• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.10
• /
• pp.865-871
• /
• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• 제어로봇시스템학회:학술대회논문집
• /
• 1996.10b
• /
• pp.1352-1355
• /
• 1996

The control of diamond turning is usually achieved through a laser-interferometer feedback of slide position. If the tool post is rigid and the material removal process is relatively static, then such a non-collocated position feedback control scheme may surface. However, as the accuracy requirement gets tighter and desired surface contours become more complex, the need for a direct tool-tip sensing becomes inevitable. The physical constraints of the machining process prohibit any reasonable implementation of a tool-tip motion measurement. It is proposed that the measured force normal to the face of the workpiece can be filtered through an appropriate admittance transfer function to result in the estimated depth of cut. This can be compared to the desired depth of cut to generate the adjustment control action in addition to position feedback control. In this work, the design methodology on the admittance model-based control with a conventional controller is presented. The recursive least-squares algorithm with forgetting factor is proposed to identify the parameters and update the cutting process in real time. The normal cutting forces are measured to identify the cutting dynamics in the real diamond turning process using the precision dynamometer. Based on the parameter estimation of cutting dynamics and the admittance model-based nanodynamic control scheme, simulation results are shown.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.14 no.6
• /
• pp.1495-1508
• /
• 1990

There are requirement of surface roughness in mechanical elements that has minute surface of several nm degree. When high precision surface roughness measurement is made with stylus type surface roughness measuring apparatus, measuring accuracy depend on the tip radius of diamond stylus. Therefore, ultra precision machining was accomplished using ion sputter machining in order to machining the stylus tip radius less than 0.5.mu.m, which is impossible through lapping machining. In this study, optimal machining condition for the ion sputter machining was obtained through the experiment under the various varing machinbing quantity and condition of diamond stylus. And as the result of applying this optimal condition, the good result was obtained that machining probability of stylus tip radius less than o.5.mu.m is 93%.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.86-89
• /
• 2003

Chemical Mechanical Planarization(CMP) has been accepted as the most effective processes for ultra large scale integrated (ULSI) chip manufacturing. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. And pad surface is ununiformly deformed as real contact distance. These defects make material removal rate(MRR) decrease with a number of polishied wafer. Also the desired within-chip planarity, within wafer non-uniformity(WIWNU) and wafer to wafer non-uniformity(WTWNU) arc unable to be achieved. So, pad conditioning in CMP Process is essential to overcome these defects. The eletroplated or brazed diamond conditioner is used as the conventional conditioning. And. allumina long fiber, the jet power of high pressure deionized water, vacuum compression. ultrasonic conditioner aided by cavitation effect and ceramic plate conditioner are once used or under investigation. But. these methods arc not sufficient for ununiformly deformed pad surface and the limits of conditioning effect. So this paper focuses on the characteristics of diamond conditioner which reopens glazed pores and removes ununiformly deformed pad away.

• Journal of the Korean Society for Precision Engineering
• /
• v.30 no.9
• /
• pp.931-942
• /
• 2013

In this study, we analyzed and compared the ultrasonic welding with the laser welding for the pure aluminium thin plates in a series of secondary lithium-ion batteries which are currently being produced by the ultrasonic welding; and performed the experiment for the purpose of the preceding study to replace the ultrasonic welding method with the laser welding method. As a result, the weld width of ultrasonic welding was 5mm, but that of laser welding was about 1~1.5 mm. As a result of tension test, the tensile strength was high when the pulse duration hour was short at the low peak power, while the high tensile strength was achieved when the pulse duration hour was long at the high peak power. The value of tensile strength was higher in the ultrasonic welding while the laser welding showed a maximum 45% better result as for the welding width.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.12
• /
• pp.1107-1113
• /
• 2014

In this article, the megasonic cleaning system for cleaning micro/nano particles from flat panel display (FPD) surfaces was developed. A piezoelectric actuator and a waveguide were designed by finite element method (FEM) analysis. The calculated peak frequency value of the quartz waveguide was 1002 kHz, which agreed well with the measured value of 1003 kHz. The average acoustic pressure of the megasonic cleaning system was 43.1 kPa, which is three times greater than that of the conventional type of 13.9 kPa. Particle removal efficiency (PRE) tests were performed, and the cleaning efficiency of the developed system was proven to be 99%. The power consumption of the developed system was 64% lower than that of the commercial system. These results show that the developed megasonic cleaning system can be an effective solution in particle removing from FPD substrate with higher energy efficiency and lower chemical and ultra pure water (UPW) consumption.

• Journal of the Korean Society for Precision Engineering
• /
• v.34 no.1
• /
• pp.53-58
• /
• 2017

A fine stage is developed for the 3-DOF error compensation of a linear axis in order to improve the positioning accuracy. This stage is designed as a planar parallel mechanism, and the joints are based on a flexure hinge to achieve ultra-precise positioning. Also, the effect of Abbe's offsets between the measuring and driving coordinate systems is minimized to ensure an exact error compensation. The mode shapes of the designed stage are analyzed to verify the desired 3-DOF motions, and the workspace and displacement of a piezoelectric actuator (PZT) for compensation are analyzed using forward and inverse kinematics. The 3-DOF error of a linear axis is measured and compensated by using the developed fine stage. A marked improvement is observed compared to the results obtained without error compensation. The peak-to-valley (PV) values of the positional and rotational errors are reduced by 92.6% and 91.3%, respectively.

• Journal of the Korean Society for Precision Engineering
• /
• v.23 no.9 s.186
• /
• pp.61-67
• /
• 2006

Sandwich structures, which are composed of a thick core between two faces, are commonly used in many engineering applications because they combine high stiffness and strength with low weight. Accordingly, the usage of sandwich structure is very widely applied to the aircraft, the automobile and marine industry, etc., because of these advantages. In this paper, we have investigated the buckling protection of an inner structure plate and the useful corrugated configuration for contact, and the fabrication method of the inner structure plate for large area using the continuous molding process. Also, we have guaranteed the accuracy of the molding process through the micro corrugated mold fabrication and secured the accuracy and analyzed aspect properties of the inner structure plate fabricated for a large area using the partial mold process. We have compared molding simulation according to the aspect thickness of the corrugated configuration with the molding experiment results.

• Journal of the Korean Society for Precision Engineering
• /
• v.34 no.2
• /
• pp.89-94
• /
• 2017

Micro-screws can be defined by their outer diameter of generally less than 1 mm. They are manufactured by head forging and thread rolling processes. In this study, the thread rolling process was numerically analyzed for a micro-screw with a diameter and pitch of 0.8 and 0.2 mm, respectively. Through finite element (FE) analysis, the effects of two design parameters (die gap and chamfer height) on the dimensional accuracy were investigated. Three combinations of chamfer heights were chosen first and the corresponding die gap candidates selected by geometric calculation. FE analyses were performed for each combination and their results indicated that the concave chamfer height should be less than 0.3 mm, while a 10 ?m difference in the die gap might cause degeneration in dimensional accuracy. These results conclude that ultra-high accuracy is required in die fabrication and assemblies to ensure dimensional accuracy in micro-screw manufacturing.

• Journal of the Korean Society for Precision Engineering
• /
• v.13 no.6
• /
• pp.59-65
• /
• 1996

There are many difficulties in automatic polishing for die & mold surfaces. Even though the process has been studied in the past 15 years, it has not been achieved yet, but by the process of actual hand work of well-skilled workers. A new magentic assisted polishing process, which is one of the potential methods for automation of surface finishing has been studied in the past 10 years by colleagues. The process has many merits, but on the other hand also has demerits, one being low efficiency of grindability by comparision with wheel polish. Therefore, some attempts were tried to improve the grindability by adopting electropolishing, ultra-high speed milling, 5-axis controlled machine etc... most recently by colleagues. This paper also aims to improve the efficiency of polishing by introducing the easily-polished shape surface cutting method equalizing the tool feed per revolution to the pick feed. This cutting method was experimentally confirmed to have sufficient grindability to polish milled surface (with $10{{\mu}m}$Rmax surface roughness) into mirror surface (with $0.4{{\mu}m}$Rmax surface roughness).