• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2005년도 춘계학술대회논문집
• /
• pp.264-268
• /
• 2005

In the semiconductor and optical industry the non-contact transportation is required for reducing the damages. The ultrasonic levitation is the solution of the problem. In this paper, the ultrasonic levitation system and 3 disk-type stator for levitating various object are proposed. The vibration modes of disks are analyzed with FEM and designed with the analysis results. The 3D vibration profiles of the disks are measured by Laser scanning vibrometer for verifying the vibration characteristics of the system and the amplitudes of the disks and the levitation heights of object are measured for evaluating the performance.

• Tribology and Lubricants
• /
• 제34권4호
• /
• pp.132-137
• /
• 2018

Ultrasonic waves are used in various applications in multiple devices, sensors, and high-power machinery, such as processing machines, welders, and cleaners, because the acoustic vibration frequencies are above the human audible frequency range. In ultrasonic machining, electrical energy at a high frequency of 20 kHz or more is converted into mechanical vibration by a vibrator and an amplifier. This technique allows instantaneous separation between a tool and a workpiece during machining, machining by pulse impulse force at the time of re-contact and minimizes the minute elastic deformations of the workpiece and machine tools due to the cutting effect. The Al7075 alloy used in this study is a typical aluminum alloy with superior strength that is mainly used in aircrafts, automobiles, and sporting goods. To investigate the optimal conditions for machining aluminum alloy using ultrasonic vibration, the present experiment utilized the Taguchi orthogonal array method, and the coefficient of friction was analyzed using the characteristics of the Taguchi technique. In ultrasonic friction and abrasion tests, the changes in the friction coefficient were measured in the absence of ultrasonic vibrations and at 28 kHz and 40 kHz. As a result, the most considerable influence on the friction coefficient was found to be the normal load, and the frequency of ultrasonic vibrations increases, the coefficient of friction increases. It was thus confirmed that the amount of wear increases when ultrasonic vibration is applied.

• 소성∙가공
• /
• 제19권6호
• /
• pp.363-371
• /
• 2010

In ultrasonic vibration drawing, the drawing forces can be reduced by applying ultrasonically oscillating dies. Ultrasonic vibration drawing has been considered as a means of accommodating high-level drawing processes such as shaped wire, ultrafine wire, and the wire drawing operation in semidry or dry condition. Prior studies were attempted to analyze the mechanism of improved drawing performances, such as reduced drawing force and improved lubrication characteristic. However, researches on design rule for ultrasonic vibration drawing system are not yet carried out. The principal objectives of this work are to design a set of tooling capable to superimpose the oscillations and to observe by experiments the influence of the ultrasonic oscillations on the wire drawing.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 춘계학술대회 논문집
• /
• pp.1527-1530
• /
• 2005

In the semiconductor and optical industry the non-contact transportation is required for reducing the damages. The ultrasonic levitation is the solution of the problem. In this paper, the ultrasonic levitation system and 3 disk-type stator for levitation various object are proposed. The vibration modes of disks are analyzed with FEM and designed with the analysis results. The 3D vibration profiles of the disks are measured by Laser scanning vibrometer for verifying the vibration characteristics of the system. The amplitudes of the disks and the levitation heights of object are measured for evaluating the performance.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2003년도 춘계학술대회 논문집
• /
• pp.1853-1856
• /
• 2003

Multi-layer printed circuit board(PCB) is being used widely for the product with relatively complex circuits such as TV, VTR and FAX. With the rapid enlargement of electronic and IT industry, the hole machining technology on multi-layer PCB is increasingly required to improve. Thus, the micro drilling with ultrasonic vibration can be a good method for hole machining. Unlike conventional drilling, ultrasonic vibration applied drilling introduces less wear and fracture of not only tool but also internal surface of workpiece due to little cutting resistance, thus, machinability can be improved. The experiment is conducted through the comparison between the results of conventional drilling and ultrasonic micro drilling as well as among each results by the variation according to not only feed rate of drill but also amplitude and frequency of ultrasonic vibration. The multi-layer PCB consists of 6 layers and ${\Phi}$0.3 diameter drill was used. As a result, it was found that the state of internal surfaces of holes on multiple layer PCBs is improved by the application of ultrasonic vibration.

• 한국정밀공학회지
• /
• 제28권3호
• /
• pp.363-369
• /
• 2011

In this study, a direct pattern forming process on a plastic film using ultrasonic vibration energy is investigated. A tool horn containing micro-patterns is attached to an ultrasonic power supply, and is used to press a plastic film with ultrasonic vibration in order to replicate micro-patterns on the surface of the plastic film. To replicate micro-patterns with high accuracy, the tool horn should be designed to allow only the longitudinal vibration, not the transverse vibration. For this purpose, the design of a tool horn is investigated through finite element analysis, from which the resulting natural frequency of the tool horn can be adjusted in the range of the ultrasonic power supply. The analysis result is then reflected on the optimal design and fabrication of the tool horn. The validity of the developed tool horn is discussed through pattern-forming experiments using the ultrasonic vibration of the developed tool horn.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2005년도 추계학술대회논문집
• /
• pp.959-962
• /
• 2005

In the semiconductor and optical industry. a new transport system which can replace the conventional transport system is required. The Transport systems are driven by the magnetic field and conveyer belts. The magnetic field may damage semiconductor and the contact force may scratch the optical lens. The ultrasonic wave driven system can solve these problems. In this semiconductor and optical industry, the non-contact system is required for reducing the damages. The ultrasonic transportation is the solution of the problem. In this paper, the ultrasonic levitation system for levitation object are proposed. The 3D vibration profiles of the beam are measured by Laser Scanning Vibrometer for verifying the vibration characteristics of the system and the amplitudes of the beam and the levitation heights of object are measured fore evaluating the performance.

• 한국공작기계학회논문집
• /
• 제17권6호
• /
• pp.63-70
• /
• 2008

Conical horn is used in many high frequency ultrasonic horns, to achieve a longitudinal vibration mode across a wide ultrasonic tool horn output surface. Modal analysis is method for designing tuned ultrasonic tool horn and for the prediction natural frequency of ultrasonic tool horn vibration mode. The design of ultrasonic horn is based on prototype estimate obtained by FEM analysis. The FEM simulated ultrasonic tool horn is built and characterized experimentally through laser vibrometer and electrical impedance analysis. In this paper, FEM analysis is developed to predict the natural frequency of ultrasonic tool horn and use of in the optimal design of ultrasonic horn shape.

• 에너지공학
• /
• 제13권4호
• /
• pp.275-280
• /
• 2004

관내부로 흐르는 물에 초음파 진동을 가진 하였을 때 관내 열전달이 증진되는 효과를 실험 및 수치해석을 통해 연구하였다 원형관 벽면에서 관내부로 흐르는 물로의 대류 열 전달계수를 초음파 진동이 있을 때 와 없을 때에 측정하였다. 이 결과를 비교함으로써 초음파진동이 전열성능 향상에 미치는 영향을 정량화 하였다. 이러한 현상에 영향을 줄 수 있는 유량과 온도의 범위를 넓히기 위하여 수치해석을 수행하였다. FLUENT 6.1을 이용하여 관내의 유동장과 온도분포를 해석하고 초음파 진동 유무 시 대류 열 전달계수를 평가하였다 연구결과 초음파진동이 강제대류 조건에서 전열성능을 향상시키며 그 영향은 관내를 흐르는 물의 유량에 따라 크게 변한다는 것을 보여주고 있다.

• 한국정밀공학회지
• /
• 제30권11호
• /
• pp.1121-1128
• /
• 2013

Ultrasonic grinding system is that the ultrasonic vibration by ultrasonic actuator is applied on conventional grinding system during grinding process. The Ultrasonic vibration with a frequency of over 20kHz can reduce grinding forces and increase surface quality, material removal rate (MRR) and grinding wheel life. In addition, ultrasonic vibration assisted grinding can be used for the materials that are difficult to cut. In this paper, methodology for ultrasonic tools is studied based on finite element method, and in turn the ultrasonic tools are designed and fabricated. It is found that the ultrasonic tool can vibrate with a frequency of 20kHz and amplitude of $25{\mu}m$. In order to verify the machining performance, the grinding experiment is performed on titanium alloy. By applying ultrasonic vibration, the grinding force and temperature are reduced and MRR is increased compared with the conventional grinding.