• 대한치과보철학회지
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• 제35권4호
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• pp.697-705
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• 1997

The purpose of this study was to evaluate the effects of two metal adhesive primers on the shear bond strengths of self-curing resin to Ni-Cr a]toy and the effects of 1000 thermal cycling on the durability of the bond. The two selected metal adhesive primers were Metal Primer II(G-C corp., Japan) and MR Bond(Tokuyama corp., Japan) and no treatment groups were used as control. All specimens were divided into two groups according to thermal cycling. In the group without thermal cycling, the specimens were stored in water for 24 hours. In the group with thermal cycling, the specimens were thermocycled 1000 times at temperature of $5^{\circ}C\;and\;55^{\circ}C$. Shear bond strengths were measured using the Universal testing machine(Zwick 145641, Germany) with a crosshead speed of 0.5 mm/min. The results were as follows: 1. MR Bond significantly improved the shear bond strength of resin to Ni-Cr alloy before and after thermal cycling. 2. There were no difference in the shear bond strength of resin to Ni-Cr alloy between Metal Primer II treated group and no treatment group. 3. Regardless of the type and the use of adhesive primers, there were tendency of decrease in shear bond strength with 1000 thermal cycling.

• 대한의용생체공학회:의공학회지
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• 제17권3호
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• pp.327-336
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• 1996

This study was performed to investigate the effec% of immersion in water and thermal cycling on the mechanical peoperties of light cured restorative composite resins. Five commerically available light-cured composite resins(Photo Clearfil A : CA, Lite-Fil A . LF, Clearril Photo Posterior CP, Prisms AP.H.. PA, 2100 : ZH) were unto The specimens of 12 m in diameter and 0.7 m in thickness were made, and an immersion in $37^{\circ}C$ water for 7 days and a thermal cycling of 1000 cycles at 15 second dwell time each in $5^{\circ}C$ and $55^{\circ}C$ baths were performed. Biaxial flexure test was conducted using the ball-on-three-ball method at the crosshead speed of 0.5mm/min. In order to investigate the deterioration of composite resins during the thermal cycling test, Weibull analysis for the biaxial flexure strengths was done. Fracture surfaces and the surfaces before and after the thermal cycling test were examined by SEM. The highest Weibull modulus value of 10.09 after thermal cycling tests which means the lowest strength variation, was observed in the CP group, and the lowest value of 4.47 was obsered in the LF Group. Biaxial flexure strengths and Knoop hardness numbers significantly decreased due to the thermal cycling ($\textit{p}$< 0.01), however, they recovered when specimens were drie4 The highest biaxial flexure strength of 125.65MPa was observed in the ZH group after the thermal cycling test, and the lowest value of 64.86MPa was observed in the CA group. Biaxial flexure strengths of ZH and CP groups were higher than those of PA, CF, and CA groups after thermal cycling test($\textit{p}$< 0.05). Knoop hardness numbers of CP group after the thermal cycling test was the highest(95.47 $\pm$ 7.35kg/$mm^2$) among the samples, while that of CA group was the lowest(30.73 $\pm$ 2.58kg/$mm^2$). Knoop hardness numbers showed the significant differences between the CP group and others after the thermal cycling test(($\textit{p}$< 0.05). Fracture surfaces showed that the composite resin failure developed along the matrix resin and the filler/resin interface region, and the cracks propagated in the conical shape from the maximum tensile stress zone.

• 한국수소및신에너지학회논문집
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• 제2권1호
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• pp.69-75
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• 1990

The effect of thermal cycling on the hydrogenation characteristics of the $Mg_2Cu-H$ system was investigated in order to study of intrinsic degradation of the system. The hydrogen storage capacity decreased with thermal cycling from $573^{\circ}K$ to $663^{\circ}K$. By the thermal analysis it is found that stable $MgH_2$ hydride is formed during thermal cycling. With a heat treatment at $693^{\circ}K$ at a hydrogen pressure of 16 atm, the hydrogenation rate drastically decreased. From these observation, it suggested that the intrinsic degradation of $Mg_2Cu$ system results from mainly the formation of stable $MgH_2$ hydride phase.

• 대한치과보철학회지
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• 제37권5호
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• pp.597-606
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• 1999

This study was performed to evaluate the effect of aging and thermal cycling on the biaxial flexure strength of low commercially available veneering resin composites for crown(Dentacolor : DC, Artglass : AG, Esternia : ET and Targis : TG). Disc specimens were fabricated in a teflon mold giving 12mm in diameter and 1mm in thickness. All samples were divided into 4 groups. Group 1 was dried in a dessicator at $25^{\circ}C$ for 30 days. Group 2 was immersed in distilled water at $37^{\circ}C$ for 30 days. Group 3 was immersed in distilled water at $65^{\circ}C$ for 30 days. Group 4 was subjected to 10,000 thermal cycles between $5^{\circ}C\;and\;55^{\circ}C$, and the immersion time in each bath was 15 seconds per cycle. Biaxial flexure test was conducted using the ball-on-three-ball method at the cross head speed of 0.5mm/min and fracture surfaces were observed with scanning electoron microscope. The results obtained were summarized as follows; 1. Weibull modulus values, except for the AG group, decreased after thermal cycling treatment. 2. Biaxial flexure strength values of aging group at $37^{\circ}C$ were the lowest in all sample groups. Except for the DC group, strength values were significantly decreased for the drying group. 3. After thermal cycling test, the highest value of biaxial flexure strength of 188.8 MPa was observed in the ET group and the lowest value of 73.2 MPa was observed in the DC group. The strength values showed the significant differences in each group (p<0.05). 4. Observation of surfaces after thermal cycling test revealed the ditching in the part of surrounding large fillers.

• 한국수소및신에너지학회논문집
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• 제12권3호
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• pp.177-189
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• 2001

T hydrogen absorption-desorption behavior induced by thermal or hydrogen pressure cycling in a closed system was observed in hydrogen storage alloys, $(La-R-Mm)Ni_{4.5}Fe_{0.5}$, $MmNi_4Fe_{0.85}Cu_{0.15}$ and $(Ce-F-Mm)Ni_{4.7}Al_{0.2}Fe_{0.1}$. Thereby (La-R-Mm), Mm and (Ce-F-Mm) refer to La-rich mischmetal, mischmetal and Ce-free mischmetal respectively. As the results, it is found that the alloy stabilities during thermal cycling varies with alloy composition change. The highest stability occurs in $MmNi_4Fe_{0.85}Cu_{0.15}$ and the lowest stability in $(La-R-Mm)Ni_{4.5}Fe_{0.5}$. Comparing hydrogen pressure cycling with thermal cycling, pressure cycling causes severer degradation of the alloy $(Ce-F-Mm)Ni_{4.7}Al_{0.2}Fe_{0.1}$ than thermal cycling. When the 1500 times-cycled alloy is annealed at $400^{\circ}C$ for 3hrs under 1 atm of hydrogen pressure the hydrogen storage capacity is recovered only partially but not completely to the initial capacity. The amount of capacity loss after annealing is larger in the hydrogen pressure cycled samples than in the thermal cycled, suggesting an incoming of impure gas during hydrogen pressure cycling.

• 열처리공학회지
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• 제5권3호
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• pp.179-185
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• 1992

The shape memory effect results from the martensite transfomation of each individual grain. Thus it is necessary to study the texture and its variation. In this study the change of texture during thermal cycling and it's effect on shape memory ability are investigated. The major component of the rolling texture in the parent phase is identified (001) [110], and minor components are (112) [110], (111) [112], {hkl}<100> fiber texture is developed at $45^{\circ}$ from rolling direction. In the case of martensite phase, it is estimated that the major component is (011) [100] and the minor components are (105) [501], (010) [101] and (100) [001]. According to thermal cycling. severity of texture, especially (001) [110] component in parent phase and (011) [100] component in martensite phase are increased. The shape memory ability is increased with increase of thermal cycles and also increased as the direction of specimen approach to $45^{\circ}$ from rolling direction. After first thermal cycling the temperature of transformation can be define clearly and Ms and As are raised by thermal cycling.

• 대한금속재료학회지
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• 제46권9호
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.27-34
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• 2015

The correlation between crack propagation and localized recrystallization are compared in a series of cross section analyses on thermal cycled edgebond and underfilm material applied wafer level chip scale package (WLCSP) components with a baseline of no-material applied WLCSP components. The results show that the crack propagation distribution and recrystallization region correlation can explain potential degradation mechanisms and support the damage accumulation history in a more efficient way. Edgebond material applied components show a shift of damage accumulation to a more localized region, thus potentially accelerated the degradation during thermal cycling. Underfilm material applied components triggered more solder joints for a more wider distribution of damage accumulation resulting in a slightly improved thermal cycling performance compared to no-material applied components. Using an analysis on localized distribution of recrystallized areas inside the solder joint showed potential value as a new analytical approach.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.38-42
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• 2002

An apparatus was developed to repetitively apply a $-196^{\circ}C$ thermal load to coupon-sized mechanical test specimens. Using this device, IM7/5250-4 (carbon / bismaleimide) cross-ply and quasi-isotropic laminates were submerged in liquid nitrogen ($LN_2$) 400 times. Ply-by-ply micro-crack density, laminate modulus, and laminate strength were measured as a function of thermal cycles. Quasi-isotropic samples of IM7/977-3 (carbon / epoxy) composite were also manually cycled between liquid nitrogen and an oven set at $120^{\circ}C$ for 130 cycles to determine whether including elevated temperature in the thermal cycle significantly altered the degree or location of micro-cracking. In response to thermal cycling, both materials micro-cracked extensively in the surface plies fellowed by sparse cracking of the inner plies. The tensile modulus of the IM7/5250-4 specimens was unaffected by thermal cycling, but the tensile strength of two of the lay-ups decreased by as much as 8.5%.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2003년도 제20회 춘계학술대회 논문집
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• pp.151-155
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• 2003

An apparatus was developed to repetitively apply a -196 $^{\circ}C$ thermal load to coupon-sized mechanical test specimens. Using this device, IM7/5250-4 (carbon / bismaleimide) cross-ply and quasi-isotropic laminates were submerged in liquid nitrogen (L$N_2$) 400 times. Ply-by-Ply micro-crack density, laminate modulus, and laminate strength were measured as a function of thermal cycles. Quasi-isotropic samples of IM7/977-3 (carbon / epoxy) composite were also manually cycled between liquid nitrogen and an oven set at 120 $^{\circ}C$ for 130 cycles to determine whether including elevated temperature in the thermal cycle significantly altered the degree or location of micro-cracking. In response to thermal cycling, both materials micro-cracked extensively in the surface plies followed by sparse cracking of the inner plies. The tensile modulus of the IM7/5250-4 specimens was unaffected by thermal cycling, but the tensile strength of two of the lay-ups decreased by as much as 8.5 %.