• Journal of the Korean Vacuum Society
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• v.8 no.4A
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• pp.391-396
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• 1999

KSTAR vacuum vessel mockup was fabricated by Korea Heavy Industries. The fabrication technology chosen for the mockup is introduced and assessed in this paper. KSTAR vacuum vessel is a huge vacuum chamber of 52 cubic meters never built in this country. Through the experiency of the KSTAR mockup fabrication, welding methods for obtaining both ultra high vacuum and structural integrity of the large vacuum chamber are extracted. The fabrication and assembly techniques for the complicated structure composed of reinforced ribs, double walls and various ports are also developed. A nondestructive test on the welding spot was performed and the results show that no major leaks violating the criterion were found. The one of the main objectives of the mockup fabrication is to measure the dimensions of the structure before and after fabrication, which plays an important role in the fabrication and the assembly. By assaying the problems occurred during mockup fabrication, the KSTAR mockup will provide the techniques for the fabrication of the main vacuum vessel.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2001.05a
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• pp.349-352
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• 2001

In this paper, novel device structure in order to realize ultra fast and ultra small silicon devices are investigated using ultra-high vacuum chemical vapor deposition(UHVCVD) and Excimer Laser Annealing (ELA) for ultra pn junction formation. Based on these fundamental technologies for the deep sub-micron device, high speed and low power devices can be fabricated. These junction formation technologies based on damage-free process for replacing of low energy ion implantation involve solid phase diffusion and vapor phase diffusion. As a result, ultra shallow junction depths by ELA are analyzed to 10~20 nm for arsenic dosage (2$\times$10$^{14}$ $\textrm{cm}^2$), excimer laser source(λ=248nm) is KrF, and sheet resistances are measured to 1k$\Omega$/$\square$ at junction depth of 15nm.

• Journal of the Korean Vacuum Society
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• v.10 no.1
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• pp.9-15
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• 2001

The total pressure and partial pressure of small cavity for flat panel display have been successfully measured by using an ultra-high vacuum chamber with mass spectrometer. The total pressure in the panel was in the range of $10^{-6}$ Torr and the major partial pressure affecting increase in total pressure were those of Ar, $CH_4$and He. The baking temperature during evacuation process was very important for high-vacuum package, the total pressure and partial pressure of $CH_4$ were decreased as the increase of baking temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.311-311
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• 2013

The resistance switching memory devices have several advantages to take breakthrough for the limitation of operation speed, retention, and device scale. Especially, the metal-oxide materials such as ZnO are able to fabricate on the flexible and visible transparent plastic substrate. Also, the quantum dots (QDs) embedded in dielectric layer could be improve the ratio between the low and the high resistance becauseof their Coulomb blockade, carrier trap and induced filament path formation. In this study, we irradiated 0.2-MeV-electron beam on the ZnO/QDs/ZnO structure to control the defect and oxygen vacancy of ZnO layer. The metal-oxide QDs embedded in ZnO layer on Pt/glass substrate were fabricated for a memory device and evaluated electrical properties after 0.2-MeV-electron beam irradiations. To formation bottom electrode, the Pt layer (200 nm) was deposited on the glass substrate by direct current sputter. The ZnO layer (100 nm) was deposited by ultra-high vacuum radio frequency sputter at base pressure $1{\times}10^{-10}$ Torr. And then, the metal-oxide QDs on the ZnO layer were created by thermal annealing. Finally, the ZnO layer (100 nm) also was deposited by ultra-high vacuum sputter. Before the formation top electrode, 0.2 MeV liner accelerated electron beams with flux of $1{\times}10^{13}$ and $10^{14}$ electrons/$cm^2$ were irradiated. We will discuss the electrical properties and the physical relationships among the irradiation condition, the dislocation density and mechanism of resistive switching in the hybrid memory device.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.326-328
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• 1995

SiC buffer layers were grown on Si(100) substrates by ultra-high-vacuum electron cryclotron resonance plasma (UHV ECR plasma) from $CH_4/H_2$ mixture at 700$^{\circ}C$. The electron densities and temperature were measured by single probe. The axial plasma potentials measured by emissive probe had the double layer structure at positive substrate bias. Piranha cleaning was carried out as ex-situ wet cleaning. Clean and smooth silicon surface were prepared by in-situ hydrogen plasma cleaning at 540$^{\circ}C$. A short exposure to hydrogen plasma transforms the Si surface from 1$\times$1 to 2$\times$1 reconstruction. It was monitored by reflection high energy electron diffraction (RHEED). The defect densities were analysed by the dilute Schimmel etching. The results showed that the substrate bias is important factor in hydrogen plasma cleaning. The low base pressure ($5\times10^{-10}$ torr) restrains the $SiO_2$ growth on silicon surface. The grown layers showed different characteristics at various substrate bias. RHEED and K-ray Photoelectron spectroscopy study showed that grown layer was SiC.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.228.2-228.2
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• 2014

Characteristics of high Fermi velocity, high mechanical strength, and transparency offer tremendous advantages for using graphene as a promising transparent conducting material [1] in electronic devices. Although graphene is a prospective candidate for touch sensor with strong mechanical properties [2] and flexibility, only few investigations have been carried out in the field of sensor as a device form. In this study, we suggest ultra-highly sensitive and transparent graphene touch sensor fabricated by single layer graphenes. One of the graphene layers is formed in the top panel as a disconnected graphene beam transferred on PDMS, and the other of the graphene layer is formed with line-patterning on the bottom panel of triple structure PET/PI/SiO2. The touch sensor shows characteristics of flexible. Its transmittance is approximately 75% where transmittance of the top panel and the bottom panel are 86.3% and 87%, respectively, at 550 nm wavelength. Sheet resistance of each graphene layer is estimated as low as $971{\Omega}/sq$. The results show that the conductance change rate (${\Delta}C/C0$) is $8{\times}105$ which depicts ultra-high sensitivity. Moreover, reliability characteristic confirms consistent behavior up to a 100-cycle test.

• Proceedings of the Korean Vacuum Society Conference
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• 2008.02a
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• pp.100-100
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• 2008

• Journal of the Korean Vacuum Society
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• v.18 no.1
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• pp.60-65
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• 2009

We performed a study on optical properties of $BaSm_2Ti_4O_{12}$ thin films by vacuum ultra violet spectroscopic ellipsometry in the $0.92{\sim}8.6\;eV$ energy range. For the analysis of the measured ellipsometric spectra, a 5-layer model was applied where optical property of the $BaSm_2Ti_4O_{12}$ layer was well represented by a Tauc-Lorentz dispersion function. Our analysis clearly showed new structure in high energy region at about 7.5 eV Consistent changes of refractive index & extinction coefficient of the $BaSm_2Ti_4O_{12}$ thin film by the growth and annealing temperatures were also confirmed.

• Macromolecular Research
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• v.12 no.1
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• pp.112-118
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• 2004

With the goal of enhancing the creep resistance of ultra-high molecular weight polyethylene (UHMWPE), we performed gamma irradiation and post-irradiation annealing at a low temperature, and investigated the crystalline structures and mechanical properties of the samples. Electron spin resonance spectra reveal that most of the residual radicals are stabilized by annealing at 100$^{\circ}C$ for 72 h under vacuum. Both the melting temperature and crystallinity increase after increasing the dose and by post-irradiation annealing. When irradiated with the same dose, the quenched sample having a higher amorphous fraction exhibits a lower swell ratio than does the slow-cooled sample. The measured tensile properties correlate well to the crystalline structure of the irradiated and annealed samples. For enhancing creep resistance, high crystallinity appears to be more critical than a high degree of crosslinking.

• Journal of the Korean Vacuum Society
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• v.8 no.4A
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• pp.397-402
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• 1999

The base pressure of the vacuum vessel of KSTAR tokamak is to be ultra high vacuum, $10^{-6}\sim10^{-7}Pa$, to produce a clean plasma with low impurity concentrations. For this purpose, vessel and plasma facing components need to be baked up to $250^{\circ}C$, $350^{\circ}C$ respectively to remove impurities from the plasma-material interaction surfaces. Here the required heating power to be supplied for baking has been calculated according to pre-assumed different temperature profiles (baking scenario and proper baking plan for KSTAR tokamak has been proposed. Mass flow rate and temperature of nitrogen gas for baking has also been calculated.