• Korean Journal of Materials Research
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• v.10 no.3
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• pp.184-190
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• 2000

We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2004.06a
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• pp.105-114
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• 2004

This study investigated the thermal behavior of the nuclear graphite waste generated from the decommissioning of the Korean nuclear research reactor, The first part study investigated the decomposition rate of the nuclear graphite waste up to $1000^{\circ}C$ under various oxygen partial pressures using a thermo-gravimetric analyzer (TGA). Tested graphite waste sample not easily destroyed in the oxygen-deficient condition. However, the gas-solid oxidation reaction was found to be very effective in the presence of oxygen. No significant amount of the product of incomplete combustion was formed even in the limited oxygen concentration of 4% $O_2$. The influence of temperature and oxygen partial pressure was evaluated by the theoretical model analysis of the thermo-gravimetric data. The activation energy and the reaction order of graphite oxidation were evaluated as 128 kJ/mole and 1.1, respectively. The second part of this study investigated the behavior of radioactive elements under graphite oxidation atmosphere using thermodynamic equilibrium model. $^{22}Na$, $^{134}Cs$ and $^{137}Cs$ were found be the semi-volatile elements. Since volatile uranium species can be formulated at high temperatures above $1050^{\circ}C$, the temperature of incinerator furnace should be minimized. Other corrosion/activation products, fission products and uranium were found to be the non-volatile species.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.04a
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• pp.421-424
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• 2011

Thermal Analyses are conducted to measure various factors of a liquid fuel required for numerical analysis. Thermal Analyses are divided into two different methods of TGA (Thermo Gravimetric Analysis) and DSC (Differential Scanning Calorimetry). Non-isothermal experimental results are analyzed using by TGA. The results are filtered by a Freeman Carroll method. At the same time, chemical parameters of unknown liquid fuel, activation temperature and reaction order are measured to 6128.2 K and 1.4, respectively. Furthermore, the parameters can be obtained by various mathematical methods. It is found that tha parameters depend on the processing method.

• Transactions of the Korean hydrogen and new energy society
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• v.19 no.4
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• pp.305-312
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• 2008

ZnO/Zn redox cycle is the one of the promising thermochemical cycles for hydrogen production via water splitting with high temperature heat source like a concentrated solar energy. This paper reports the particle size effect of Zinc on water splitting behavior. Water splitting reaction experiments were carried out at isothermal conditions of 350 and 400$^{\circ}C$ in TGA (Thermo Gravimetric Analyzer) using four commercial Zinc powders (nano, <10 ${\mu}m$, <150 ${\mu}m$ and $150{\sim}600\;{\mu}m$ particle sizes). Before the experiments, average particle size of Zinc powders was analyzed by PSA (Particle Size Analysis). After the experiments, XRD (X-Ray Diffraction) and SEM (Scanning Electron Microscope) analyses were conducted on the samples. The experimental results showed that particle size had a effect on the conversion of Zinc to ZnO. Zinc conversion was increased, as the particle size decreased. Especially, the nano size particles were aggregated and the particle's morphology changed on the surface during hydrolysis reaction.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Journal of the Korean Society of Combustion
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• v.15 no.2
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• pp.34-40
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• 2010

The effect of co-firing with pulverized coal and wood biomass on ignition and burn-out temperature was investigated at air and oxy-fuel conditions by thermo gravimetric analyzer(TGA). Three kinds of coal(shenhua, adaro, wira) were selected and mixing ratios of coal and wood biomass was set to 1, 0.5, and 0.8. The ignition temperature depended on the amount of volatile matter of blended fuel, while the burn-out temperature was dominated by the oxidant ingredients. The oxy-fuel condition with an oxygen ratio(Ofr,o) of 0.3 showed similar tendency with air condition in the heat flow measurement. Volatile matter reaction, however, became dominant when oxygen ratio exceeded 0.8 for co-firing combustion of wood biomass and pulverized coal.

• Polymer(Korea)
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• v.36 no.3
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• pp.275-280
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• 2012

Poly(amic acid)s were successfully synthesized from 1,4-bis(4-aminophenoxy)benzene (1,4-APB) or 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP) with pyromellitic dianhydride (PMDA), 3,3'-4,4'-benzopenonetetracarboxylic dianhydride (BPDA) and $p$-phenylenediamine ($p$-PDA) and then they were effectively converted into polyimide films by thermal imidization. The chemical structure and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FTIR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer, dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The moisture absorption, thermal and mechanical properties of polyimide films decreased with increasing the amount of 1,4-APB and HFBAPP. The polyimide films using HFBAPP showed lower properties than that of 1,4-APB at the same ratio, but it displayed better thermal properties and lower moisture absorption at the similar coefficient of thermal expansion (CTE) with a copper. On the basis of our finding, it is concluded that 4-component polyimide films could be utilized for base films for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

• ETRI Journal
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• v.26 no.3
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• pp.252-256
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• 2004

We formed silver nanocrystallites by the thermal decomposition of a $Ag^{+1}$-oleate complex, which was prepared by a reaction with $AgNO_{3}$ and sodium oleate in a water solution. The resulting monodispersed silver nanocrystallites were produced by controlling the temperature (290$^{\circ}$C). Transmission electron microscopic (TEM) images of the particles showed a 2-dimensional assembly of the particles with a diameter of $9.5{\pm}0.7nm$, demonstrating the uniformity of these nanocrystallites. An energy-dispersive X-ray (EDX) spectrum and X-ray diffraction (XRD) peaks of the nanocrystallites showed the highly crystalline nature of the silver structure. We analyzed the decomposition of the $Ag^{+1}$-oleate complex using a Thermo Gravimetric Analyzer (TGA) and observed the crystallization process using XRD.

• Membrane Journal
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• v.22 no.2
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• pp.104-112
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• 2012

Chemically stable Polyvinylidene fluoride-hexa-fluoropropane (PVDF-HFP) copolymer asymmetric membranes were prepared by the conventional phase inversion process, using Dimethyacetamide (DMAc) as a solvent and water as a non-solvent. To control the pore size and porosity of the PVDF-HFP membranes, tetra-ethoxysilane (TEOS) was used as a pore-forming agent. The prepared membranes were characterized, using several analytical methods such as Fourier Transform Infrared spectroscopy (FTIR), Thermo-gravimetric analyzer (TGA), Field Emission Scanning Electronic Microscopy (FESEM). TEOS turned out to increase porosity and make homogeneous pores on the membranes. Depending on the composition of the dope solutions, the pore size was ranged from 0.1 to 1.0 ${\mu}m$. The flux of the PVDF-HFP membranes prepared by using TEOS as a pore forming agent was increased substantially without much decrease in the rejection. When 15 wt% PVDF-HFP solution was blended with 13 wt% TEOS solution at composition ratio of 70/30 in wt%, the water flux at 2 bars was about 2 $m^3/m^2day$.