• Food Science and Industry
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• v.53 no.3
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• pp.256-263
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• 2020

Milk pasteurization is used to destroy harmful bacteria present in the raw milk for improvement of the keeping quality of dairy products. It is generally carried out in dairy industries as the heating process of raw milk in properly designed and operated equipment to a specific temperature for a specified a specified period. However, thermal processing may cause quality changes in milk as well as significant nutritional losses. Hence, many researchers have started work to design alternative strategies to produce safer foods with minimal thermal treatments for pasteurization. Therefore, the present paper shows the current status of commercial pasteurization system of dairy products in korean industry and the research efforts carried out by researchers on novel milk pasteurization system that could be an alternative to traditional thermal processes for maintaining the freshness of dairy products.

• Korean Journal of Digital Imaging in Medicine
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• v.12 no.1
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• pp.15-18
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• 2010

Main component of radiography barrier aprons is lead. To manufacture a lead-free barrier sheath, barium sulfate and organic iodine-based chemicals should be mixed with rubber. Barrier capacity was tested in the medical field. To improve adaptation of rubber with the mixture, raw materials went through milling, agitation, and extruding processes. Three sheaths were manufactured with 30%, 80%, and 120% sulfate barium, respectively. This study found 10% lower barrier capacity of lead-free barrier than the traditional lead-containing rubber sheath. Problems, however, were confronted during the agitation and extruding processes. Mixing with rubber was a technically demanding job. Inconsistent depth, problems with thermal processing and dissipation were encountered as well.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.9
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• pp.90-97
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• 2002

Ceramics are being increasingly used in industry due to their outstanding physical and chemical properties. But these materials are difficult to machine by traditional machining processes, because they are hard and brittle. Recently, as one of various alternative processes, laser-beam machining is widely used in the cutting of ceramics. Although the use of lasers presents a number of advantages over other methods, one of the problems associated with this process is the uncertain formation of cracks that result from the thermal stresses. This paper presents a Bayesian probabilistic modeling of crack formation over thin alumina plates during laser cutting.

• Fashion & Textile Research Journal
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• v.24 no.1
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• pp.95-107
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• 2022

In reality, the distinction between the Korean traditional culture and the cultures of other countries is at a delicate boundary. Additionally in the wake of the recent socio-cultural confrontation between Korea and China, it has become necessary to establish the foundation and area of Korean traditional culture and to actively utilize the importance of improving awareness of Korean traditional culture. To reorganize the reckless use of the gold foil pattern shown in the rental hanbok, data on the museum's collection of gold leaf patterns were collected and analyzed. Based on the gold foil, Gilsang characters such as Phoenix pattern, Crane pattern, Bat pattern, Flower pattern, Fruit pattern and recovery advice were extracted through references. The traditional gold foil pattern was reconstructed and relocated to design the gold leaf patch. Based on the collection and analysis of the museum's relics, the Wonsam & Daedae, Dangeui, Sranchima, Sagyusam, Jeonbok, Bokgun, and Daenggi were produced. Therefore, we present the possibility of producing gold foil and modern methods for producing gold foil using laser cutting techniques that can express refinement and complexity well, and gold foil thermal transfer paper with retouchable effects. Additionally, we would like to reflect upon the practicality and the convenience to modern people by considering the complexity and hassle of the traditional gold foil production process, and the disadvantages of processes that require relatively longer time. It intends to help revitalize the market of Korean traditional clothing and fashion products.

• Proceedings of the Korea Concrete Institute Conference
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• 1997.10a
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• pp.3-23
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• 1997

The growth in fast-track construction and repair has prompted major efforts to develop high-early-strength concrete mix compositions. Such mixtures rely on the use of relatively high cement contents and accelerator dosages to increase the rate of strength development. The measures, however, seem to compromise the long-term performance of concrete in applications such as full-depth patches as evidenced by occasional premature deterioration of such patches. The hypothesis successfully validated in this research was that traditional methods of increasing the early-age strength of concrete, involving the use of high cement and accelerator contents, increase the moisture and thermal movements of concrete. Restraint of such movements in actual field conditions, by external or internal restraining factors, generates tensile stresses which introduced microcracks and thus increase the permeability of concrete. This increase in permeability accelerates various processes of concrete deterioration, including freeze-thaw attack. Fiver reinforcement of concrete is an effective approach to the control of microcrack and crack development under tensile stresses. Fibers, however, have not been known of accelerating the process of strength gain in concrete. The recently developed specialty cellulose fibers, however, were found in this research to be highly effective in increasing the early-age strength of concrete. This provides a unique opportunity to increase the rate of strength gain in concrete without increasing moisture an thermal movements, which actually controlling the processes of microcracking and racking in concrete. Laboratory test results confirmed the desirable resistance of specialty cellulose fiber reinforced High-early-strength concrete to restrained shrinkage microcracking an cracking, and to different processes of deterioration under weathering effects.

• Korean Journal of Food Science and Technology
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• v.45 no.5
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• pp.590-597
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• 2013

High voltage pulsed electric fields (PEF) treatment is a promising non-thermal processing technology that can replace or partially substitute for thermal processes. The aim of this research was to investigate the microbial inactivation mechanisms by PEF treatment in terms of physiological changes to Saccharomyces cerevisiae. PEF was applied at the electric field strength of 50 kV/cm, treatment time of 56 ${\mu}s$ and temperature of $40^{\circ}C$. The microbial cells treated with PEF showed loss of salt tolerance on the cell membrane and collapse of the relative pH gradient on in-out of cells. Cell death or injury resulted from the breakdown of homeostasis, decreased $H^+$-ATPase activity, and loss of glycolysis activity.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.473-476
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• 2005

Today's manufacturing industry is facing challenges from advanced difficult-to-machine materials (WC-Co alloys, ceramics, and composites), stringent design requirements (high precision, complex shapes, and high surface quality), and machining costs. Advanced materials play an increasingly important role in modem manufacturing industries, especially, in aircraft, automobile, tool, die and mold making industries. The greatly-improved thermal, chemical, and mechanical properties of the material (such as improved strength, heat resistance, wear resistance, and corrosion resistance), while having yielded enormous economic benefits to manufacturing industries through improved product performance and product design, are making traditional machining processes unable to machine them or unable to machine them economically. In this paper, mechanical characteristic evaluation test of fine powder type WC-Co alloy was accomplished to obtain clear data for miniaturized special die parts machining with high reliability and high quality.

• Journal of the Korean institute of surface engineering
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• v.39 no.4
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• pp.179-189
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• 2006

High velocity oxygen fuel(HVOF) thermal spray coating of WC-Co powder is one of the most promising candidate for the replacement of the traditional hard chrome plating and ceramics coating because of the environmental problem of the very toxic $Cr^{6+}$ known as carcinogen and the brittleness of ceramics coating. WC-Co micron and nano powder were coated by HVOF thermal spraying method for the study of durability improvement of the high speed spindle. Coatings were planned by Taguchi program for the four spray parameters of spray distance, flow rates of hydrogen, oxygen and powder feed rate. Optimal coating process was obtained by the studies of coating properties such as porosity, surface roughness, micro hardness, and micro structure. WC-Co micron and nano powder were coated on the Inconel 718 substrate by the optimal coating process obtained in this study. The wear behaviors were studied by the sliding wear tester at room temperature and at an elevated temperature of $500^{\circ}C$ for the application to high speed spindle. Sliding wear test was carried out for four most promising hard coatings of chrome coating, ceramics coatings such as $A1_2O_3,\;Cr_2O_3$ and HVOF Co-alloy T800 for the comparison of their wear behaviors. HVOF WC-Co coating was better than other coatings showing highest micro hardness of 1400 Hv and comparable friction coefficients with others. HVOF WC-Co coating is a strong candidate for the replacement of the traditional hard chrome plating for the high speed spindle.

• Journal of Microbiology and Biotechnology
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• v.12 no.2
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• pp.183-188
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• 2002

The ohmic heating of foods for sterilization provides a shorter come-up time compared to conventional thermal processes. The electric fields as well as the heat generated by ohmic heating facilitate germicidal effects. In the present study, the effect of ohmic heating on the structure and permeability of the cell membrane of yeast cells, Saccharomyces cerevisae, isolated from Takju (a traditional Korean rice-beer), was investigated. The ohmic heating was found to translocate intracellular protein materials out of the cell wall, and the amount of exuded protein increased significantly as the electric field increased from 10 to 20 V/cm. As higher frequencies were applied, more materials were exuded. Compared to conventional heating, more amounts of proteins and nucleic acids were exuded when these cells were treated with ohmic heating. The molecular weights of the major exuded proteins ranged from 14 kDa to 18 kDa, as analyzed by Tricine-SDS PAGE. A TEM study also confirmed the leakage of cellular materials, thus indicating irreversible damage to the cell wall by ohmic heating. It was, therefore, concluded that the electric fields generated by ohmic heating induced electroporation, causing irreversible damage to the yeast cell wall and promoting the translocation of intracellular materials.