• The Transactions of the Korean Institute of Electrical Engineers
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• v.41 no.2
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• pp.170-177
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• 1992

Contact resistance and contact leakage current of the Al/TiSiS12T/Si system are investigated for NS0+T and PS0+T junctions. SALICIDE (Self Aligned Silicide) process was used to make the Al/TiSiS12T/Si system. Titanium disilicide is one of the most common silicides because of its thermal stability, ability to form selective formation and low resistivity. In this paper, RTA temperature effect and Junction implant dose effect were evaluated to characterize contact resistance and contact leakage current. The TiSiS12T contact resistance to NS0+T silicon is lower than that to PS0+T silicon, and TiSiS12T of contact leakage current to NS0+T silicon is lower than that to PS0+T silicon. Contact resistance and contact leakage current of the Al/TiSiS12T/Si system by this method were possible for VLSI application.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.11
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• pp.887-893
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• 1991

To take advantage of Ti-polycide, when it is contacted with both n+ and p+ active area of silicon, the effects of BF$_2$ on the formation of Ti-silicide were investigated with RTA temperature and dopant concentration. The intermediate phase C49 TiSi$_2$ appeared at $650^{\circ}C$ and the stable phase C54 TiSi2 was formed at $700^{\circ}C$. And the formation of Ti-silicide was hindered by BF$_2$ doping and this trend was decreased with increasing temperature. The out-diffusion phenomena of BF$_2$ into Ti silicide were not observed. And significantly, the native oxide was a chief factor preventing the formation of Ti-silicides.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.454-457
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• 1987

Formation of the titanium silicides was performed by the furnace annealing. Ti-silicide was formed by reacting Ti films with singlecrystalline silicon in vacuum or nitrogen ambient in the temperature range $500{\sim}900^{\circ}C$. The Ti-Si interaction in such films was investigated by using X-ray diffraction, and sheet resistance measurements. It was found that the dorminant crystal phase of silicide formed during annealing at $600{\sim}700^{\circ}C$ was TiSi, and $TiSi_2$ phase is associated with a very low sheet resistance(<$2{\Omega}/{\Box}$).

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.05a
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• pp.62-62
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• 1996

• Journal of Powder Materials
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• v.6 no.1
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• pp.103-110
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• 1999

Different sizes of Si powder and milling medium materials (steel and partially stabilized zirconia (PSZ)) were used to synthesize $Ti_3Si$ and $TiSi_2$ by mechanical aollying (MA) of Ti-25.0.at.%Si and Ti-66.7at.% Si powder mixtures. the formation of each titanium silicide did not occur even after 360 min of MA of as-re-ceived Si and Ti powder mixtures due to the lack of homogeneity. $Ti_3Si$, however, was synthesized after 240 min of MA of Ti and 60 min-premilled Si powder mixture. ${\alpha}-TiSi_2$ and $TiSi_2$ were produced by jar milling of Ti and 60 min-premilled Si powder mixture for 48 hr and high -energy PSZ ball-milling in a steel vial for 360 min. The formation of each titanium silicide was characterized by a slow reaction rate as the reactants and product(s) coexisted for a certain period of time. The formation of $Ti_3Si$ and $TiSi_2$ and the reaction rates appeared to be influenced by the Si particle size, the homogeneity of the powder mixtures and the milling medium materials.

• 연구논문집
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• s.31
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• pp.113-125
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• 2001

Silicon addition in titanium alloys generally results in solid solution hardening by silicon itself and precipitation hardening by titanium silicides. The morphology and distribution of the titanium silicides depend upon the alloy chemistry or the heat treatment condition, and play an important role in improving the mechanical properties of the alloys. In this study, the morphology and crystallographic characteristics of the titanium silicides in the Ti-Fe-Si alloy system were studied. Three types of silicides were found in the alloys; (1) interconnected chain-like silicides at grain boundary, (2) coarse silicides over im, (3) fine silicides smaller than 0.2m. Ti3Si was dominant in cast + HIP condition while Ti5Si3 was dominant in as-cast state. It is recognized that $Ti_5Si_3$$\rightarrow$$Ti_3Si$ transition occurred by the peritectoid reaction and it may be promoted by the pressure during HIP. However, in the case of the fine silicides, $Ti_3Si$ and $Ti_5Si_3$ were found simultaneously even after HIP. Such a fine silicide was found to have a crystallographic orientation relationship with matrix.

• Electrical & Electronic Materials
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• v.8 no.6
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• pp.737-743
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• 1995

Two step RTD(Rapid Thermal Diffussion) of P into silicon wafer using tungsten halogen lamp was used to fabricated very shallow n$^{+}$p junction. 1st RTD was performed in the temperature range of 800.deg. C for 60 see and the heating rate was in the 50.deg. C/sec. Phosphrous solid source was transfered on the silicon surface. 2nd RTD process was performed in the temperature range 1050.deg. C, 10sec. Using 2 step RTD we can obtain a shallow junction 0.13.mu.m in depth. After RTD, the Ti-silicide process was performed by the two step RTA(Rapid Thermal Annealing) to reduced the electric resistance and to improve the n$^{+}$p junction diode. The titanium thickness was 300.angs.. The condition of lst RTA process was 600.deg. C of 30sec and that of 2nd RTA process was varied in the range 700.deg. C, 750.deg. C, 800.deg. C for 10sec-60sec. After 2 step RTA, sheet resistance was 46.ohm../[]. Ti-silicide n+p junction diode was fabricated and I-V characteristics were measured.red.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.168-175
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• 1992

The surface and interface morphology as well as the sheet resistance, and uniformity of TiSiz film are significantly improved and the lateral titanium silicide growth over the oxide spacer is minimized by the use of ion beam mixing and rapid thermal annealing in nitrogen ambient. In addition, TiSiz film formations on TiISi and TiISiOz system were also studied.

• ETRI Journal
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• v.13 no.4
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• pp.58-69
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• 1991

고집적회로에서 A1 금속공정의 diffusion barrier로 널리 사용되는 titanium nitride의 성질을 조사하였다. 실제 회로 구조의 열적 안정성을 관찰하기 위하여 준비된 TiN/Ti다층 barrier를 $600^{\circ}C$까지 열처리하여 x-ray photoelectron spectroscopy (XPS), cross-sectional transmission electron microscopy(XTEM) 등으로 분석하였다. 열처리 온도가 증가됨에 따라 oxygen은 TiN 층의 표면과 pure-Ti 층에 pile up 된다. TiN 층의 표면에서는 $600^{\circ}C$열처리시 TiN이 분해되어 완전히 $TiO_2$가 형성되며, TiN 층 내에서는 oxygen 함량은 열처리 온도의 증가에 따라 커지고 이때 형성되는 Ti-oxide는 $TiO_2$ 보다 TiO, $Ti_2$$O_3$ 상태로 존재하게 된다. Pure-Ti 층은 열처리시 두개의 층으로 나누어 지는 데, 표면에서 침투하는 oxygen과 pure-Ti이 반응하여 Ti-oxide 층이 생기며 실리콘 기판과의 반응으로 Ti-silicide를 형성한다. $600^{\circ}C$에서 모든 Ti 층이 반응으로 소모되고 열적 stress, Ti-silicide의 grain growth, oxygen의 침입으로 TiN 층에 blistering이 발생한다.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.41-44
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• 2000

Ultra large scale integrated circuit(ULSI) & complementary metal oxide semiconductor(CMOS) circuits require gate electrode materials such as meta] silicides, titanium-silicide for gate oxides. Many previous authors have researched the improvements sub-micron gate oxide quality. However, little has been done on the electrical quality and reliability of ultra thin gates. In this research, we recommend novel shallow trench isolation structure and two step TiSi$_{2}$ formation for sub 0.1${\mu}{\textrm}{m}$ gate oxide.