• Transactions of the Korean Society of Mechanical Engineers A
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• v.23 no.6 s.165
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• pp.961-967
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• 1999

A model is constructed to evaluate the mode III stress intensity factor(SIF) for orthotropic three-layered material with a center crack subjected to uniform anti-plane shear loading. A mixed boundary value problem is formulated by Fourier integral transform method and a Fredholm integral equation of the second kind is derived. The integral equation is numerically analyzed to evaluate the effects of the ratio of shear modulus, strength of each layer and crack length to layer thickness on the stress intensity factor.

• Transactions of Materials Processing
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• v.12 no.1
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• pp.43-48
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• 2003

The strain state during the continuous confined strip shearing (CCSS) based on ECAP was tackled by means of a two-dimensional FEM analysis. The deformation of AA 1100 sheet in the CCSS apparatus was composed of three distinct processes of rolling, bending and shearing. The pronounced difference in the friction conditions on the upper and lower roll surfaces led to the different variation of the strain component ${epsilon}_13$ throughout the thickness of the aluminum sheet. Strain accompanying bending was negligible because of a large radius of curvature. The shear deformation was concentrated at the corner of the CCSSchannel where the abrupt change in the direction of material flow occurred. The process variables involving the CCSS-die design and frictions between tools and strip influenced the evolution of shear strains during CCSS.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.10
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• pp.2535-2542
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• 1993

Two-noded curved beam elements, CMLC (field-consistent membrane and linear curvature) and IMLC(field-inconsistent membrane and linear curvature) are developed on the basis of Timoshenko's beam theory and curvilinear coordinate. The curved beam element is developed by the separation of the radial deflection into the bending deflection. In the CMLC element, field-consistent axial strain interpolation is adapted for removing the membrane locking. The CMLC element shows the rapid and stable convergence on the wide range of curved beam radius to thickness. The field-consistent axial strain and the separation of radial deformation produces the most efficient linear element possible.

• Structural Engineering and Mechanics
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• v.68 no.2
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• pp.183-191
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• 2018

In this paper, harmonic responses of infilled multi-storey frames are obtained by using a single variable shear deformation theory (SVSDT) and dynamic stiffness formulations. Two different planar frame models are used which are fully infilled and soft storey. The infill walls are modeled by using equivalent diagonal strut approach. Firstly, free vibration analyses of bare frame and infilled frames are performed. The calculated natural frequencies are tabulated with finite element solution results. Then, harmonic response curves (HRCs) of frame models are plotted for different infill wall thickness values. All of the results are presented comparatively with Timoshenko beam theory results to reveal the effectiveness of SVSDT which considers the parabolic shear stress distribution along the frame member cross-sections.

• Steel and Composite Structures
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• v.27 no.5
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• pp.599-611
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• 2018

In this article a four unknown quasi-3D shear deformation theory for the bending analysis of functionally graded (FG) plates is developed. The advantage of this theory is that, in addition to introducing the thickness stretching impact (${\varepsilon}_z{\neq}0$), the displacement field is modeled with only four variables, which is even less than the first order shear deformation theory (FSDT). The principle of virtual work is utilized to determine the governing equations. The obtained numerical results from the proposed theory are compared with the CPT, FSDT, and other quasi-3D HSDTs.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.70-75
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• 2003

Spot welding is a process that sheet metals are joined in one or more spot by heating at the faying interface. In this process, the spatter is dispersed from melted area. It has been reported that spatter generation has adverse effects on weld quality. However, no systematic study has been carried out to find out its effect on weld quality in resistance spot welding processes. In this study, specially designed specimen are used to perform experimental investigation of spatter generation and its effect. Major finding of this study show trends in tensile-shear strength for various amounts of spatter generated during spot welding process. Thus, optimum welding conditions are proposed in view of spatter generation and tensile-shear strength. (Received December 11, 2002)

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.11
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• pp.2696-2704
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• 2000

This paper presents a new laminated plate theory for the cylindrical bending of laminated plated. The theory assumes that in plane displacements vary exponentially through plate thickness. Analytical solutions are derived for simply supported plates subjected to transverse loading. The accuracy of the present theory is examined for unsymmetric laminates, and the numerical results are compared with three-dimensional elasticity solutions of Pagano. The present theory predicts displacements and stresses for very thick plates very accurately. In particular, transverse shear stresses obtained form constitutive equations are predicted very accurately.

• Journal of Mechanical Science and Technology
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• v.17 no.2
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• pp.269-279
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• 2003

The anti-plane shear problem of bonded elastic materials containing a crack at an arbitrary angle to the graded interfacial zone is investigated in this paper The interfacial zone is modeled as a nonhomogeneous interlayer of finite thickness with the continuously varying shear modulus between the two dissimilar, homogeneous half-planes. Formulation of the crack problem is based upon the use of the Fourier integral transform method and the coordinate transformations of basic field variables. The resulting Cauchy-type singular integral equation is solved numerically to provide the values of mode 111 stress intensity factors. A comprehensive parametric study is then presented of the influence of crack obliquity on the stress intensity factors for different crack size and locations and for different material combinations, in conjunction with the material nonhomogeneity within the graded interfacial zone.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.1
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• pp.127-132
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• 2001

By the use of a similar numerical method as the forming limit strain by coating method of coated sheet metals is investigated, in which the FEM is applied and J2G(J2-Gotohs Corner Theory) is utilized as the plasticity constitutive equa-tion. Circular bonded sheet metals with dissimilar sheets on both surface planes are stretched in a plane -strain state, with various work-hardening exponent n-values and thicknesses of each layer. Processes of shear-band formation in such com-posite sheets are clearly illustrated. It is concluded that, it the bonded state, the higher limiting strain of one layer is reduced due to the lower limiting strain of the other layer and vice versa, and does not necessarily obey the rule of linear combination of the limiting strain of each layer weighed according thickness.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.498-504
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• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.