• 한국정밀공학회지
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• 제18권4호
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• pp.129-134
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• 2001

It is essential to predict the welding deformation at assembly stage, to increase productivity through mechanization and automation effectively. A practical analysis method appled for production engineering was proposed to simulate the deformation of arc welding, with an analytical model using finite element method solving thermal-elastic-plastic behavior. In this research, for accurate assembling, 3-D thermal-elastic-plastic finite element model is used to simulate the out-of-plane deformation caused by arc welding. Efforts have been made to find out the efficient method to improve the reliability and accuracy of the numerical calculation. Each of theories of small and large deformation is applied in solving 3-D thermal-elastic-plastic problem to compare with their efficiency about calculation imes and solution accuracy. When solid elements are used in a bending problem of a plate, phenomenon that the predictive deformation is more than that of actual survey is observed. To prevent this phenomenon, reduced integration method for element is employed instead of full integration that is generally used in 3-D thermal-elastic-plastic analysis.

• Journal of Welding and Joining
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• 제21권3호
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• pp.68-77
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• 2003

It is important to understand the characteristics of material strength and fracture under the dynamic loading like as earthquakes to assure the integrity of welded structures. The characteristics of dynamic strength and fracture in structural steels and their welded joints should be evaluated based on the effects of the strain rate and the service temperature. It is difficult to predict or measure temperature rise history with the corresponding stress-strain behavior. In particular, material behaviors beyond the uniform elongation can not be precisely evaluated, though the behavior at large strain region after the maximum loading point is much important for the evaluation of fracture. In this paper, the coupling phenomena of temperature and stress-strain fields under the dynamic loading was simulated by using the finite element method. The modified rate-temperature parameter was defined by accounting for the effect of temperature rise under the dynamic deformation, and it was applied to the fully-coupled analysis between heat conduction and thermal elastic-plastic behavior. Temperature rise and stress-strain behavior including complicated phenomena were studies after the maximum loading point in structural steels and their undermatched joints and compared with the measured values.

• Journal of Welding and Joining
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• 제17권5호
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• pp.77-82
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• 1999

Resistance spot welding process is completed in very short time and there are many factors affecting on the generation of heat. It is difficult to control these experimental factors and monitor distribution of the temperature and stresses in the experimental analysis case. and too much time and expense are required for the experimental trials to fine proper welding condition. So numerical analyses have been attempted steadily, but most numerical analyses on the resistance spot welding are mainly focused on thermal behavior. Therefore, in this paper, the numerical analysis of mechanical behavior as well as heat conduction is carried out for the spot welding process. For this numerical analysis, axial symmetric computer program for the spot welding analysis by F.E.M. has been developed considering heat conduction and thermal elastic-plastic theory. Material properties depending on temperature such as density, heat conductivity, heat expansion coefficient, specific heat, yield stress, elastic modulus, and specific resistance are considered. Using the results of temperature distribution obtained from heat conduction analysis, the thermal elastic-plastic analysis is carried out to clarify mechanical behavior of spot welded specimen. In order to evaluate the effect of residual stresses, numerical analyses are carried out under tension-shear load in two cases respectively; one with residual stress, the other without residual stresses.

• 한국정밀공학회지
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• 제15권1호
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

• 대한기계학회논문집A
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• 제25권7호
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• pp.1139-1146
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• 2001

The reactor pressure vessel(RPV) is usually cladded with stainless steel to prevent corrosion and radiation embrittlement, and a number of subclad cracks have been found during an in-service-inspection. These subclad cracks should be assured for a safe operation under normal conditions and faulted conditions such as pressurized thermal shock(PTS). Currently available integrity assessment procedure for an RPV, ASME Code Sec. XI, are built on the basis of linear fracture mechanics (LEFM). In PTS condition, however, thermal stress and mechanical stress give rise to high tensile stress at the cladding and elastic-plastic behavior is expected in this area. Therfore, ASME Code Sec. XI is overly conservative in assessing the structural integrity under PTS condition. In this paper, the fracture parameter (stress intensity factor, K, and RT(sub)NDT) from elastic analysis using ASME Sec. XI and finite element method were validated against 3-D elastic-plastic finite element analyses. The difference between elastic and elastic-plastic analysis became significant with increasing crack depth. Therfore, it is recommended to perform elastic-plastic analysis for the accurate assessment of subclad cracks under TPS which causes plastic deformation at the cladding.

• 대한기계학회논문집A
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• 제26권1호
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• pp.39-47
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• 2002

Performed here is an assessment study for deterministic fracture mechanics analysis of a pressurized thermal shock(PTS). The PTS event means an event or transient in pressurized water reactors(PWRs) causing severe overcooling(thermal shock) concurrent with or followed by significant pressure in the reactor vessel. The problems consisting of two transients and 10 cracks are solved and maximum stress intensity factors and maximum allowable nil-ductility reference temperatures are calculated. Their results are compared each other to address the general characteristics between transients, crack types and analysis methods. The effects of elastic-plastic material behavior and clad coating on the inner surface are explored.

• Structural Engineering and Mechanics
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• 제47권6호
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• pp.839-856
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• 2013

Metallic annular discs with their outer boundary fully constrained are studied with newly derived semi-analytical solutions for the effects of thickness variations under thermal loading and unloading. The plane stress and axisymmetric assumptions were adopted, and the thickness of the disk depends on the radius hyperbolically with an exponent n. Furthermore, it is assumed that the stress state is two dimensional and temperature is uniform in the domain. The solutions include the elastic, elastic-plastic and plastic-collapse behavior, depending on the values of temperature. The von Mises type yield criterion is adopted in this work. The material properties, Young's modulus, yield stress and thermal expansion coefficient, are assumed temperature dependent, while the Poisson's ratio is assumed to be temperature independent. It is found that for any n values, if the normalized hole radius a greater than 0.6, the normalized temperature difference between the elastically reversible temperature and plastic collapse temperature is a monotonically decreasing function of inner radius. For small holes, the n values have strong effects on the normalized temperature difference. Furthermore, it is shown that thickness variations may have stronger effects on the strain distributions when temperature-dependent material properties are considered.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.732-734
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• 1998

Metal thin films such as aluminum have been used as interconnects in semiconductor device. Recently, these materials are applied to structural materials in microsensors and microactuators. In this study, we evaluate deformation and strength behavior of aluminum alloy film. Three layer model for thermal deformation of multilayered thin film material is introduced and applied to Si/Al(1%Si)/$SiO_2$ system. Based on beam bending theory and concept of bending strain. elastic and elastic/plastic thermal deformation behaviors of multilayered materials can be estimated. In the case of plastic deformation of ductile layer, strain rate equations based on deformation mechanism map are employed for describe the stress relaxation effect. To experimentally examine deformation of multilayered thin film materials, in-situ laser scanning method is used to measure curvature of specimens during heating and cooling. The thickness of $SiO_2$ layer is varied to estimate third-layer effect of thermal deformation of metal films, and its effect on deformation behavior are discussed.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2002년도 춘계학술강연 및 발표대회
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• pp.11-11
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• 2002

Plastic deformation was observed by TEM around the intragranular SiC particles in the $Al_2O_3$ matrix for $Al_2O_3/SiC$ nanocomposite system. The dislocations are generated at selected planes and there is a tendency for the dislocations to form a subgrain boundary structure with low-angel grain boundaries and networks. In this study, dislocation generated in the $Al_2O_3$ matrix during cooling down from sintering temperatures by the highly localized thermal stresses within and/or around SiC particles caused from the thermal expansion mismatch between $Al_2O_3$ matrix and SiC particle was observed. In monolithic $Al_2O_3$ and $Al_2O_3/SiC$ microcomposite system. These phenomena is closely related to the plastic relaxation of the elastic stress and strain energy associated with both thermal misfitting inclusions and creep behaviors. The plastic relaxation behavior was explained by combination of yield stress and internal stress.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.908-913
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• 2000

In the process of integrity evaluation for nuclear power plant components, a series of fracture mechanics evaluation on surface cracks in reactor pressure vessel(RPV) must be conducted. These fracture mechanics evaluations are based on stress intensity factor, K. However, under pressurized thermal shock(PTS) conditions, the combination of thermal and mechanical stress by steep temperature gradient and internal pressure causes considerably high tensile stress at the inside of RPV wall. Besides, the internal pressure during the normal operation produces high tensile stress at the RPV wall. As a result cracks on inner surface of RPVs may experience elastic-plastic behavior which can be explained with J-integral. In such a case, however, J-integral may possibly lose its validity due to constraint effect. In this paper, in order to verify the suitability of J-integral, two dimensional finite element analyses were applied for various surface crack. Total of 18 crack geometries were analyzed, and Q stresses were obtained by comparing resulting HRR stress distribution with corresponding actual stress distributions. In conclusion, HRR stress fields were found to overestimate the actual crack-tin stress field due to constraint effect.