• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.4
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• pp.153-160
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• 2001

In order to analyze the degradation process of epoxy/glass fiber for outdoor condition, FRP laminate was exposed to high temperature. Then, the degradation process was evaluated by comparing contact angle, surface potential, surface resistivity, and XPS. The experimental results showed that the amount of weight loss, contact angle, surface potential and surface resistivity increased up to 200 $^{\circ}C$ as a function of temperature. These phenomena show the existence of hydrophobic surface. With the change to the hydrophobic surface and the electrical potential and resistivity on FRP surface increased. In XPS to analyze surface chemical structures, the increased hydrophobicity in thermal increase of unsaturated double bond in carbon chains. Aslo, thermal treatment caused the discoloration on the point of treated surface. These phenomena were attributed to the generations of ether group.

• Polymer(Korea)
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• v.24 no.3
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• pp.314-325
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• 2000

Thermal degradation of thermoplasitc polyurethane modified polycarbonate has been investigated by means of DSC, GPC and FT-IR techniques. The polyurethanes used in this study are TPU-35 and TPU-53 containing 35.5 and 53.4 wt% of hard segments, respectively. The more content of hard segment, the higher the glass transition temperature (T$_{g}$) of TPU was observed. On the other hand, the T$_{g}$ of the TPU modified PC decreased with the content of TPU and the annealing temperature regardless of the hard segment contents. The latter behavior nay arise from the thermal degradation of TPU upon annealing process: the observed thermal degradation temperatures were at 240 and 25$0^{\circ}C$ for the PC/TPU-35 and PC/TPU-53, respectively. The molecular weight, molecular weight distribution and viscosity agree well with the DSC measurement, which implicates a thermal degradation of TPU. In addition, thermal stability of the TPU modified PC linearly decreased with an incorporation of TPU. Transesterification or any interaction was not observed using FT-IR: the evidence was no frequency shift or any variance betwere the carbonyl stretching and NH group. For the specimens prepared below the degradation temperature, the enhancement of the thickness dependent impact strength of the PC/TPU blend was observed, and the morphology of the two blends was compared.d.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2003.10a
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• pp.116-121
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• 2003

In this study, the thermal degradation process has been investigated at various reaction temperature$(350{\sim}400^{\circ}C)$ and times$(30{\sim}120\;min)$ in order to recycle waste plastic films as solid state wax. Waste plastic films were easily melted by adding a small amount of waxes. The effects of wax addition and nitrogen flow rate on their thermal degradation properties were investigated. FT-IR, GPC and viscometer were used to analyze properties of the solid wax including the structure, molicular weight distribution and melt viscosity. The average molecular weight of solid wax was decreased with increasing the reaction time, temperature and amount of wax added, Also, the viscosity of solid wax decreased with increasing the stirring speed at a constant reaction temperature and time, and its viscosity got close to zero above $390^{\circ}C$.

• Journal of Hydrogen and New Energy
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• v.27 no.5
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• pp.562-570
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• 2016

At the carbon dioxide capture process using the aqueous amine solution, degradation of absorbents is main factor to reducing the process performance. Also, degradation mechanism of absorbent is important for understanding the environmental risk, route of degradation products, health risk etc. In this study, the degradation products of MEA were studied to clarify mechanism in thermal degradation process. The degradation products were analyzed using a $^1H$ NMR (nuclear magnetic resonance) and $^{13}C$ NMR. The analysis methods used in this study provide guidelines that could be used to develop a degradation inhibitor of absorbent and a corrosion inhibitor.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.21 no.10
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• pp.82-88
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• 2007

This paper presents the thermal and electrical characteristics of ZnO arrester blocks under the AC voltages. The leakage currents of ZnO arrester blocks were measured as a function of the time. The temperature distributions of ZnO arrester blocks were observed by the thermal image infrared camera. The degradation and thermal runaway of ZnO arrester blocks were closely related to the temperature limit of ZnO arrester blocks which being decided heat generation and dissipation. The temperature and leakage current of ZnO arrester blocks were sensitively changed in a resistance of ZnO arrester blocks. As a result, the degradation and thermal runaway of ZnO arrester blocks depend on the temperature and leakage current of ZnO arrester blocks.

• KEPCO Journal on Electric Power and Energy
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• v.2 no.2
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• pp.273-278
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• 2016

In order to evaluate the lifespan of high-temperature parts with thermal barrier coating in gas turbines used for power generation, this study was performed on an 80 MW-class gas turbine exceeding 24 k equivalent operating hours. Degradation characteristics were evaluated by analyzing the YSZ (Yttria Stabilized Zirconia) top coat, which serves as the thermal barrier coating layer, the NiCrAlY bond coat, and interface layers. Microstructural analysis of the top, middle, and bottom sections showed that Thermal Growth Oxide (TGO) growth, Cr precipitate growth within the bond coat layer, and formation of diffusion layer occur actively in high-temperature sections. These microstructural changes were consistent with damaged areas of the thermal barrier coating layer observed at the surface of the used blade. The distribution of Cr precipitates within the bond coat layer, in addition to the thickness of TGO, is regarded as a key indicator in the evaluation of degradation characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• Applied Biological Chemistry
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• v.40 no.6
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• pp.519-524
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• 1997

As an investigation for utilization of ascidian tunic carotenoids as a food color additives, we attempted to collect the volatile thermal degradation compounds from ascidian tunic carotenoids. Oxygenate volatile compounds were extracted by simultaneous distillation and extraction/concentration apparatus and analyzed by gas chromatography and mass spectrometery. Total 63 compounds were identified and some of them were caused by thermal degradation. They included 1,3,5-trimethylbenzene, 3,5,5-trimethyl-3-cyclohexen-1-ol, 3,5,5-trimethyl-3-cyclohexen-1-one, 1,1,2,3-tetramethyl-2-cyclohexen-5-ol, 1,1,2,3-tetramethyl-2-cyclohexen-5-one, 2,3,4,4-tetramethyl-6-hydroxy-2-cyclohexene-1-one, 1,2,3,8-tetrahydro-3,3,6-trimethyl-1-naphtol, dihydroacetinidolide, ${\beta}-ionone$, 2-(1,1,5-trimethyl-3-hydroxy-5-cyclohexen-6-yl)-1-tolylethene, 2,6-dimethyl-8-(1,1,5-trimethyl-3-hydroxy-5-cyclohexen-6-yl)-1,3,5-octatriene-7-yne. Proposed mechanism of formation of some compounds as thermal degradation products of ascidian tunic carotenoids are provided.

• Preventive Nutrition and Food Science
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• v.12 no.3
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• pp.131-134
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• 2007

The kinetic analyses for thermal products of alpha-, gamma- and delta-tocopherols during heating as functions of temperature and time were studied. Alpha-, gamma- and delta-tocopherols dissolved in glycerol were heated at $100{\sim}200^{\circ}C$ for $5{\sim}60$ min. The thermal products were separated by hexane extraction and analyzed by HPLC using a reversed phase ${\mu}-Bondapak$ $C_{18}-column$ with two kinds of elution solvents in a gradient mode. The formation kinetics of thermal products of tocopherols followed a first-order kinetic model. The formation rate of thermal products of tocopherols was dependent on heating temperatures and heating times. The activation energy and enthalpy for the thermal products of ${\gamma}-and$ ${\delta}-tocopherols$ were higher than those for ${\alpha}-tocopherol$ as in the case of the oxidative degradation kinetics of tocopherol. The magnitude order of the activation energy was ${\gamma}->{\delta}->{\alpha}-tocopherol$.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.22.2-22.2
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• 2011

Reliability and degradation mechanism of conventional phosphor-converted white GaN-based light-emitting diodes (LEDs) were investigated. Under electro-thermal stress condition, the optical output degraded rapidly at the initial stress time accompanied by the change of chromatic properties. This could be attributed to the optical degradation of packaged materials, in particular, the browning of encapsulants and the darkening of reflective packages. At longer stress times, the optical output gradually decreased according to the degree of the reverse leakage currents, namely, the generation ofnonradiative recombination defects. This indicates that the optical degradation of white LEDs are dominated by the darkening of packaged materials and the generation of defects depending on the injection current and ambient temperatures. Using analyses of electroluminescence spectra, optical microscopy, electrical, optical, and thermal properties, optical degradations of white LEDs are discussed.