• Title/Summary/Keyword: transient thermal analysis

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3-Dimensional Numerical Analysis for Thermal Stratification in Surgeline in Nuclear Power Plant (원전 밀림관 열성층의 3 차원 수치해석)

  • Kim, Young-Jong;Kim, Maan-Won;Ko, Eun-Mi
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.729-734
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    • 2008
  • A thermal stratification may occur in the horizontal parts of the surge line during operating transients of the pressurizer, which produces relatively high fatigue usage factor. Heat-up transient is the most severe case among the transient conditions. In this study, to study the relationship between the magnitude of thermal stratification and the length of vertical part of the surge line, some parametric fluid-structure interaction (FSI) analyses with different length variables of the vertical part of the surge line were performed for plant heat-up transient condition by using 3-dimensional numerical analysis. The conservativeness of the traditional finite element model for thermal stratification analysis based on the conservative assumption in the surge line was also discussed by comparison of the results of 3-dimensional transient FSI analysis of this study. Stresses calculated with 3-dimensional transient model were considerably reduced comparing with the traditional analysis.

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A Study on the Prediction of Temperature Change during the Thermal Fatigue Test of Exhaust Manifolds (배기계 내구시험 중의 온도 변화 예측을 위한 연구)

  • 이원근
    • Transactions of the Korean Society of Automotive Engineers
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    • v.11 no.5
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    • pp.29-36
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    • 2003
  • Exhaust manifolds suffer from serious temperature variation during the thermal fatigue test. The spatial distribution of temperature changes at each moment. Because transient flow can not be simulated during the long period of temperature change, the simulation can not be performed by conjugate heat transfer analysis. In this study, a new procedure for transient thermal analysis is established by decoupling fluid-solid analysis. The procedure consists of (1) transient CFD calculation (2 cycles), (2) mapping heat transfer coefficient to the inner surface of solid mesh as a boundary condition of heat conduction analysis and (3) transient heat conduction analysis in the long period (30 min). The realistic temperature change can be predicted by this procedure.

Analysis of Transient Heat Transfer Characteristics of a Receiver for a Dish Type Solar Thermal System by using CFD (CFD를 이용한 접시형 태양열 집열기의 Transient 열전달 성능 해석)

  • Oh, Sang-June;Lee, Ju-Han;Seo, Joo-Hyun;Lee, Jin-Gyu;Cho, Hyun-Seok;Seo, Tae-Beom
    • 한국신재생에너지학회:학술대회논문집
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    • 2008.10a
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    • pp.167-170
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    • 2008
  • A numerical and experimental studies are carried out to investigate the transient heat transfer characteristics of 5kWth dish type solar air receiver. Measured solar radiation and temperatures at several different locations are used as boundary conditions for numerical simulation. Many parameters' effects (reflectivity of the reflector, the thermal conductivity of the receiver body, transmissivity of the quartz window, etc.) on the thermal performance are investigated. Discrete Transfer Method is used to calculate the radiation heat exchange in the receiver. A transient heat transfer model is developed and the rate of radiation, convection and conduction heat transfer are calculated. Comparing the experimental and numerical results, good agreement is obtained. Using the numerical model, the transient heat transfer characteristics of volumetric air receiver for dish type solar thermal systems are known and the transient thermal performance of the receiver can be estimated.

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Analysis of Transient Heat Transfer Characteristics of Dish-Type Solar Receiver System (접시형 태양열 흡수기의 Transient 열전달 특성에 대한 수치해석 연구)

  • Lee, Ju-Han;Seo, Joo-Hyun;Oh, Sang-June;Lee, Jin-Kyu;Seo, Tae-Beom
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2094-2099
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    • 2008
  • A numerical and experimental studies are carried out to investigate the transient heat transfer characteristics of 5kWth dish-type solar air receiver. Measured solar radiation and temperatures at several different locations are used as boundary conditions for numerical simulation. Many parameters' effects (reflectivity of the reflector, the thermal conductivity of the receiver body, transmissivity of the quartz window, etc.) on the thermal performance are investigated. Discrete Transfer Method is used to calculate the radiation heat exchange in the receiver. A transient heat transfer model is developed and the rate of radiation, convection and conduction heat transfer are calculated. Comparing the experimental and numerical results, good agreement is obtained. Using the numerical model, the transient heat transfer characteristics of volumetric air receiver for dish-type solar thermal systems are known and the transient thermal performance of the receiver can be estimated.

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Nonlinear finite element analysis of reinforced concrete structures subjected to transient thermal loads

  • Zhou, C.E.;Vecchio, F.J.
    • Computers and Concrete
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    • v.2 no.6
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    • pp.455-479
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    • 2005
  • This paper describes a 2D nonlinear finite element analysis (NLFEA) platform that combines heat flow analysis with realistic analysis of cracked reinforced concrete structures. The behavior models included in the structural analysis are mainly based on the Modified Compression Field Theory and the Distributed Stress Field Model. The heat flow analysis takes into account time-varying thermal loads and temperature-dependent material properties. The capability of 2D nonlinear transient thermal analysis is then implemented into a nonlinear finite element analysis program VecTor2(C) for 2D reinforced concrete membranes. Analyses of four numerical examples are performed using VecTor2, and results obtained indicate that the suggested nonlinear finite element analysis procedure is capable of modeling the complete response of a concrete structure to thermal and mechanical loads.

A Study on Heat Transfer of an Induction Motor with Cooling Channels under Transient Operation Condition (냉각채널을 지닌 유도전동기의 비정상상태 운전시 열전달)

  • Lee, Jeong-Ho;Park, Sung-Hoon;Kauh, S.-Ken
    • Proceedings of the KSME Conference
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    • 2000.04b
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    • pp.205-212
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    • 2000
  • Induction motors. having axial cooling channels in stator and rotor are designed for better cooling performance. Traction motors are one of those examples. And, thermal analysis gain more attention with the Increased demand of the motors, for reliable operation and life prolongation. was Induced to effective thermal conductivity through modeling. Through. fundamental comparison experiment, heat source experiment and transient state experiment, the induction motor using inverter was examined to produce heat source with frequency level and traced to thermal variation at starting and stopping. And thermal analysis using thermal network was compared with a transient state experiment.

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Computational Heat Transfer Analysis of Dish Type Solar Receiver Using the Transient model (CFD를 이용한 접시형 태양열 집열기의 과도 열전달 모델 해석)

  • Oh, Sang-June;Lee, Ju-Han;Seo, Joo-Hyun;Lee, Jin-Gyu;Cho, Hyun-Seok;Seo, Tae-Beom
    • New & Renewable Energy
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    • v.4 no.4
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    • pp.72-79
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    • 2008
  • A numerical and experimental studies are carried out to investigate the transient heat transfer characteristics of 5kWth dish type solar air receiver. Measured solar radiation and temperatures at several different locations are used as boundary conditions for numerical a. Many parameters' effects (reflectivity of the reflector, the thermal conductivity of the receiver body, transmissivity of the quartz window, etc.) on the thermal performance are investigated. Discrete Transfer Method is used to calculate the radiation heat exchange in the receiver. A transient heat transfer model is developed and the rate of radiation, convection and conduction heat transfer are calculated. Comparing of the experimental and the numerical results, results of both are in good agreement. Using the numerical model, the transient heat transfer characteristics of volumetric air receiver for dish type solar thermal systems are known and the transient thermal performance of the receiver can be estimated.

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Thermal Transient Characteristics of Die Attach in High Power LED Package

  • Kim Hyun-Ho;Choi Sang-Hyun;Shin Sang-Hyun;Lee Young-Gi;Choi Seok-Moon;Oh Yong-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.4 s.37
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    • pp.331-338
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    • 2005
  • The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

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Development of an Electric Circuit Transient Analogy Model in a Vertical Closed Loop Ground Heat Exchanger (수직밀폐형 지중열교환기의 회로 과도해석 상사모델 개발)

  • Kim, Won-Uk;Park, Hong-Hee;Kim, Yong-Chan
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.24 no.4
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    • pp.306-314
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    • 2012
  • Several numerical or analytical models have been proposed to analyze the thermal response of vertical ground heat exchangers (GHEX). However, most models are valid only after several hours of operation since they neglect the heat capacity of the borehole. Recently, the short time response of the GHEX became important in system simulation to improve efficiency. In this paper, a simple new method to evaluate the short time response of the GHEX by using an analogy model of electric circuit transient analysis was presented. The new transient heat exchanger model adopting the concept of thermal capacitance of the borehole as well as the steady-state thermal resistance showed the transient thermal resistance of the borehole. The model was validated by in-situ thermal response test and then compared with the DST model of the TRNSYS program.

Development of Experimental Apparatus For Measuring Thermal Conductivity by Transient Probe Method (과도탐침법에 의한 열전도계수 측정장치 개발)

  • 배신철;김명윤
    • Journal of Biosystems Engineering
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    • v.22 no.1
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    • pp.59-67
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    • 1997
  • An experimental apparatus was developed for the rapid determination of thermal conductivity by transient probe method. The theoretical basis for transient probe method has been investigated. The mathematical model for this method is the Carslaw and Jaeger model which is used perfect line source theory. The small needle probe which is equipped with thermocouple and heating element is constructed. A software that performs data analysis and acquisition is programmed. The influence of the power dissipated per unit length of the probe has been assessed for glycerin. The result showed no significant correlation between thermal conductivity and power input. Determination made with this experimental apparatus were found to agree well with the recommended thermal conductivity data.

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