• Korean Journal of Metals and Materials
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• v.50 no.9
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• pp.629-636
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• 2012

Volume shrinkage behavior accompanying the cure of resin formulations might be a critical factor when assembly processes using polymer materials are considered. In this study, cure shrinkage behavior with respect to resin formulation type and heating method was measured on sandwich structure samples by a thermomechanical analyzer (TMA). Quartz, used as a cover material for the sandwich structure, indicated the coefficient of thermal expansion close to $0ppm/^{\circ}C$. When a dynamic heating mode was conducted, a squeeze-out region and a cross-linking region for each resin formulation could be separated clearly with overlapping differential scanning calorimeter results on the TMA results. In addition, a cure shrinkage dominant region and a thermal expansion dominant region in the cross-linking region were distinguished. Consequently, the degree of cure at the initiation of the thermal expansion dominant region was successfully measured. Measurement of all resin formulations indicated the thermal expansion behavior exceeded cure shrinkage before full cure.

• Composites Research
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• v.27 no.3
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• pp.90-95
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• 2014

Cure shrinkage during cure process of polymer matrix composites develope residual stress that cause some structural deformation, such as spring-in, spring-out and warpage. The carbon/epoxy prepreg used in this study is Hexply M21EV/34%/UD268NFS/IMA-12K supplied by Hexcel corp. Cure shrinkage and degree of cure measured by TMA(thermomechanical analyzer) and DSC(differential scanning calorimetry). Cure shrinkages are measured by TMA within a temperature range of $140{\sim}240^{\circ}C$ in a nitrogen atmosphere, and degree of cure determined by the heat of reaction using dynamic and isothermal DSC runs in argon atmosphere. As a result, the cure shrinkage is increased dramatically in a degree of cure range between 27~80%. the higher the cure temperature, the lower the degree of cure occurring to begin cure shrinkage.

• Journal of the Korean Wood Science and Technology
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• v.35 no.5
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• pp.76-86
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• 2007

This study was conducted to investigate the effects of formaldehyde to urea (F/U) mole ratio on thermomechanical curing of UF resin adhesives with different F/U mole ratios. Thermomechanical curing of these UF resin adhesives was characterized using parameters of dynamic mechanical analysis (DMA) such as the gel temperature, maximum storage modulus, and peak temperatures of storage and loss modulus. As the F/U mole ratio decreased, the gel temperature of UF resin adhesives increased. The maximum storage modulus as an indicator of the rigidity of UF resin adhesives decreased with decreasing F/U mole ratio. The peak temperature of tan $\delta$ increased with decreasing F/U mole ratio, indicating that the vitrification occurred faster for high F/U mole ratio of UF resin adhesives than for the one of lower F/U mole ratio. These results partially explained the reason why UF resin adhesives with lower F/U mole ratio resulted in relatively poor adhesion performance when they were applied.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.261-267
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• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).