• 한국재료학회지
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• 제10권3호
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• pp.184-190
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• 2000

비전도성 충진재를 포함한 개선된 이방성 전도 접착제의 열적/기계적 특성과 이를 이용한 유기 기판용 플립 칩의 신뢰성에 미치는 충진재 양의 영향을 고찰하였다. 비전도성 충진재 양이 다른 개선된 이방성 접착제의 특성을 살펴보기 위해 differential scanning calorimeter (DSC), thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermo-mechanical analyzer (TMA)을 사용하였다. 비전도성 충진재의 양이 증가함에 따라 열팽창계수는 감소하였고, 상온에서의 storage modulus는 증가하였다. 추가로, 충진재의 양이 증가하면 DSC에 의한 유리전이온도와 TMA에 의한 유리전이온도도 증가하였다. 그러나 TGA 거동은 거의 변화가 없었다. 이방성 전도 접착제를 사용한 유기 기판 플립 칩의 신뢰성 테스트를 위해 열주기 시험, 고온고습 시험, 고온건조 시험을 수행하였는데, 주로 열주기 시험에서 이방서 전도 접착제의 열팽창계수의 영향이 컸다. 비전도성 충진재를 포함해서 낮은 열팽창계수와 높은 storage modulus를 갖는 이방성 전도 접착제에 의해 부착된 플립 칩의 신뢰성이 비전도성 충진재를 포함하지 않은 이방성 전도 접착제에 의한 플립 칩의 신뢰성보다 더 좋게 나타났다.

• 한국방사성폐기물학회:학술대회논문집
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• 한국방사성폐기물학회 2004년도 학술논문집
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• pp.105-114
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• 2004

This study investigated the thermal behavior of the nuclear graphite waste generated from the decommissioning of the Korean nuclear research reactor, The first part study investigated the decomposition rate of the nuclear graphite waste up to $1000^{\circ}C$ under various oxygen partial pressures using a thermo-gravimetric analyzer (TGA). Tested graphite waste sample not easily destroyed in the oxygen-deficient condition. However, the gas-solid oxidation reaction was found to be very effective in the presence of oxygen. No significant amount of the product of incomplete combustion was formed even in the limited oxygen concentration of 4% $O_2$. The influence of temperature and oxygen partial pressure was evaluated by the theoretical model analysis of the thermo-gravimetric data. The activation energy and the reaction order of graphite oxidation were evaluated as 128 kJ/mole and 1.1, respectively. The second part of this study investigated the behavior of radioactive elements under graphite oxidation atmosphere using thermodynamic equilibrium model. $^{22}Na$, $^{134}Cs$ and $^{137}Cs$ were found be the semi-volatile elements. Since volatile uranium species can be formulated at high temperatures above $1050^{\circ}C$, the temperature of incinerator furnace should be minimized. Other corrosion/activation products, fission products and uranium were found to be the non-volatile species.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2011년도 제36회 춘계학술대회논문집
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• pp.421-424
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• 2011

본 연구에서는 열분석법을 이용하여 혼합 액체연료의 수치해석에 필요한 여러 가지 인자를 측정하였다. 이러한 열분석법에는 열중량 분석방법(TGA, Thermo-Gravimetric Analyzer)과 시차 주사열량 측정법(DSC, Differential Scanning Calorimetry)이 있다. 열중량 분석방법을 통한 비등온 실험(non-isothermal experimental) 결과를 토대로 Freeman Carroll의 수학적인 후처리 방법을 이용하여 미지의 액체연료의 구성 성분에 대한 동역학적 변수인 활성화 온도와 반응차수로 각각 6128.2 K와 1.4를 얻었다. 그 외 다양한 수학적 처리 방법에 따른 동역학적 변수의 값을 구해보았고, 계산 결과는 처리방법에 따라 약간의 차이를 보였다.

• 한국수소및신에너지학회논문집
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• 제19권4호
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• pp.305-312
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• 2008

ZnO/Zn redox cycle is the one of the promising thermochemical cycles for hydrogen production via water splitting with high temperature heat source like a concentrated solar energy. This paper reports the particle size effect of Zinc on water splitting behavior. Water splitting reaction experiments were carried out at isothermal conditions of 350 and 400$^{\circ}C$ in TGA (Thermo Gravimetric Analyzer) using four commercial Zinc powders (nano, <10 ${\mu}m$, <150 ${\mu}m$ and $150{\sim}600\;{\mu}m$ particle sizes). Before the experiments, average particle size of Zinc powders was analyzed by PSA (Particle Size Analysis). After the experiments, XRD (X-Ray Diffraction) and SEM (Scanning Electron Microscope) analyses were conducted on the samples. The experimental results showed that particle size had a effect on the conversion of Zinc to ZnO. Zinc conversion was increased, as the particle size decreased. Especially, the nano size particles were aggregated and the particle's morphology changed on the surface during hydrolysis reaction.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 한국연소학회지
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• 제15권2호
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• pp.34-40
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• 2010

The effect of co-firing with pulverized coal and wood biomass on ignition and burn-out temperature was investigated at air and oxy-fuel conditions by thermo gravimetric analyzer(TGA). Three kinds of coal(shenhua, adaro, wira) were selected and mixing ratios of coal and wood biomass was set to 1, 0.5, and 0.8. The ignition temperature depended on the amount of volatile matter of blended fuel, while the burn-out temperature was dominated by the oxidant ingredients. The oxy-fuel condition with an oxygen ratio(Ofr,o) of 0.3 showed similar tendency with air condition in the heat flow measurement. Volatile matter reaction, however, became dominant when oxygen ratio exceeded 0.8 for co-firing combustion of wood biomass and pulverized coal.

• 폴리머
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• 제36권3호
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• pp.275-280
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• 2012

Pyromellitic dianhydride(PMDA), 3,3'-4,4'-benzopenonetetracarboxylic dianhydride(BPDA) 그리고 $p$-phenylenediamine($p$-PDA)와 함께 1,4-bis(4-aminophenoxy)benzene(1,4-APB)와 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane(HFBAPP)를 각각 이용하여 폴리아믹산을 합성하였고, 이를 열적 이미드화 공정을 통하여 폴리이미드 필름을 제조하였다. 제조된 필름은 퓨리에 변환 적외선 분광기(FTIR), 열 중량 분석기(TGA), 열 기계 분석기(TMA), 동 역학적 거동 분석기(DMA), 그리고 만능 인장 시험기(UTM) 등을 이용하여 화학 구조 및 열적 기계적 특성을 조사하였다. 1,4-APB와 HFBAPP의 조성이 증가함에 따라 열적 기계적 물성과 흡습률이 낮아지는 경향을 나타내었고, 동박과 비슷한 열팽창계수(CTE)를 가진 폴리이미드 필름의 경우 HFBAPP를 이용한 필름이 1,4-APB를 이용한 필름보다 향상된 열적 특성과 낮은 흡습률 결과를 나타내었다. 이와 같이 본 연구에서 합성된 폴리이미드 필름은 유연성 회로 기판의 flexible copper clad laminates(FCCL)를 위한 기본 필름으로 적용할 수 있을 것으로 판단된다.

• ETRI Journal
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• 제26권3호
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• pp.252-256
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• 2004

We formed silver nanocrystallites by the thermal decomposition of a $Ag^{+1}$-oleate complex, which was prepared by a reaction with $AgNO_{3}$ and sodium oleate in a water solution. The resulting monodispersed silver nanocrystallites were produced by controlling the temperature (290$^{\circ}$C). Transmission electron microscopic (TEM) images of the particles showed a 2-dimensional assembly of the particles with a diameter of $9.5{\pm}0.7nm$, demonstrating the uniformity of these nanocrystallites. An energy-dispersive X-ray (EDX) spectrum and X-ray diffraction (XRD) peaks of the nanocrystallites showed the highly crystalline nature of the silver structure. We analyzed the decomposition of the $Ag^{+1}$-oleate complex using a Thermo Gravimetric Analyzer (TGA) and observed the crystallization process using XRD.

• 멤브레인
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• 제22권2호
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• pp.104-112
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• 2012

Chemically stable Polyvinylidene fluoride-hexa-fluoropropane (PVDF-HFP) copolymer asymmetric membranes were prepared by the conventional phase inversion process, using Dimethyacetamide (DMAc) as a solvent and water as a non-solvent. To control the pore size and porosity of the PVDF-HFP membranes, tetra-ethoxysilane (TEOS) was used as a pore-forming agent. The prepared membranes were characterized, using several analytical methods such as Fourier Transform Infrared spectroscopy (FTIR), Thermo-gravimetric analyzer (TGA), Field Emission Scanning Electronic Microscopy (FESEM). TEOS turned out to increase porosity and make homogeneous pores on the membranes. Depending on the composition of the dope solutions, the pore size was ranged from 0.1 to 1.0 ${\mu}m$. The flux of the PVDF-HFP membranes prepared by using TEOS as a pore forming agent was increased substantially without much decrease in the rejection. When 15 wt% PVDF-HFP solution was blended with 13 wt% TEOS solution at composition ratio of 70/30 in wt%, the water flux at 2 bars was about 2 $m^3/m^2day$.