• Title/Summary/Keyword: through-via

Search Result 5,654, Processing Time 0.039 seconds

CR389, a Benzoimidazolyl Pyridinone Analog, Induces Cell Cycle Arrest and Apoptosis via p53 Activation in Human Ovarian Cancer PA-1 Cells

  • Suh, Hyewon;Choi, Ko-woon;Lee, Chul-Hoon
    • Journal of Microbiology and Biotechnology
    • /
    • v.25 no.3
    • /
    • pp.418-422
    • /
    • 2015
  • In the course of screening for novel cell cycle inhibitors and apoptotic inducers, CR389, elucidated as 5-(1H-benzoimidazol-2-yl)-1H-pyridin-2-one, was generated as a new hit compound. Flow cytometric analysis and western blots of PA-1 cells treated with $60{\mu}M$ CR389 revealed an appreciable cell cycle arrest at the G2/M phase through direct inhibition of the CDK1 complex. In addition, activation of p53 via phosphorylation at Ser15 and subsequent up-regulation of p21CIP1 showed that CR389 also induces p53-dependent-p21CIP1-mediated cell cycle arrest. Furthermore, apoptotic induction in $60{\mu}M$ CR389-treated PA-1 cells is associated with the release of cytochrome c from mitochondria through up-regulation of the proapoptotic Bax protein, which results in the activation of procaspase-9 and -3, and the cleavage of poly(ADP-ribose) polymerase (PARP). Accordingly, CR389 seems to have multiple mechanisms of antiproliferative activity through p53-mediated pathways against human ovarian cancer cells. Therefore, we conclude that CR389 is a candidate therapeutic agent for the treatment of human ovarian cancer via the activation of p53.

Characterization of Backside Passivation Process for Through Silicon via Wafer (TSV 웨이퍼 공정용 Si3N4 후막 스트레스에 대한 공정특성 분석)

  • Kang, Dong Hyun;Gu, Jung Mo;Ko, Young-Don;Hong, Sang Jeen
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.27 no.3
    • /
    • pp.137-140
    • /
    • 2014
  • With the recent advent of through silicon via (TSV) technology, wafer level-TSV interconnection become feasible in high volume manufacturing. To increase the manufacturing productivity, it is required to develop equipment for backside passivation layer deposition for TSV wafer bonding process with high deposition rate and low film stress. In this research, we investigated the relationship between process parameters and the induced wafer stress of PECVD silicon nitride film on 300 mm wafers employing statistical and artificial intelligence modeling. We found that the film stress increases with increased RF power, but the pressure has inversely proportional to the stress. It is also observed that no significant stress change is observed when the gas flow rate is low.

Electron Pre-acceleration in Weak Quasi-perpendicular Shocks in Clusters of Galaxies

  • Ha, Ji-Hoon;Kang, Hyesung;Ryu, Dongsu
    • The Bulletin of The Korean Astronomical Society
    • /
    • v.44 no.1
    • /
    • pp.49.1-49.1
    • /
    • 2019
  • Giant radio relics in the outskirts of galaxy clusters have been observed and they are interpreted as synchrotron emission from relativistic electrons accelerated via diffusive shock acceleration (DSA) in weak shocks of Ms < 3.0. In the DSA theory, the particle momentum should be greater than a few times the momentum of thermal protons to cross the shock transition and participate in the Fermi acceleration process. In the equilibrium, the momentum of thermal electrons is much smaller than the momentum of thermal protons, so electrons need to be pre-accelerated before they can go through DSA. To investigate such electron injection process, we study the electron pre-acceleration in weak quasi-perpendicular shocks (Ms = 2.0 - 3.0) in an ICM plasma (kT = 8.6 keV, beta = 100) through 2D particle-in-cell simulations. It is known that in quasi-perpendicular shocks, a substantial fraction of electrons could be reflected upstream, gain energy via shock drift acceleration (SDA), and generate oblique waves via the electron firehose instability (EFI), leading the energization of electrons through wave-particle interactions. We find that such kinetic processes are effective only in supercritical shocks above a critical Mach number, $Ms{\ast}{\sim}2.3$. In addition, even in shocks with Ms > 2.3, energized electrons may not reach high energies to be injected to DSA, because the oblique EFI alone fails to generate long-wavelength waves. Our results should have implications for the origin and nature of radio relics.

  • PDF

Thermal stress intensity factor solutions for reactor pressure vessel nozzles

  • Jeong, Si-Hwa;Chung, Kyung-Seok;Ma, Wan-Jun;Yang, Jun-Seog;Choi, Jae-Boong;Kim, Moon Ki
    • Nuclear Engineering and Technology
    • /
    • v.54 no.6
    • /
    • pp.2188-2197
    • /
    • 2022
  • To ensure the safety margin of a reactor pressure vessel (RPV) under normal operating conditions, it is regulated through the pressure-temperature (P-T) limit curve. The stress intensity factor (SIF) obtained by the internal pressure and thermal load should be obtained through crack analysis of the nozzle corner crack in advance to generate the P-T limit curve for the nozzle. In the ASME code Section XI, Appendix G, the SIF via the internal pressure for the nozzle corner crack is expressed as a function of the cooling or heating rate, and the wall thickness, however, the SIF via the thermal load is presented as a polynomial format based on the stress linearization analysis results. Inevitably, the SIF can only be obtained through finite element (FE) analysis. In this paper, simple prediction equations of the SIF via the thermal load under, cool-down and heat-up conditions are presented. For the Korean standard nuclear power plant, three geometric variables were set and 72 cases of RPV models were made, and then the heat transfer analysis and thermal stress analysis were performed sequentially. Based on the FE results, simple engineering solutions predicting the value of thermal SIF under cool-down and heat-up conditions are suggested.

Bio-degradation of Phenol in Wastewater by Enzyme-loaded Membrane Reactor: Numerical Approach

  • Barbieri, Giuseppe;Choi, Seung-Hak;Scura, Francesco;Mazzei, Rosalinda;Giorno, Lidietta;Drioli, Enrico;Kim, Jeong-Hoon
    • Membrane Journal
    • /
    • v.19 no.1
    • /
    • pp.72-82
    • /
    • 2009
  • A mathematical model was written for simulating the removal of phenol from wastewater in enzyme-loaded membrane reactor (EMR). The numerical simulation program was developed so as to predict the degradation of phenol through an EMR. Numerical model proves to be effective in searching for optimal operating conditions and creating an optimal microenvironment for the biocatalyst in order to optimize productivity. In this study, several dimensionless parameters such as Thiele Modulus (${\phi}^2$, dimensionless Michaelis-Menten constant ($\xi$), Peclet number (Pe) were introduced to simplify their effects on system efficiency. In particular, the study of phenol conversion at different feed compositions shows that low phenol concentrations and high Thiele Modulus values lead to higher reactant degradation.

Three Color Algorithm for Two-Layer Printed Circuit Boards Layout with Minimum Via

  • Lee, Sang-Un
    • Journal of the Korea Society of Computer and Information
    • /
    • v.21 no.3
    • /
    • pp.1-8
    • /
    • 2016
  • The printed circuit board (PCB) can be used only 2 layers of front and back. Therefore, the wiring line segments are located in 2 layers without crossing each other. In this case, the line segment can be appear in both layers and this line segment is to resolve the crossing problem go through the via. The via minimization problem (VMP) has minimum number of via in layout design problem. The VMP is classified by NP-complete because of the polynomial time algorithm to solve the optimal solution has been unknown yet. This paper suggests polynomial time algorithm that can be solve the optimal solution of VMP. This algorithm transforms n-line segments into vertices, and p-crossing into edges of a graph. Then this graph is partitioned into 3-coloring sets of each vertex in each set independent each other. For 3-coloring sets $C_i$, (i=1,2,3), the $C_1$ is assigned to front F, $C_2$ is back B, and $C_3$ is B-F and connected with via. For the various experimental data, though this algorithm can be require O(np) polynomial time, we obtain the optimal solution for all of data.

Mediating Effects of Emotional Venting via Instant Messaging (IM) and Positive Emotion in the Relationship between Negative Emotion and Depression (부정적 정서와 우울의 관계에서 인스턴트 메시징(Instant Messaging)을 통한 감정 표출과 긍정적 정서의 매개효과)

  • Lee, Hannah;An, Soontae
    • Research in Community and Public Health Nursing
    • /
    • v.30 no.4
    • /
    • pp.571-580
    • /
    • 2019
  • Purpose: The purpose of this study is to examine the mediating effects of emotional venting via instant messaging (IM) and positive emotion in the relationship between negative emotion and depression. Methods: Online survey was conducted in Korea between 2 April and 7 April 2019. To obtain samples with representativeness, data were gathered by the professional research firm. A total of 250 Koreans were participated in this study. The collected data were analyzed using descriptive statistics, Pearson's correlation coefficients, and SPSS PROCESS macro to test the mediating effects. Results: This study analyzed the direct/indirect effects of negative emotion on emotional venting via IM, in the relationship between positive emotion and depression. Negative emotion had indirect effects on depression through emotional venting via IM and positive emotion. Both emotional venting via IM and positive emotion had dual mediating effects in the influence of negative emotion on depression. Conclusion: These results suggest that it is important to manage negative emotion to prevent depression. Also, this study confirmed that emotional venting via IM is a powerful factor influencing emotional recovery.

THE VERIFICATION OF THE MTT ASSAY ON THE VIABILITY OF PERIODONTAL LIGAMENTAL CELLS IN RAT MOLARS THROUGH THE HISTOLOGIC EXAMINATION (쥐치아 치근면의 치주인대세포의 활성도를 평가하는 방법으로 MTT검색법의 적절성에 대한 조직학적인 검증)

  • Kim, Hyun-Ki;Kim, Eui-Seoung;Choi, In-Bok;Kim, Jin;Lee, Seung-Jong
    • Restorative Dentistry and Endodontics
    • /
    • v.28 no.5
    • /
    • pp.385-391
    • /
    • 2003
  • The purpose of this study is to examine the viability of PDL cells in rat molars by using MTT assay and to verify the MTT assay through the histologic observation. Thirty of Sprague-Dawley white female rats of 4-weeks old with a body weight of about 100 grams were used. Groupings are as follows : Immediate Group : Positive control group(n=10)-after extraction immediately. Dried Group : Negative control group(n=10)-after drying for an hour under warm dry. $ViaSpan^{\circledR}$ Group : 1hour $ViaSpan^{\circledR}$ group(n=10)-after storing in $ViaSpan^{\circledR}{\;}at{\;}4^{\circ}C$ for 1hour. Ten teeth of each group were treated as same as above and replanted to the original socket of experimental animals. After two weeks of replantation. all the experimental animals were sacrificed. And after fixation, extracted maxillary jaw was dimineralized. After it was embedded in paraffin. serial section by $5\mu\textrm{m}$ was carried out and for construction of specimen, hematoxylin-eosin dye was used. The mean MTT measurement of immediate group(positive control) is 2.81 and the mean measurement of dried group(negative control) is 0.98 which is significantt differnt(P<0.05), The mean measurement of $ViaSpan^{\circledR}$ group is 2.65 and there is significant difference between dried group and $ViaSpan^{\circledR}$ group(P<0.05), However, there is no difference between immediate group and $ViaSpan^{\circledR}$ group. The average resorption points of immediate group is 3.03 points. In the dried group, average 6.44 points resorption and 2.68 points showed resorption in the $ViaSpan^{\circledR}$ group. Unlike with MTT assay, there was no significant difference between the immediate group and $ViaSpan^{\circledR}$ group. The usage of MTT assay as a viable cell marker may give us a better indication of the maintenance of periodontal ligament cell vitality.

자화된 유도결합 플라즈마에서의 $SF_6/O_2$ 특성 및 Silicon Via에 대한 식각 특성

  • Kim, Wan-Su;Lee, U-Hyeon;Park, Wan-Jae;Kim, Hyeok;Hwang, Gi-Ung
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.02a
    • /
    • pp.455-456
    • /
    • 2012
  • 최근 반도체 소자의 Design rule의 지속적인 축소로 물리적 한계에 다가서고 있는 상황이다. 이에 대한 대책으로 여러가지 방안이 대두되고 있으며 그 중 하나로 TSV (Through Silicon Via)를 적용한 3D 혹은 stack scheme이 개발되고 있다. TSV 공정은 throughput의 향상을 위해 high etch rate를 기본 필요 조건으로 한다. 본 연구에서는 자화된 유도결합 식각 장치하에서 $SF_6/O_2$ 플라즈마의 특성을 Langmuir Probe와 Actinometry를 이용하여 측정하고 자화여부에 따른 특성 차이와 이의 Silicon Via에 대한 특성에 대해 살펴보았다.

  • PDF