes and large numbers of crescent shaped merozoites. Out of 40 animals examined, 3 mammals and 5 birds were positive (20%). The infection rate was 15% and 25% in mammals and birds, respectively. Regarding the organs, the infection rate was 50% in the skeletal muscles followed by tongue and heart (37.5%), diaphragm (25%), and esophagus (12.5%). Further ultrastructural studies are required to identify the species of Sarcocystis that infect captive wild animals and their possible role in zoonosis.

Al-Si 합금의 양극산화거동 및 규소화합물 제어 (Anodizing Behavior and Silicides Control in Al-Si Alloy System)

  • 박종문;김주석;김재권;김수림;박노진;오명훈
    • 열처리공학회지
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    • 제31권1호
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    • pp.6-11
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    • 2018
  • The anodic oxidation behavior of Si-containing aluminum alloy for diecasting was investigated. Especially, the property changes during anodization both on aluminum 1050 and 9 weight percentage silicon containing aluminum (Al-9Si) alloys were analyzed by the static current test. In order to fabricate a uniform anodic oxidation film by effect of Al-Si compound, nitric acid containing hydrofluoric acid had been used as a desmutter for aluminum alloy after alkaline etching. It was found that the level of voltage of Al-9Si alloy during the static current test was almost as double as higher than aluminum 1050 through anodization. By adding hydrofluoric acid in the nitric acid electrolyte, the silicon compound on the surface was removed, and the optimum amount of added hydrofluoric acid could be derived. It was also observed that the size of silicon compound formed on the surface could be refined by heat treatment at $500^{\circ}C$ and followed water quenching.

Wall charge effects on structural properties of a coarse-grained FENE polyelectrolyte confined in slit nanochannels by Brownian dynamics simulation

  • Jeon, Jong-Gu;Chun, Myung-Suk
    • Korea-Australia Rheology Journal
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    • 제19권2호
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    • pp.51-59
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    • 2007
  • A polyelectrolyte chain confined in a slit nanochannel exhibits a structural transition from the one in free space. In this paper, the effect of the long-range electrostatic interactions between the xanthan polyelectrolyte and the slit wall on the confined xanthan conformation is investigated via the Brownian dynamics simulation. A neutral and two negatively charged surfaces of polydimethylsiloxane (PDMS) and glass are combined to make four kinds of slit channels with different charge characteristics: i) neutral-neutral, ii) glass-glass, iii) neutral-PDMS and iv) neutral-glass walls. Their walls are characterized by uniform surface charge densities determined from experimental data of zeta potential. Both the nonmonotonic chain size variation and the loss of long-range bond vector correlation, previously observed under confinement in the PDMS-PDMS slit, are also found in the neutral slit, demonstrating the nonelectrostatic origin of such crossover behaviors. As expected, the effect of wall charges is negligible at sufficiently high medium ionic strength of 100mM but it becomes significant in the opposite limit of 0.01mM. In the latter case, the high charge density of glass walls strengthens the effective confinement of a negatively charged polyelectrolyte and produces a xanthan structure comparable to that confined in a much narrower neutral slit. The obtained structural data suggest the possibility of controlling the structure of confined polyelectrolytes by the modification of surface charge characteristics of micro/nanofluidic devices in combination with the adjustment of the medium ionic strength.

구리 기판에 전착시킨 니켈과 니켈합금의 집합조직 형성 (Texture Formation of Eletroplated Nickel and Nickel Alloy on Cu Substrate)

  • 김재근;이선왕;김호진;홍계원;이희균
    • Progress in Superconductivity
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    • 제7권2호
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    • pp.145-151
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    • 2006
  • Nickel and nickel-tungsten alloy were electroplated on a cold rolled and heat treated copper(Cu) substrate. 4 mm-thick high purity commercial grade Cu was rolled to various thicknesses of 50, 70, 100 and 150 micron. High reduction ratio of 30% was applied down to 150 micron. Rolled texture was converted into cube texture via high temperature heat treatment at $400-800^{\circ}C$. Grain size of Cu was about 50 micron which is much smaller compared to >300 micron for the Cu prepared using smaller reduction pass of 5%. 1.5 km-long 150 micron Cu was fabricated with a rolling speed of 33 m/min and texture of Cu was uniform along length. Abnormal grain growth and non-cube texture appeared for the specimen anneal above $900^{\circ}C$. 1-10 micron thick Ni and Ni-W film was electroplated onto an annealed cube-textured Cu or directly on a cold rolled Cu. Both specimens were annealed and the degree of texture was measured. For electroplating of Ni on annealed Cu, Ni layer duplicated the cube-texture of Cu substrate and the FWHM of in plane XRD measurement for annealed Cu layer and electroplated layer was $9.9^{\circ}\;and\;13.4^{\irc}$, respectively. But the FWHM of in plane XRD measurement of the specimen which electroplated Ni directly on cold rolled Cu was $8.6^{\circ}$, which is better texture than that of nickel electroplated on annealed Cu and it might be caused by the suppression of secondary recrystallization and abnormal grain growth of Cu at high temperature above $900^{\circ}C$ by electroplated nickel.

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Ink setting and back trap mottle

  • 김병수;박종열
    • 한국펄프종이공학회:학술대회논문집
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    • 한국펄프종이공학회 2003년도 춘계학술발표논문집
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    • pp.70-79
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    • 2003
  • Paper coating can give smoothness surface and good printability to uncoated paper. Macro roughness of base paper would be decreasing its groove and grit in view of side. Nevertheless its improving effect for paper, some kind of problem is showing in the fine coated paper. Especially, back trap mottle is one of serious problems in printing with fine coated paper. Printers can not adjust conditions to overcome the problem. Also large amounts of paper can be rejected. There are many factors that influence back trap mottle. However it is not clear what the important parameters are in back trap mottle. Back trap mottle has some relationship with ink setting but good guidelines are not clear. Back trap mottle has been linked to non-uniform ink setting. We do not know how much variation in setting we can tolerate. Other mottle issues such as micro-picking and ink refusal are still common. This paper was prepared to identify correlation with ink setting and delta ink density obtained from experiment and then tried to find out some relationships with ink setting and back trap mottle. Basically fine calcium carbonate and ciay was used for main components and coarse calcium carbonate was mixed in two fine pigments to change its porosity and ink acceptance. Micro ink tack force at KRK printing tester was adapted to measure ink setting rate. KRK units were used for back trap mottle simulation and two printed samples were prepared to check delta ink density. Clay base coating has more fast ink setting time than calcium carbonate's though smoothness of clay was better than calcium carbonate. It could be explained by that clay has finer pore in its coating than calcium carbonate. DID(delta ink density) has shown a good correlation with ink setting time from micro ink tack. The total pore volume of coating layer did not match with ink setting and DID. From the results we might conclude coating that has fine pore size around 0.05 ${\mu}m$ can be exposed to high possibility of back trap mottle.

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