• Title/Summary/Keyword: type of defects

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Complications after Senning Operation for TGA with and Wothout VSD (대혈관전위증에서 Senning수술후 합병증에 관한 임상적 고찰)

  • 안재호
    • Journal of Chest Surgery
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    • v.26 no.8
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    • pp.595-603
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    • 1993
  • We analysed 60 consecutive patients who got Senning operation for transposition of the great arteries [TGA] with or without ventricular septal defects [VSD]. There were 41 simple TGA [group I] and 19 TGA with VSD [Group II], the operative mortality was 20 % [in group I 4.9 %, group II 52.6 %]. Among the survivors [n=48], the mean follow-up period was 7 years [range, 1 year to 13.5 years] and the actuarial survival rate at 13 years were 95 % in group I and 42 % in group II. Preoperative high left ventricular pressure and high pulmonary arterial pressure affected the surviving [p<0.01]. There occurred various type of arrhythmia like junctional rhythm, first degree atrioventricular [AV] block, sick sinus syndrome and complete AV block, and we inserted 2 permanent pacemakers for these patients. The incidence of arrhythmia were 28.2 % [11/39] in group I and 55.6 % [5/9] in group II, and the actuarial freedom from arrhythmia at 13 years after operation was 66 % [71 % in group I, 44 % in group II]. Increased aortic cross clamping time had affected the development of arrhythmia [p<0.05] which meant the complexity of the operation. The total incidence of left ventricular outflow tract obstruction [LVOTO] was 31.3 % [15/48], but only 3 patients [6.25 %] showed the significant gradient requiring reoperation. The pulmonary venous pathway obstruction [PVO] were found in 3 patients, all in group I, and among them only one required the reoperation. The estimated freedom from PVO was 89 % at 13 years [87 % in group I, 100 % in group II], but we couldn`t find any significant systemic venous obstruction in our series. There occurred 27.1 % [13/48] mild degree tricuspid valve regurgitation without necessary surgical correction. We experienced 14.6 % [7/48] reoperation rate: 3 residual VSD, 3 LVOTO, 1 PVO, 3 atrial baffle leakage. For this high incidence of complication rate after Senning operation and high mortality in TGA with VSD, We do not use this kind of surgical modality any more and do the Jatene operation for all the TGA patients since several years ago.

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Genetical and Pathological Studies on the Mutant Mice as an Animal Model for Deafness Disease

  • Lee, Jeong-Woong;Lee, Eun-Ju;Lee, Hoon-Taek;Chung, Kil-Saeng;Ryoo, Zae-Young
    • Proceedings of the KSAR Conference
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    • 2001.03a
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    • pp.48-48
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    • 2001
  • A new neurological mutant has been found in the ICR outbred strain mouse. Affected mice display profound deafness and a head-tossing and bidirectional circling behavior, showing an autosomal recessive mode of inheritance. It was, therefore, named cir/Kr with the gene symbol cir. The auditory tests identified clearly the hearing loss of the cir mice when compared to wild type mice. Pathological studies confirmed the developmental defects in the middle ear, cochlea, cochlear nerve, and semicircular canal areas, which were correlated to the abnormal behavior observed in the cir mice. Thus, cir mice may be useful as a model for studying inner ear abnormalities and deafness. We have constructed a genetic linkage map by positioning 14 microsatellite markers across the (cir) region and intraspecific backcross between cir and C57BL/6J mice. The cir mouse harbors an autosomal recessive mutation on mouse chromosome 9. The cir gene was mapped to a region between D9Mit116 and D9Mit38 Estimated distances between cir and D9Mit116, and between cir and D9Mit38 are 0.7 and 0.2 cM, respectively. The gene in order was defines : centromere-D9Mit182-D9Mit51/D9Mit79/D9Mit310-D9Mit212/D9Mit184-D9Mit116-cir-D9Mit38-D9Mit20-D9Mit243-D9Mit16-D9Mit55/D9Mit125-D9Mit281. The mouse map location of the cir locus appears to be in a region homologous to human 3q21. Our present date suggest that the nearest flanking marker D9Mit38 provides a useful anchor for the isolation of the cir gene in a yeast artificial chromosome contig.

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A Study on the Nonwet Defective Factors of the SMT Process (SMT 공정 Nonwet 불량 인자에 대한 연구)

  • Yun, Chanhyung
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.35-39
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    • 2020
  • Nonwet (Head in Pillow) defect is one of the defects in SMT (surface mount technology) process, the defect is caused by several factors, such as solder paste misalignment, reflow condition, package warpage and package ball size. This paper focused on ① reflow condition ② package ball & solder paste misalignment ③ package ball size for nonwet experiment. The first, on the case of reflow condition, there would be high risk of nonwet defect when the soldering time was increased, but N2 was adopted to reflow process, there could be no or low risk of nonwet defect because of oxidation barrier control. And when the contact depth between Solder ball and solder paste was below 20 ㎛, there could be high risk of nonwet defect. Also smaller package ball would have low risk of nonwet defect.

Signal Characteristics of Eddy Current Test for Intergranular Attack of Steam Generator Tubes (증기발생기 전열관의 입계부식에 대한 와전류검사 신호특성)

  • Choi, Myung-Sik;Lee, Deok-Hyun;Cho, Se-Gon;Yim, Chang-Jae;Han, Jung-Ho;Hur, Do-Haeng
    • Journal of the Korean Society for Nondestructive Testing
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    • v.22 no.2
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    • pp.198-202
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    • 2002
  • Beacuse intergranular attack (IGA), one of the locallized corrosion forms occurring on steam generator tubes, can not be fabricated by an electric discharge machining method, there are few data for the eddy current test (ECT) characteristics of IGA. In this paper, the characteristics of eddy current signals are evaluated using nonexpanded tubes with IGA defects formed in 0.1 M sodium tetrathionate solution at $40^{\circ}C$. The detectability and sizing accuracy of IGA were discussed in terms of the coil type and frequency of the ECT probes.

Four-valued Hybrid FFT processor design using current mode CMOS (전류 모드 CMOS를 이용한 4치 Hybrid FFT 연산기 설계)

  • 서명웅;송홍복
    • Journal of the Korea Computer Industry Society
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    • v.3 no.1
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    • pp.57-66
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    • 2002
  • In this study, Multi-Values Logic processor was designed using the basic circuit of the electric current mode CMOS. First of all, binary FFT(Fast Fourier Transform) was extended and high-speed Multi-Valued Logic processor was constructed using a multi-valued logic circuit. Compared with the existing two-valued FFT, the FFT operation can reduce the number of transistors significantly and show the simplicity of the circuit. Moreover, for the construction of amount was used inside the FFT circuit with the set of redundant numbers like [0,1,2,3]. As a result, the defects in lines were reduced and it turned out to be effective in the aspect of normality an regularity when it was used designing VLSI(Very Large Scale Integration). To multiply FFT, the time and size of the operation was used as LUT(Look Up Table) Finally, for the compatibility with the binary system, multiple-valued hybrid-type FFT processor was proposed and designed using binary-four valued encoder, four-binary valued decoder, and the electric current mode CMOS circuit.

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Research of Liquid Crystal Alignment on Tantalum Oxide by Using Ion Beam Irradiation (이온빔 조사를 사용한 탄탈륨 산화막에서의 액정 배향에 대한 조사)

  • Lim, Ji-Hun;Oh, Byeong-Yun;Lee, Won-Kyu;Lee, Kang-Min;Na, Hyun-Jae;Park, Hong-Kyu;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.300-300
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    • 2008
  • In this study, the advanced DuoPIGatron-type ion beam (IB) system was applied to inorganic thin film for aligning liquid crystal (LC). LC alignment on $Ta_2O_5$ via IB irradiation was embodied. As a result of IB irradiation, the homogeneously aligned liquid crystal display (LCD) on $Ta_2O_5$ was observed with low pretilt angles. The $Ta_2O_5$ were deposited on indium-tin-oxide coated Coming 1737 glass substrates by rf magnetron sputtering at $200^{\circ}C$. The deposition process resulted in forming very uniform thin film on glass substrates without any defects. To confirm the application of the inorganic alignment on modem display optical devices, we fabricated twisted nematic LCD and measured optical property and response time. As a result of the experiment, the electro optical characteristics of the LCD fabricated by using IB irradiation on $Ta_2O_5$ alignment layer were similar with the other LCD fabricated by using rubbing process.

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A Study on Smart Contract for Personal Information Protection (개인정보보호를 위한 스마트컨트랙트 연구)

  • Kim, Young-Hun
    • Journal of Digital Convergence
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    • v.17 no.3
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    • pp.215-220
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    • 2019
  • The block chain technology is a technique that prevents manipulation of data and ensures integrity and reliability. Ethereum is building a smart contract environment as a type of encryptionenabled system based on block chains. Smart contracts can be implemented when conditions are met, thus increasing confidence in digital data. However, smart contracts that are being tried in various ways are not covered by information security and personal information protection. The structure in which the network participant can view the open transaction ledger is exposed to data or personal information listed in the block chain. In this study, it is possible to manage the data of personal information recorded in the block chain directly. This study is protected personal information by preventing the exposure of personal information and by executing time code, it is possible to erase recorded information after a certain period of time has elapsed. Based on the proposed system in the future, it is necessary to study the additional management techniques of unknown code defects or personal information protection.

A Study on a Fingerprint Identification System Complemented with Additional Three-Dimensional Information (3차원 추가 정보가 보강된 지문인식 시스템에 관한 연구)

  • Lee, Jin-Young
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.3
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    • pp.1310-1318
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    • 2012
  • This study presents a new system that can make up for the decrease in identification rate due to the environmental or physical factors of a fingerprint identification system, which is most actively used among existing biometric systems. Considered most usable in life among many types of biometrics due to the convenience of use, smaller initial investment, and the smaller size, fingerprint identification is widely used in diverse applications. However, a fingerprint identification system has several defects, including environmental factors, physical skin damage, and variable sensor contact, lowering the identification rate in comparison to other biometric systems. On the basis of the existing fingerprint system, this study presents a more efficient system that can improve the identification rate by getting additional biometric information and three-dimensional finger type information through the use of simple and inexpensive additional equipment, which can be used in diverse areas.

Enhanced Hole Concentration of p-GaN by Sb Surfactant (Sb 계면활성제에 의한 p-GaN 박막의 홀농도 향상)

  • Kim, J.Y.;Park, S.J.;Moon, Y.B.;Kwon, M.K.
    • Journal of the Korean Vacuum Society
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    • v.20 no.4
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    • pp.271-275
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    • 2011
  • The role and effect of Sb surfactant on structure and properties of p type gallium nitride (GaN) epilayers have been investigated. It was found that there was a increase of hole concentration with Sb surfactant, compared to typical Mg-doped p-GaN. The structural and optical quality of p-GaN epilayers were accessed by x-ray diffraction, photoluminescence and atomic force microscope measurements. The results clearly show that the increase in hole concentration with Sb surfactant can be resulted from decrease in the dislocations and nitrogen point defects.

Development of Real-Time TCP/COF Inspection System using Differential Image (차영상을 이용한 실시간 TCP/COF 검사 시스템 개발)

  • Lee, Sang-Won;Choi, Hwan-Yong;Lee, Dae-Jong;Chun, Myung-Geun
    • Journal of the Korean Institute of Intelligent Systems
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    • v.22 no.1
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    • pp.87-93
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    • 2012
  • In this paper, we proposed a faulty pattern detection algorithm of TCP(Tape Carrier Package)/COF(Chip On Film), and implemented a real-time system for inspecting TCP/COF. Since TCP/COF has very high resolution having several micro meters, the human operator should visually inspect all the parts through microscope. In this work, we implement an inspection system to detect the faulty pattern, so the operator can visually inspect only the designated parts by the inspection system through the monitor. The proposed defects detection algorithm for TCP/COF packages is implemented by the pattern matching method based on subtracting the reference image from test image. To evaluate performance of the proposal system. we made various experiments according to type of CCD camera and light source as well as illumination projection method. From experimental results, it is confirmed that the proposed system makes it possible to detect effectively the defective TCP/COF film.