• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.9
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• pp.1615-1620
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• 2010

A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.

• Progress in Superconductivity and Cryogenics
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• v.23 no.3
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• pp.55-59
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• 2021

A thermoelectric cooler (TEC) is promising as an alternative refrigeration technology for the sake of its inherent advantages; no-moving parts and refrigerant-free in its operation. Due to the compactness, reliability and excellence in temperature stability, TECs have been widely used for small cooling devices. In recent years, thermoelectric devices have been attractive technologies that not only serve the needs of cooling and heating applications but also meet the demand for energy by recycling waste heat. In this research paper, multistage TEC is proposed as a concept of demonstrating the idea of transient cooling technology. The key idea of transient cooling is to harnesses the thermal mass installed at the interfacial level of the stages. By storing heat temporally at the thermal mass, the multistage TEC can readily reach lower temperatures than that by a steady-state operation. The multistage TEC consists of four different sizes of thermoelectric modules and they are operated with an optimized current. Once the cold-part of the uppermost stage is reached at the no-load temperature, the current is successively supplied to the lower stages with a certain time interval; 25, 50 and 75 seconds. The results show the temperatures that can be ultimately reached at the cold-side of the lowermost stage are 197, 182 and 237 K, respectively. It can be concluded that the timing or total amount of the current fed to each thermoelectric module is the key parameter to determine the no-load temperature.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1459-1462
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• 2007

In general a thermoelectric cooler (TEC) consists of a series of P type and N type thermoelectric materials sandwiched between two wafers. When a DC current passes through these materials, three different effects take place; Peltier effect, Joule heating effect and heat transfer by conduction due to temperature difference between hot and cold plates. In this study we have developed a micro TEC using $Bi_2Te_3$ (N type) and $Bi_{0.5}Sb_{1.5}Te_3$ (P type) thin films. In order to improve that performance of a micro TEC, we made 10 um height TE legs using special PR only for lift-off. We measured COP (coefficient of performance) and temperature difference between hot and cold connectors with current.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.10
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• pp.2335-2340
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• 2012

The detector is an uncooled detector system that functions inside the thermoelectric cooler (TEC) equipped with features instead of the cooler. The function of the thermoelectric device to control the temperature of the detector based on a function of temperature to prevent degradation of image quality to perform the role, the latest technology trend by removing the thermoelectric device size, cost a lot of effort to reduce has been studied. In this paper, It would be proposed of the actual test result using real chamber environment of for the best TECless algorithm as to minimize the degradation of image quality and obtain the low price of the uncooled detector.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.640-645
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• 2007

An experimental apparatus to show the hot spot cooling of an IC chip using a thermoelectric cooler is developed. The spot heating in very small area is achieved by the applying CO$_2$ laser source and temperatures are measured using miniature thermocouples. The active effects of thermoelectric cooler on the hot spot cooling system such as rapid heat spreading in the chip and lowering the peak temperature around the hot spot region are investigated. The experimental results are simulated numerically using the TAS program, which the performance characteristics such as Seebeck coefficient, electrical resistance and thermal conductivity of the thermoelectric cooler are searched by trial and error. Good agreements are obtained between numerical and experimental results if the appropriate performance data of the thermoelectric cooler are given.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1999.04a
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• pp.24-24
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• 1999

This study addresses the effectiveness of TEC(Thermoelectric cooler) application for spacecraft thermal control. The required radiator area and power consumption characteristics of active thermal control using TEC are compared with the passive control at BOL and EOL through unsteady thermal analyses by calculating external heat fluxes. When the component operating temperature is low enough in TEC active control, the required radiator area can be smaller than the passive thermal control. TEC also needs less power consumption than the passive control under the condition that the temperature of cooling pars is low enough and/or the design temperature margin of the components is narrow enough.

• Korean Journal of Optics and Photonics
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• v.29 no.1
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• pp.28-31
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• 2018

In this paper, we have proposed and demonstrated a variable optical attenuator (VOA) incorporating a dual-fiber collimator and a bimetallic actuator. The optical attenuation between input and output single-mode fibers was tuned by tilting the angle of a reflection mirror fixed on the bimetal. The bimetal was heated or cooled by a thermoelectric cooler (TEC) and then moved the reflection mirror, due to bending and unreeling. The desired optical attenuation can be obtained through adjusting the electrical input into the TEC. The fabricated device showed 0.5 dB of insertion loss, 0.2 dB of maximum polarization-dependent loss, and 40 dB of dynamic range. The response time was measured to be about 5 s.

• Journal of Astronomy and Space Sciences
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• v.17 no.1
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• pp.53-66
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• 2000

We developed low light CCD imaging system using thermoelectric cooling method collaboration with a company to design a commercial model. It consists of Kodak KAF-0401E(768$\times$512 pixels) CCD chip, thermoelectric module manufactured by Thermotek. This TEC system can reach an operative temperature of $-25^{\circ}C$. We employed an Uniblitz VS25s shutter and it has capability a minimum exposure time 80ms. The system components are an interface card using a Korea Astronomy Observatory (hereafter KAO) ISA bus controller, image acquisition with AD9816 chip, that is 12bit video processor. The performance test with this imaging system showed good operation within the initial specification of our design. It shows a dark current less than 0.4e-/pixel/sec at a temperature of $-10^{\circ}C$, a linearity 99.9$\pm$0.1%, gain 4.24e-/adu, and system noise is 25.3e-(rms). For low temperature CCD operation, we designed a TEC, which uses a one-stage peltier module and forced air heat exchanger. This TEC imaging system enables accurate photometry($\pm$0.01mag) even though the CCD is not at 'conventional' cryogenic temperatures(140k). The system can be a useful instrument for any other imaging applications. Finally, with this system, we obtained several images of astronomical objects for system performance tests.

• Proceedings of the KIEE Conference
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• 2005.10b
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• pp.600-602
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• 2005

Recently image display devices have become large and high quality. To control the qualities of the component, measurements of the shape and thickness of a plate glass has been required. In order to measure the shape of the specular objects, Non-Contact Optical Sensor using Hologram laser unit was proposed. The sensor has a optical system that is composed of a Hologram laser and objective lens used for CD Player, and the sensor showed high performance for measuring the shape and thickness of transparent plates. In the sensor, the temperature of the sensor body is controlled by TEC(Thermoelectric Cooler). In this paper, we proposed the measuring method to make better performance of sensor using focus error signal of a hologram laser unit. It can measure the shape and the thickness of transparent objects with the s-type focus error signal which is generated by the sensor while it goes to the object.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.343-345
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• 2007

Temperature difference between two plates occurs when a current is passed though two semi-conductors that are connected each other at two junctions. The current drives a transfer of heat from one junction to the other. In this study, the thermoelectric module based on th "Peltier effect" was made by combing fullerene and polyaniline. Continuous temperature measurements on both surfaces were performed at room temperature($25.4^{\circ}C$) by an infrared non-contact thermometer. The results showed that cool ing effect of $2.2^{\circ}C$ was attained by 30 seconds, after which the effect was continuously vanished mainly due to electro decomposition.