• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.49-52
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• 2007

We investigated hydrogen storage and production properties using redox system of iron oxide($Fe_{3}O_{4}$ + $4H_{2}$ ${\leftrightarrows}$ 3Fe + $4H_{2}O$) modified with rhodium, ceria and zirconia under atmospheric pressure. Reduction of iron oxide with hydrogen(hydrogen storage) and re-oxidation of reduced iron oxide with steam(hydrogen evolution) was carried out using a temperature programmed reaction(TPR) technique. On the temperature programmed studies, the effects of amounts of cerium and zirconium on the re-oxidation rate of partial reduced iron oxides were increased with increasing metal additives amount, but the rhodium amount showed little effect on the re-oxidation rate. On the thermal studies, the re-oxidation rates were enhanced with increasing temperature(300 $^{\circ}C$ < 350 $^{\circ}C$).

• 센서학회지
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• 제17권4호
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• pp.273-280
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• 2008

Monolith aperture-type oxygen sensors with simple structure of YSZ(pin-hole)/Pt/ YSZ(solid electrolyte)/Pt were fabricated by co-firing technique. To enhance the yield of productivity, a couple of YSZ green sheets for diffused barrier and solid electrolyte were prepared by tape-casting and co-firing method. The limit current characteristics of the oxygen sensors were measured between 500 and $650^{\circ}C$ The heating temperature of $600^{\circ}C$ was optimum as a portable oxygen sensor in the range of oxygen concentration from 0 to 75 vol%. Linear proficiency of limit current behavior as a function of oxygen concentration was controlled by the variation of aperture dimension. The fabricated oxygen sensors showed the stable sensing output for 30 days. Gas leakage in bonding area due to warping, cracking and thermal cycling was not found in the period.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 추계학술대회
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• pp.364-367
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• 2006

The decrease of polarization resistance in cathode is the key point for intermediate temperature SOFC(Solid Oxide Fuel Cell). In this study, the Influence of Co substitution in B-site at perovskite PSCM (Pr0.3Sr0.7CoxMn(1-x)) was investigated. The PSCM series exhibits excellent MIEC(Mixed ionic Electronic Conductor) properties. The ASR(Area Specific Resistance) of PSCM3773 was $0.174{\Omega}cm^2\;at\;700^{\circ}C$. The activation energy of PSCM3773 was also lower than other compositions of PSCM. The ASR values were increased gradually during the thermal cycling test of PSCM37773 due to the delamination between electrolyte and cathode materials.

• 한국전기전자재료학회논문지
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• 제21권1호
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• pp.57-62
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• 2008

From the progressing results, it was found that thin film using 52 wt% Ni - 38 wt% Cr - 3 wt% Al - 4 wt% Mn - 3 wt% Si target has good characteristics for low TCR (temperature coefficients of resistance) and high resistivity. The optimum sputtering condition was DC 250 W, 5 mtorr, and 50 sccm and the proper annealing condition was $350^{\circ}C$/3.5 hr in air atmosphere. At these fabricated conditions, thin film resistors with TCR values of less than ${\pm}10ppm/^{\circ}C$ were obtained. The TCR of the packaged-samples made at proper fabrication conditions was $-3{\sim}15ppm/^{\circ}C$ after the thermal cycling and $-20{\sim}180ppm/^{\circ}C$ after PCT (pressure cooker test), we could confirm reliability for the thin film resistor and find the need for enduring research about packaging method.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 B
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• pp.871-873
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• 1999

According to the reports about the failure mode analysis of modules and systems, It is said that there are many early failure of system. To remove latent defects which causes early failures like that, It is necessary that screening test is performed. ESS is often used fur screening electronic equipments, and is proposed by the most powerful tool for removing latent defects of electronic equipments. [1][2] In this report, the procedure of the environmental stress screening which uses the temperature cycling stress is proposed. It is considered about environmental conditions of distributed control system(DCS) to be tested, design specifications of the system, recommended conditions of relative IEC-STD and applied conditions of similar company. ESS test was applied at the DCS to be installed in power plant. As the results of analyzing discovered problems. It was found that almost latent defects of electronic control systems was discovered early.

• 대한기계학회논문집A
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• 제23권7호
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• pp.1085-1093
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• 1999

Thickness effects of coupling agent on residual bending stress were investigated in $Polyimide/SiO_2$ joints during thermal cycling. Thickness and peel strength of $\gamma$-APS coupling agent were measured and correlated with solution concentration and residual bending stress. The variation of residual bending stress with temperature was also measured for various thicknesses of the coupling agent. Finite element results were compared with experimental data for residual bending stress in $Polyimide/SiO_2$ joints.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2006년도 정기 학술대회 논문집
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• pp.3-9
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• 2006

Among many fabrication methods of composite materials, filament winding is the most effective method for fabricating axis-symmetric structures such as pressure tanks and pipes. Filament wound pressure tanks are under high internal pressure during the operation and it has the complexity in damage mechanisms and failure modes. Fiber optic sensors, especially FBG sensors can be easily embedded into the composite structures contrary to conventional electric strain gages (ESGs). In addition, many FBG sensors can be multiplexed in single optical fiber using wavelength division multiplexing (WDM) techniques. In this paper, we fabricated several filament wound pressure tanks with embedded FBG sensors and conducted some kinds of experiments such as an impact test, a bending test, and a thermal cycling test. From the experimental results, it was successfully demonstrated that FBG sensors are very appropriate to composite structures fabricated by filament winding process even though they are embedded into composites by multiplexing.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.265-269
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• 2003

Sn(또는 SnAg)/Ni(P)와 Sn/Cu 계의 열사이클동안 형성되는 금속간화합물에 의해 유기되는 응력의 변화를 in-situ로 관찰하였다. Sn(또는 SnAg)/Ni(11.7P) 박막은 계면반응으로 인해 $Ni_3P$와 $Ni_3Sn_4$ 상이 형성되고 이때 인장응력이 발생하였으며, 한편, Sn(또는 SnAg)/Ni(3P) 박막의 계면반응에 의해서는 동일한 $Ni_3P$와 $Ni_3Sn_4$ 상이 형성됨에도 불구하고 압축응력이 발생하였다. SmAg를 사용할 때 형성되는 $Ag_3Sn$이 응력에 미치는 영향은 거의 없었다. Sn/Cu 박막의 경우는 계면반응 초기에는 인장응력이 발생하였고 어느 정도 이상 반응이 진전됨에 따라 압축응력이 발생하였고 최종적으로 $Cu_3Sn$ 상이 형성되었다. 초기의 인장응력은 계면에서 원자들의 intermixing 베 의한 것이고 압축응력은 Sn 방향으로 일방향 성장하는 금속간화합물 형성에 기인한다.

• 전자공학회논문지D
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• 제34D권7호
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• pp.30-36
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• 1997

Bump bonded piezoesistive silicon accelerometer was fabricated by the porous silicon micromachining and th eprocess technique of integrated circuit. The output voltage of the accelerometer fabricated on (111)-oreiented Si substrates with n/n$^{+}$n triple layers showed good linear characteristic of less than 1%. The measured sensitivity and the resonant frequency was about 743 .mu.V/g and 2.04 kHz, respectively. And the transverse sensitivity of 5.2% was measured from the accelerometer. Also, to investigate an influence on the output characteristics of the sensor due to bump bonding, the values of the piezoresistors were measured through thermal-cycling test in the temperature variation form -50 to 120.deg. C. Then, there was 0.014% resistance changes about 3.61 k.ohm., so sthe output charcteristics of the sensor was less affected by bump bonding.g.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.220-223
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• 1996

Mechanical properties of Plasma-Enhanced Chemical Vapor Deposited (PECVD) silicon nitride thin film was studied to determine the feasibility of the film as a passivation layer over the aluminum bonding areas of integrated circuit chips. Ultimate strain of the films in thicknesses of about 5 k${\AA}$ was measured using four-point bending method. The ultimate strain of these films was constant at about 0.2% regardless of residual stress. Intrinsic and residual stresses of these films were measured and compared with thermal shock and cycling test results. Comparison of the results showed that more tensile films were more susceptible to crack- induced failure.