• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.220-223
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• 1996

Mechanical properties of Plasma-Enhanced Chemical Vapor Deposited (PECVD) silicon nitride thin film was studied to determine the feasibility of the film as a passivation layer over the aluminum bonding areas of integrated circuit chips. Ultimate strain of the films in thicknesses of about 5 k${\AA}$ was measured using four-point bending method. The ultimate strain of these films was constant at about 0.2% regardless of residual stress. Intrinsic and residual stresses of these films were measured and compared with thermal shock and cycling test results. Comparison of the results showed that more tensile films were more susceptible to crack- induced failure.

• Journal of Electrochemical Science and Technology
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• 제7권4호
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• pp.263-268
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• 2016

This study describes the effect of coating the $Li[Ni_{0.8}Co_{0.15}Al_{0.05}]O_2$ cathode surface with a homogeneous carbon layer produced by carbonization of polyvinylidene fluoride (PVDF) as a novel organic source. The phase integrity of the above cathode was not affected by the carbon coating, whereas its rate capability and cycling performance were enhanced. Similarly, the cathode thermal stability was also improved after coating, which additionally protected the cathode surface against the reactive electrolyte containing hydrofluoric acid (HF). The results show that coating the $Li[Ni_{0.8}Co_{0.15}Al_{0.05}]O_2$ cathode with carbon using the PVDF precursor is an effective approach to enhance its electrochemical properties.

• 한국수소및신에너지학회논문집
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• 제16권4호
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• pp.386-390
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• 2005

Al film(135.5 nm thick) with Pd film(39.6 nm thick) on the top of it was made by thermal evaporation method. Electrical resistance change due to hydrogen absorption and desorption was measured by four point measurement method. The sample was activated by hydrogen absorption and desorption cycling at room temp. Hydrogen was introduced into the film by increasing hydrogen gas pressure step by step up to 640 torr at room temp. The resistance change ratio was decreased to 12 % with increasing hydrogen pressure in contrast to normal metal behavior. This strange tendency was not understood yet. Further study is needed to find out the mechanism of hydrogen absorption in Al in Al/Pd film.

• 전기학회논문지
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• 제62권6호
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• pp.881-885
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• 2013

In this paper, we present a deterioration judgment model of urban rail power equipment using driving history, the frequency and number of failures. In addition, we have developed a deterioration judgment program based on the derived failure rate. A deterioration judgment model of power equipments on metro system was designed to establish how much environmental factors, such as thermal cycling, humidity, overvoltage and partial discharge. The deterioration rate of the transformers followed the Arrhenius log life versus reciprocal Kelvin temperature (hotspot temperature) relation. The deterioration judgment program is linked to the online condition monitoring system of urban railway system. The deterioration judgment program is based on the user interface it is possible to apply immediately to the urban rail power equipment.

• 한국수소및신에너지학회논문집
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• 제17권2호
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• pp.234-240
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• 2006

Al film(135.5 nm thick) with Pd film(39.6 nm thick) on the top of it was made by thermal evaporation method. Hydrogen absorption of Al/Pd film was measured by quartz crystal microbalance(QCM) method at room temperature. The sample was activated by hydrogen absorption and desorption cycling at room temperature. Hydrogen was introduced into the film by increasing hydrogen gas pressure step by step up to 640 torr at room temperature. Hydrogen concentration reached up to 25% at $5{\sim}10$ torr. But at high pressure the concentration decreased. This strange tendency was not understood yet. Further study is needed to find out the mechanism of hydrogen absorption in Al in Al/Pd film.

• 한국전기전자재료학회논문지
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• 제20권4호
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• pp.352-356
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• 2007

The Ni/Cr/Al/Cu (51/41/4/4 wt%) thin films were deposited by using DC magnetron sputtering method for the application of the resistors having low TCR (temperature coefficients of resistance) and high resistivity from the former printed-results[3]. The TCR values measured on the as-deposited thin film resistors were less than ${\pm}10\;ppm/^{\circ}C$ and $-6{\sim}+1\;ppm/^{\circ}C$ after annealing and packaging process. The TCR values were $-3{\sim}1\;ppm/^{\circ}C$ (ratio of variation : about 0.02 %) and $-30{\sim}20\;ppm/^{\circ}C$ (ratio of variation : about $0.5{\sim}1\;%$) for the thermal cycling and PCT (pressure cooker test), respectively. It was confirmed that the reliability properties of the thin film resistor were good for electronic components.

• Current Photovoltaic Research
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• 제9권2호
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• pp.36-44
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• 2021

To endorse the reliability and durability of the solar photovoltaic (PV) device several tests were conducted before exposing to the outdoor field in a non-ideal condition. The PV module has high probability that intend to perform adequately for 30 years under operating conditions. To evaluate the long term performance of the PV module in diversified terrestrial conditions, one should use the outdoor performance data. However, no one wants to wait for 25 years to determine the module reliability. The accelerating stress tests performing in the laboratory by mimicking different field conditions are thus important to understand the performance of a PV module. In this review, we will discuss briefly about different accelerating stress types, levels and prioritization that are used to evaluate the PV module reliability and durability before using them in real field.

• 마이크로전자및패키징학회지
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• 제31권2호
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• pp.1-8
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• 2024

Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al₂O₃ passivation.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• 전기화학회지
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• 제5권3호
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• pp.159-163
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• 2002

리튬 이차 전지에서 음극으로 리튬 금속은 매우 높은 에너지 밀도를 가치고 있으나 짧은 충방전 수명, 안정성 결여 및 고율 충방전특성 불량 등의 단점을 가지고 있다. 이는 리튬큼속과 전해액의 반응에 의해 표면보호막의 형성, 침상리튬 생성, 음극 표면적의 증가로 인한 리튬석출의 불균일성에 기인되어 싸이클 효율과 수명이 저하된다. 본 연구는 전해 액에 첨가제 benzene, toluene, tetramethylethylenediamine를 넣어 줌으로 전지 테스트에서 싸이클 효율과 수명이 향상됨을 확인 할 수 있었다. Impedance 측정결과 필름 저항의 감소와 전하전이 저항의 증가로 전해액의 첨가제가 리튬 표면에 새로운 층을 형성시킴으로서 이런 구성물들이 리튬과 전해액과의 반응성을 억제시킴과 동시에 리튬이 특이적으로 표면에 흡착되어 리튬의 석출 형태가 향상된 것으로 사료된다.