• 제목/요약/키워드: transfer assembly

검색결과 313건 처리시간 0.031초

Determination of Thermal Contact Conductance of an Injection Mold Assembly for the Prediction of Mold Surface Temperature

  • Lee, Ki-Yeon;Kim, Kyeong-Min;Park, Keun
    • 한국생산제조학회지
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    • 제21권6호
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    • pp.1008-1012
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    • 2012
  • Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.

Leap Motion을 이용한 전자부품 조립 훈련 시스템 개발에 관한 연구 (A Study on the Development of an Electronic Component Assembly Training System Using Leap Motion)

  • 이인철
    • 한국산업융합학회 논문집
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    • 제26권3호
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    • pp.463-470
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    • 2023
  • In this study, an electronic parts assembly training system using Leap Motion was developed in consideration of the processes actually operated in the assembly process of electronic products. Based on Leap Motion and Oculus VR equipment, the system was developed to transfer user's hand movement data in real time and convert it into hand movement in virtual space so that electronic parts assembly simulation can be performed step by step. Through this, it was confirmed that the user can obtain an experience similar to the actual electronic parts assembly work, prevent errors that may occur during the assembly process, and improve proficiency. It is expected that this thesis will provide directions for the quality improvement and development of various education and training programs for virtual reality-based manufacturing processes.

완성 유도탄 탑재장비의 소프트웨어 업그레이드를 위한 MIL-STD-1553B 기반 간접적 데이터 전송 기술 (An Indirect Data Transfer Technique based on MIL-STD-1553B for the Software Upgrade of Embedded Equipments on a Missile Assembly with Booster)

  • 김기표;유해성;이헌철;윤석재;안기현;우덕영
    • 한국군사과학기술학회지
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    • 제19권1호
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    • pp.43-49
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    • 2016
  • This paper addresses the problem of the software update or upgrade of embedded equipments on a missile assembly with booster. Because the embedded equipments are assembled delicately and closely one another with various communication and power cables, they should be very carefully disassembled to directly upgrade the software of a certain embedded equipment. This may cause not only the costs for disassembly and reassembly but also additional tests to verify the completeness of the reassembled missile as a missile assembly with booster. This paper presents an indirect data transfer technique based on MIL-STD-1553B through Guidance Control Unit to easily upgrade the software of other equipments without any additional costs caused by disassembly and reassembly. The presented technique was successfully applied to the software upgrade of various equipments on real missile assembly with booster.

핵연료 집합체 혼합날개형상의 수치최적설계 (Numerical Optimization of the Shape of Mixing Vane in Nuclear Fuel Assembly)

  • 서준우;김광용
    • 대한기계학회논문집B
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    • 제28권8호
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    • pp.929-936
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    • 2004
  • In the present work, shape of the mixing vane in Plus7 fuel assembly has been optimized numerically using three-dimensional Reynolds-averaged Navier-Stokes analysis of flow and heat transfer. Standard $k-{\epsilon}$ model is used as a turbulence closure. The Response surface method is employed as an optimization technique. The objective function is defined as a combination of heat transfer rate and inverse of friction loss. Bend angle and base length of mixing vane are selected as design variables. Thermal-hydraulic performances for different shapes of mixing vane have been discussed, and optimum shape has been obtained as a function of weighting factor in the objective function.

브레이크 저더 저감을 위한 전달계 최적 설계 (The Optimal Design of Suspension Module for Brake Judder Reduction)

  • 김정훈;유동호;강연준
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.1213-1218
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    • 2007
  • The brake judder comes from non-uniformities in the tire/wheel assembly caused by mechanical effects such as a brake torque variation (BTV). A disc thickness variation (DTV) related with the kinematic behavior of the disc was investigated a main source of BTV. In this study, a dynamic model with brake corner assembly of full vehicle using MSC.ADAMS was correlated by experiment of judder phenomenon. Judder was generated and correlated systematically by judder experiment in chassis and brake dynamometer from variation in the thickness of the disc. Also it has been found a judder transfer path and variation of the braking pressure. Through analysis of transfer function and movement of subsystem caused by BTV generation, design parameters have been found. Based on the results obtained from parameter study of suspension module, the effective design process and developed model with brake corner assembly was suggested for vibration reduction of steering wheel caused by the judder phenomenon.

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강제대류-적외선 리플로 솔더링시 전자조립품의 열적반응 분석 (Analysis on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering)

  • 손영석;신지영
    • Journal of Welding and Joining
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    • 제21권6호
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    • pp.46-54
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    • 2003
  • The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

Optimization of a Wire-Spacer Fuel Assembly of Liquid Metal reactor

  • ;김광용
    • 유체기계공업학회:학술대회논문집
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    • 유체기계공업학회 2005년도 연구개발 발표회 논문집
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    • pp.240-243
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    • 2005
  • This study deals with the shape optimization of a wire spacer fuel assembly of Liquid Metal Reactors (LMRs). The Response Surface based optimization Method is used as an optimization technique with the Reynolds-averaged Navier-Stokes analysis of fluid flow and heat transfer using Shear Stress Transport (SST) turbulence model as a turbulence closure. Two design variables namely, pitch to fuel rod diameter ratio and lead length to fuel rod diameter ratio are selected. The objective function is defined as a combination of the heat transfer rate and the inverse of friction loss with a weighting factor. Three level full-factorial method is used to determine the training points. In total, nine experiments have been performed numerically and the resulting datas have been analysed for optimization study. Also, a comparison has been made between the optimized surface and the reference one in this study.

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엔진 헤드 개스킷 강건 설계 (Robust Design of Engine Head Gasket)

  • 이승우;양철호
    • 한국자동차공학회논문집
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    • 제24권4호
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    • pp.416-424
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    • 2016
  • A robust design of head gasket is pursued by using FEA model of engine assembly. Engine assembly model consists of cylinder head, block, gasket, and head bolt is constructed to understand a complex behavior of this engine compound. Thermal loading is performed on the assembled engine cylinder and block to obtain temperature field. Firing load is added to the results of heat transfer analysis to simulate the engine operation condition. Temperature filed results from heat transfer analysis are mapped into the structural mesh. Contact pressure distribution along the bead has been monitored for the engine operation condition. Based on the results obtained from the analysis, Taguchi method has been adopted for a robust design process of head gasket. Among the control factors, bolt size affects most robustness of head gasket sealing.

셀형 유연조립시스템에서의 통합 배치설계 (Integrated Layout Design in Cellular Flexible Assembly Systems)

  • 최영호;노인규
    • 한국경영과학회지
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    • 제22권4호
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    • pp.133-149
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    • 1997
  • The major two steps required to design a cellular layout are cell formation and cell layout. Because of the differences between manufacturing and assembly operations, the logic of cell formation and cell layout between an FMS and an FAS is not the same. Since the time for the assembly operations is usualaly relatively short, the transfer time is thus very crucial for the performance of assembly systems. Transfore in a cellular FAS it is more important to eliminate backtracking operations in assembly planning, not to allow intercellular movements in cell formation, and to arrange machines according to assembly sequence in cell layout. This study presents a method for the integrated layout design in cellular FASs considering the characteristics of FAS, layout, and production factors.

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