• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.111-113
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• 1989

This paper reports the optical characteristics of TeS$_{5}$ Ge$_{5}$ thin film. In phase diagram, TeS$_{5}$ Ge$_{5}$ has the eutetic point with the loweat melting point. Therfore, TeS$_{5}$ Ge$_{5}$ thin film will be melted by Diode Laser with low energy. TeS$_{5}$ Ge$_{5}$ thin films start to change the phase from amorphous to crystalline near 10$0^{\circ}C$, but perfectly change the phase at 28$0^{\circ}C$. As-deposit TeS$_{5}$ Ge$_{5}$ thin film start to change the phase to crystalline in enviroment og 66$^{\circ}C$ 80%RH.circ}C$ 80%RH.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.198.1-198.1
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• 2016

Organic light-emitting diode (OLED) displays have promising potential to replace liquid crystal displays (LCDs) due to their advantages of low power consumption, fast response time, broad viewing angle and flexibility. Organic light emitting materials are vulnerable to moisture and oxygen, so inorganic thin films are required for barrier substrates and encapsulations.[1-2]. In this work, the silicon-based inorganic thin films are deposited on plastic substrates by plasma-enhanced chemical vapor deposition (PECVD) at low temperature. It is necessary to deposit thin film at low temperature. Because the heat gives damage to flexible plastic substrates. As one of the transparent diffusion barrier materials, silicon oxides have been investigated. $SiO_x$ have less toxic, so it is one of the more widely examined materials as a diffusion barrier in addition to the dielectric materials in solid-state electronics [3-4]. The $SiO_x$ thin films are deposited by a PECVD process in low temperature below $100^{\circ}C$. Water vapor transmission rate (WVTR) was determined by a calcium resistance test, and the rate less than $10.^{-2}g/m^2{\cdot}day$ was achieved. And then, flexibility of the film was also evaluated.

• Advanced Industrial SCIence
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• v.1 no.1
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• pp.16-22
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• 2022

Starting with cathode ray tubes, displays are forming markets in the order of active marix organic light emitting diode (AMOLED) after PDP (Plasma Display Panel) and LCD (Liquid Crystal Display). OLED is recognized as a key field for the development of each country preparing for the fourth industrial revolution, and especially Samsung Display and LG Display, which are the top industries in Korea, are leading the market with more than 90% of OLED shares. Currently, AMOLED has moved to the area that can be folded or bent. This technology is possible because TFT (Thin Film Transistor) and OLED may be formed on a flexible substrate. In the future, the technology will move to stretchable displays, and for this, the development of substrate materials is first, and then TFT and OLED devices should also be implemented with stretchable materials.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.179-182
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• 2007

Polycrystaline (poly) 3C-SiC thin film on n-type and p-type Si were deposited by APCVD using HMDS, $H_2$, and Ar gas at $1180^{\circ}C$ for 3 hour. And then the schottky diode with Au/poly 3C-Sic/Si(n-type) structure was fabricated. Its threshold voltage ($V_d$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_D$) value were measured as 0.84 V, over 140 V, 61nm, and $2.7{\times}10^{19}\;cm^3$, respectively. The p-n junction diode fabricated by poly 3C-SiC was obtained like characteristics of single 3C-SiC p-n junction diode. Therefore, its poly 3C-SiC thin films are suitable MEMS applications in conjuction with Si fabrication technology.

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.92-94
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• 2004

In this investigation, 3C-SiC film deposited $1000{\AA}$ on the p-type silicon wafer which is resistance $0{\sim}30[{\Omega}{\cdot}cm]$ by PECVD (Plasma-enhanced Chemical Vapor Deposition). We deposited Cr, Ta, Pt in front of wafer to utilize DC-sputter for $500{\AA}$, the SiC Schottky diode made from Al ohmic contact about $4000{\AA}$, and to each different temperature which annealing in Ar atmosphere, we had forward characteristic analysis along to annealing temperature.

• Journal of the Korean Ceramic Society
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• v.45 no.1
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• pp.30-35
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• 2008

In this paper, CdS/Cd(Cu)S thin films and diodes were manufactured via a chemical bath deposition (CBD) process, and the effects of $NH_4Cl$ and TEA(triethylamine) on the properties of the films were examined. The addition of $NH_4Cl$ significantly increased the thickness of the CdS and Cd(Cu)S films, however, the addition of TEA decreased the thickness in both cases slightly. The addition of $NH_4Cl$ along with TEA increased the film thickness more effectively compared to the addition of only $NH_4Cl$. The thickness of the CdS film prepared from an aqueous solution of 0.007 M $CdSO_4$, 1.3 M $NH_4OH$, 0.03 M $SC(NH_2)_2$, 0.0001 M TEA and 0.03 M $NH_4Cl$ was 310 nm. Dark resistivity of the CdS film was $1.2{\times}10^3\;{\Omega}cm$ and the photo resistivity with $500\;W/cm^2$ irradiation of white light was $20{\Omega}cm$. The Cd(Cu)S/CdS thin film diodes prepared by CBD showed good rectifying characteristics.

• Journal of Information Display
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• v.7 no.1
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• pp.35-40
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• 2006

Organic light-emitting diode (OLED) display panel using the charge-pump (CP) pixel addressing scheme was fabricated, and the results show that it is applicable for information display. A CP-OLED panel with 64 ${\times}$ 64 pixels consisting of thin-film capacitors and amorphous silicon Schottky diodes was fabricated using conventional thin-film processes. The pixel drive circuit passes electrical current into the OLED cell during most of the frame period as in the thin-film transistor (TFT)-based active-matrix (AM) OLED displays. In this study, the panel was operated at a voltage level of below 4 V, and this operation voltage can be reduced by eliminating the overlap capacitance between the column bus line and the common electrode.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.479-480
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• 2006

The purpose of this paper is to investigate the relationship between CMP(Chemical Mechanical Polishing) characteristics of ITO thin film and friction signal by using the CMP monitoring system. Suba 400 pad and MSW2000 slurry of the Rohm & Haas Co. was used in this experiment to investigate the charateristics of ITO CMP. From this experiment, it is proven that the coefficient of friction is related to uniformity of the removal rate of the ITO thin film. Therefore, the prediction of polishing result would be possible by measuring friction signal.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1122-1124
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• 2009

Organic thin-film transistors (OTFTs) were fabricated by using the transfer patterning method. In order to remove Au pattern easily, UV-curable polymer mold was surface treated. Au source/drain (S/D) pattern was transferred to insulator-coated substrate surface. Fabricated OTFTs were compared to OTFTs using vacuum-deposited Au S/D. Additionally, transistor diodes were characterized.

• Journal of Korean Vacuum Science & Technology
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• v.6 no.3
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• pp.126-132
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• 2002

The origin of image-sticking in metal-insulator-metal type thin-film diode liquid crystal displays(TFD-LCDs) is the asymmetric current-voltage(I-V) characteristic of TFD element. We developed that TFD-LCDs have reduced-image-sticking. Tantalum pentoxide(Ta$_2$O$\sub$5/) is a candidate for use in metal-insulator-metal(MIM) capacitors in switching devices for active-matrix liquid crystal displays(AM-LCDs). High quality Ta$_2$O$\sub$5/ thin films have been obtained from anodizing method. We fabricated a TFD element using Ta$_2$O$\sub$5/ films which had perfect current-voltage symmetry characteristics. We applied novel process technologies which were postannealed whole TFD element instead of conventional annealing to the fabrication. One-Time Post-Annealing(OPTA) heat treatment process was introduced to reduce the asymmetry and shift of the I-V characteristics, respectively. OPTA means that the whole layers of lower metal, insulator, and upper metal are annealed at one time. Futhermore, in this paper, we discussed the effects of top-electrode metals and annealing conditions.