• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2001.11a
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• pp.163-166
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• 2001

In this paper, the superposition of ultrasonic signals which were generated by multi-source in a transformer was presented. For analysis of ultrasonic superposition, V$_{peak-peak}$ and pulse number of ultra-sonic signal were used. As a result, the wave form of ultrasonic superposition was classified into three types ; First type was the wave form whose V$_{peak-peak}$ was increased by the superposition of each signal's V$_{peak-peak}$. Second type was wave form whose V$_{peak-peak}$ was decreased by the superposition of each signal's V$_{peak-peak}$. And the other type was wave form whose peals were two or mere. And V$_{peak-peak}$ of superposed ultrasonic wave wads mostlv increased or decreased and pulse number of supe게osed u1trasonic wave was mostly increased.y increased.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.5
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• pp.1004-1010
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• 1992

In recent years, along with the development of ultrasonic probe with wide frequency range, the digitization of measuring instrument, and the development of operating process technics, it is possible to analyze ultrasonic pulse in frequency range. In this paper, applying to flaw model the ultrasonic spectroscopy method that can analyze ultrassonic pulse in frequency range, we examine the possibility of quantification of flaw and apply its result to the void and seperation in LSI package. Consequently, by using the change in frequency distribution and central frequency of sltrasonic pulse detected from flaw, the estimation of shape, size, and depth of flaw is possible. The change in central frequency is changed minutely by the sample materals and position of flaw, but changed mainly by the shape and size of flaw. And we can quantify the shape and size of flaw in LSI pakcage using the experimental result through flaw model.