• Title/Summary/Keyword: thickness-shear

Search Result 1,906, Processing Time 0.024 seconds

Comparison of Impact Sound Insulation Performances of Apartment Floors Against Heavy-weight Impact Sources via Field Measurement Data (공동주택 현장 측정자료를 활용한 중량충격원의 바닥충격음 차단성능 비교)

  • Yun, Chang-Yeon;Yeon, Jun-Oh;Kim, Myung-Jun
    • Transactions of the Korean Society for Noise and Vibration Engineering
    • /
    • v.24 no.8
    • /
    • pp.651-658
    • /
    • 2014
  • Notification 2013-611 of MOLIT has come into effect. It relates primarily to new standard impact source. In this study, an in-depth experimental analysis of the difference between a bang machine and an impact ball was performed via field testing of shear wall and flat plate structure at 51 sites. This paper focuses on the difference in single number quantities between a bang machine and an impact ball. At wall thicknesses of 180 and 210 mm in shear wall structure, the single number quantities exhibited differences of 3.1 and 4.5 dB, respectively, and at thicknesses exceeding 250 mm in flat plate structure, the difference was constant at 4.6 dB. With regard to flat plate structures, the single-index difference increased up to 11 dB as the thickness of the floor slab increased. In general, the highest level of contribution for the bang machine was 63 Hz, irrespective of thickness determining bandwidth. The highest level for the impact ball were 63 Hz and 125 Hz. In future research, when reviewing additional field performance measurement data, it will be necessary to consider a detailed examination instead of the current method of uniformly adding 3 dB for all thicknesses and types of structures.

A study on the structural behaviour of functionally graded porous plates on elastic foundation using a new quasi-3D model: Bending and free vibration analysis

  • Kaddari, Miloud;Kaci, Abdelhakim;Bousahla, Abdelmoumen Anis;Tounsi, Abdelouahed;Bourada, Fouad;Tounsi, Abdeldjebbar;Bedia, E.A. Adda;Al-Osta, Mohammed A.
    • Computers and Concrete
    • /
    • v.25 no.1
    • /
    • pp.37-57
    • /
    • 2020
  • This work investigates a new type of quasi-3D hyperbolic shear deformation theory is proposed in this study to discuss the statics and free vibration of functionally graded porous plates resting on elastic foundations. Material properties of porous FG plate are defined by rule of the mixture with an additional term of porosity in the through-thickness direction. By including indeterminate integral variables, the number of unknowns and governing equations of the present theory is reduced, and therefore, it is easy to use. The present approach to plate theory takes into account both transverse shear and normal deformations and satisfies the boundary conditions of zero tensile stress on the plate surfaces. The equations of motion are derived from the Hamilton principle. Analytical solutions are obtained for a simply supported plate. Contrary to any other theory, the number of unknown functions involved in the displacement field is only five, as compared to six or more in the case of other shear and normal deformation theories. A comparison with the corresponding results is made to verify the accuracy and efficiency of the present theory. The influences of the porosity parameter, power-law index, aspect ratio, thickness ratio and the foundation parameters on bending and vibration of porous FG plate.

Vertical Vibration Decrease Effect of Slab in Shear-Wall Structures According to Property and Size of Structural Members (전단벽식 공동주택의 부재 물성치 및 크기 변화에 따른 슬래브 수직진동 저감 효과)

  • Chun Ho-Min;Yoo Seung-Min
    • Journal of the Korean housing association
    • /
    • v.17 no.3
    • /
    • pp.61-69
    • /
    • 2006
  • Vertical vibrations on the slab of buildings are affected by types of vibration sources, transfer paths, and the material property and the size of members. Among these parameters, the vibration sources and the transfer path can not be controlled, but the property and the size of members can be controlled in the phase of design the members. In this study, the vibration responses according to the property and size of members were obtained by using a prediction program based on dynamic-stiffness matrix. Three parameters which are not usually considered as major factors for architecral planning were selected fur these analyses. They are the strength of materials, the thickness of wall and the thickness of slab. The ground vibration source located near a building was used as vibration input data in the analyses. This study has its originality on presenting appropriate property and size of structural members in order to reduce vertical vibration of slab in shear-wall structures. Analysing the results from the vibration estimation program according to the variations of parameters, the appropriate ratio among the sizes of structural members were proposed. From these results, the vibration level on the slab which is not constructed yet would be predicted and the vibration peak level can be reduced or shifted into the desirable frequency range. Therefore, the vertical vibration could be controlled in the phase of designing buildings.

Stability Analysis and Application Evaluation of the Pretensioned Soil Nailing Systems (프리텐션 쏘일네일링 시스템의 안정해석 및 적용성 평가)

  • Kim, Hong-Taek;Park, Si-Sam
    • Proceedings of the Korean Geotechical Society Conference
    • /
    • 2004.03b
    • /
    • pp.783-790
    • /
    • 2004
  • In this study, a newly modified soil nailing technology named as the PSN(pretensioned soil nailing) system, is developed to reduce both facing displacements and ground surface settlements in top-down excavation process as well as to increase the global stability. Up to now, the PSN system has been investigated mainly focusing on an establishment of the design procedure. In the present study, the analytical procedure and design technique are proposed to evaluate maximum pretension force and stability of the PSN system. Also proposed arc techniques to determine the required thickness of a shotcrete facing and to estimate probability of a failure against the punching shear. Based on the proposed procedure and technique, effects of the radius of a influence circle and dilatancy angle on the thickness of a shotcrete facing, bonded length and safety factors arc analyzed. In addition, effects of the reduction of deformations expected by pretensioning of the soil nails are examined in detail throughout an illustrative example and $FLAC^{2D}$ program analysis. And a numerical approach is further made to determine a postulated failure surface as well as a minimum safety factor of the proposed PSN system using the shear strength reduction technique with the $FLAC^{2D}$ program. Global minimum safety factors and local safety factors at various excavation stages computed in case of the PSN system arc analyzed throughout comparisons with the results expected in case of the general soil nailing system. The efficiency of the PSN system is also dealt with by analyzing the wall-facing deformations and the adjacent ground surface settlements.

  • PDF

Material Property Evaluation of High Temperature Creep on Pb-free Solder Alloy Joint to Reflow Time by Shear Punch-creep Test (전단펀치-크리프 시험에 의한 리플로우 시간별 Pb-free 솔더 합금 접합부에 대한 고온 크리프 물성 평가)

  • Ham, Young Pil;Heo, Woo Jin;Yu, Hyo Sun;Yang, Sung Mo
    • Transactions of the Korean Society of Automotive Engineers
    • /
    • v.21 no.1
    • /
    • pp.145-153
    • /
    • 2013
  • In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.

The flexural performance of laminated glass beams under elevated temperature

  • Huang, Xiaokun;Liu, Gang;Liu, Qiang;Bennison, Stephen J.
    • Structural Engineering and Mechanics
    • /
    • v.52 no.3
    • /
    • pp.603-612
    • /
    • 2014
  • A series of experimental work is carried out with the aim to understand the flexural performance of laminated glass (LG) beams using polyvinyl butyral (PVB) and Ionoplast interlayers subjected to short term duration loads in the circumstance of elevated temperature. The study is based on a total of 42 laboratory tests conducted in ambient temperature ranging from $25^{\circ}C$ to $80^{\circ}C$. The load duration is kept within 20 seconds. Through the tests, load-stress and load-deflection curves of the LG are established; appropriate analytical models for the LG are indentified; the effective thicknesses as well as the shear transfer coefficients of the LG are semi-empirically determined. The test results show that within the studied temperature range the bending stresses and deflections at mid-span of the LG develop linearly with respect to the applied loads. From $25^{\circ}C$ to $80^{\circ}C$ the flexural behavior of the PVB LG is found constantly between that of monolithic glass and layered glass having the same nominal thickness; the flexural behavior of the Ionoplast LG is equivalent to monolithic glass of the same nominal thickness until the temperature elevates up to $50^{\circ}C$. The test results reveal that in calculating the effective thicknesses of the PVB and Ionoplast LG, neglecting the shear capacities of the interlayers is uneconomic even when the ambient temperature is as high as $80^{\circ}C$. In the particular case of this study, the shear transfer coefficient of the PVB interlayer is found in a range from 0.62 to 0.14 while that of the Ionoplast interlayer is found in a range from 1.00 to 0.56 when the ambient temperature varies from $25^{\circ}C$ to $80^{\circ}C$.

A parametric study on fatigue of a top-tensioned riser subjected to vortex-induced vibrations

  • Kim, Do Kyun;Wong, Eileen Wee Chin;Lekkala, Mala Konda Reddy
    • Structural Monitoring and Maintenance
    • /
    • v.6 no.4
    • /
    • pp.365-387
    • /
    • 2019
  • This study aims to provide useful information on the fatigue assessment of a top-tensioned riser (TTR) subjected to vortex-induced vibration (VIV) by performing parametric study. The effects of principal design parameters, i.e., riser diameter, wall thickness, water depth (related to riser length), top tension, current velocity, and shear rate (or shear profile of current) are investigated. To prepare the base model of TTR for parametric studies, three (3) riser modelling techniques in the OrcaFlex were investigated and validated against a reference model by Knardahl (2012). The selected riser model was used to perform parametric studies to investigate the effects of design parameters on the VIV fatigue damage of TTR. From the obtained comparison results of VIV analysis, it was demonstrated that a model with a single line model ending at the lower flex joint (LFJ) and pinned connection with finite rotation stiffness to simulate the LFJ properties at the bottom end of the line model produced acceptable prediction. Moreover, it was suitable for VIV analysis purposes. Findings from parametric studies showed that VIV fatigue damage increased with increasing current velocity, riser outer diameter and water depth, and decreased with increasing shear rate and top tension of riser. With regard to the effects of wall thickness, it was not significant to VIV fatigue damage of TTR. The detailed outcomes were documented with parametric study results.

Beam-Type Bend Specimen for Interlaminar Fracture Toughness of Laminated Composite under Mixed-Mode Defmrmations (보 형태의 굽힘시편을 이용한 적층복합재료의 혼합모우드 층간파괴인성 평가)

  • 윤성호;홍창선
    • Transactions of the Korean Society of Mechanical Engineers
    • /
    • v.13 no.5
    • /
    • pp.911-920
    • /
    • 1989
  • It this study, beam-type bend specimen is used to evaluate the interlaminar fracture toughness of laminated composite under mixed-mode deformations. The specimen is loaded under three-point bending and hence produced mixed-mode deformations in the vicinity of the crack tip according to the variation of the thickness ratio on delamination plane. Total energy release rate is obtained by elementary beam theory considering the effect of shear deformation. The partitioning of total value into mode-I and mode-II components is also performed. The mixed-mode interlaminar fracture toughness is evaluated by experiments on specimens with several thickness ratios of delamination plane. As the part of delamination plane is thicker, the effect of shear deformation on total energy release rate is increased. Beam-type bend specimen men may be applied to obtain informations on the mixed-mode interlaminar fracture behavior of laminated composites.

Effects of hygro-thermo-mechanical conditions on the buckling of FG sandwich plates resting on elastic foundations

  • Refrafi, Salah;Bousahla, Abdelmoumen Anis;Bouhadra, Abdelhakim;Menasria, Abderrahmane;Bourada, Fouad;Tounsi, Abdeldjebbar;Bedia, E.A. Adda;Mahmoud, S.R.;Benrahou, Kouider Halim;Tounsi, Abdelouahed
    • Computers and Concrete
    • /
    • v.25 no.4
    • /
    • pp.311-325
    • /
    • 2020
  • In this research work, the hygrothermal and mechanical buckling responses of simply supported FG sandwich plate seated on Winkler-Pasternak elastic foundation are investigated using a novel shear deformation theory. The current model take into consideration the shear deformation effects and ensures the zero shear stresses on the free surfaces of the FG-sandwich plate without requiring the correction factors "Ks". The material properties of the faces sheets of the FG-sandwich plate are assumed varies as power law function "P-FGM" and the core is isotropic (purely ceramic). From the virtual work principle, the stability equations are deduced and resolved via Navier model. The hygrothermal effects are considered varies as a nonlinear, linear and uniform distribution across the thickness of the FG-sandwich plate. To check and confirm the accuracy of the current model, a several comparison has been made with other models found in the literature. The effects the temperature, moisture concentration, parameters of elastic foundation, side-to-thickness ratio, aspect ratio and the inhomogeneity parameter on the critical buckling of FG sandwich plates are also investigated.

Effect of Intermetallic Compounds Growth Characteristics on the Shear Strength of Cu pillar/Sn-3.5Ag Microbump for a 3-D Stacked IC Package (3차원 칩 적층을 위한 Cu pillar/Sn-3.5Ag 미세범프 접합부의 금속간화합물 성장거동에 따른 전단강도 평가)

  • Kwak, Byung-Hyun;Jeong, Myeong-Hyeok;Park, Young-Bae
    • Korean Journal of Metals and Materials
    • /
    • v.50 no.10
    • /
    • pp.775-783
    • /
    • 2012
  • The effect of thermal annealing on the in-situ growth characteristics of intermetallics (IMCs) and the mechanical strength of Cu pillar/Sn-3.5Ag microbumps are systematically investigated. The $Cu_6Sn_5$ phase formed at the Cu/solder interface right after bonding and grew with increased annealing time, while the $Cu_3Sn$ phase formed at the $Cu/Cu_6Sn_5$ interface and grew with increased annealing time. IMC growth followed a linear relationship with the square root of the annealing time due to a diffusion-controlled mechanism. The shear strength measured by the die shear test monotonically increased with annealing time. It then changed the slope with further annealing, which correlated with the change in fracture modes from ductile to brittle at a critical transition time. This is ascribed not only to the increasing thickness of brittle IMCs but also to the decreasing thickness of the solder, as there exists a critical annealing time for a fracture mode transition in our thin solder-capped Cu pillar microbump structures.