• Transactions of the Korean Society of Automotive Engineers
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• v.11 no.5
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• pp.29-36
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• 2003

Exhaust manifolds suffer from serious temperature variation during the thermal fatigue test. The spatial distribution of temperature changes at each moment. Because transient flow can not be simulated during the long period of temperature change, the simulation can not be performed by conjugate heat transfer analysis. In this study, a new procedure for transient thermal analysis is established by decoupling fluid-solid analysis. The procedure consists of (1) transient CFD calculation (2 cycles), (2) mapping heat transfer coefficient to the inner surface of solid mesh as a boundary condition of heat conduction analysis and (3) transient heat conduction analysis in the long period (30 min). The realistic temperature change can be predicted by this procedure.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1318-1319
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• 2011

In this paper, we analyzed of growth and electrical characteristics of micro-cracks with thermal effect in PV module. The micro-cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because microcracks accelerated aging by thermal cycling test. according to IEC61215. Before every test, we checked output and EL image of PV module.

• Journal of the Korean Ceramic Society
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• v.33 no.3
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• pp.321-326
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• 1996

Thermal fatigue test and stress analysis of Si3N4 and metal swirl chamber were carried out to investigate the reliability of the swirl chambers. Conditions of the thermal fatigue test were severer than those in real engine and FEM was used to analize the stress distribution in the swirl chambers. Fatigue cracks of the maximum length 2.4 mm and deformation were occurred at the corner of the jet in metal swirl chamber but not observed in Si3N4 swirl chamber. Maximum tensile stress in Si3N4 swirl chamber calculated by FEM was 300 MPa.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• 한국태양에너지학회:학술대회논문집
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• 2011.04a
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• pp.25-30
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• 2011

In this paper, we analyzed the electrical characteristics with Micro-cracks in Photovoltaic module. Micro cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. And The solar cells have to with stand the stress under out door operation in the finished module. Here the mechanical stress is induced by temperature changes and mechanical loads from wind and snow. So, we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because micro-cracks accelerated aging by thermal cycling test, according to IEC61215. Before every test, we checked output and EL image of PV module. As the result of first step, we detected little power loss(0.9%). But after thermal cycling test increased power loss about 3.2%.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.4
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• pp.180-184
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• 2012

3-way ball valves have been mostly used for high temperature/high pressure valves using in petrochemical carriers and oil tankers, which requires high quality products with confidentiality and durability. As a larger disaster may be generated by leakage of oil or gas from valves, thus the present research applied a numerical analysis method with thermal-structural coupled field analysis and the performance test. The Max stress by parts was confirmed through thermal-structural coupled field analysis and develop the 3-way ball valve design, which is safe on operating condition. And its performance was verified by carrying out pressure test, leakage test and durability test for the manufactured 3-way ball valves with satisfying it's regulations.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.547-548
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• 2012

• Journal of the Korean Society for Nondestructive Testing
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• v.29 no.5
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• pp.450-457
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• 2009

Periodical thermal shock can introduce defects in thermal barrier coating made by layers of CoNiCrAlY bond coating(BC) and $ZrO_2-8wt%Y_2O_3$ ceramic top coating(TC) on Inconel-738 substrate using plasma spraying. Thermal shock test is performed by severe condition that is to heat until $1000^{\circ}C$ and cool until $20^{\circ}C$. As the number of cycle is increased, the fatigue by thermal shock is also increased. After test, the micro-structures and mechanical characteristics of thermal barrier coating were investigated by SEM, XRD. The TGO layer of $Al_2O_3$ is formed between BC and TC by periodical thermal shock test, and its change in thickness is inspected by eddy current test(ECT). By ECT test, it is shown that TGO and micro-crack can be detected and it is possible to predict the life of thermal barrier coating.

• Journal of Energy Engineering
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• v.22 no.4
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• pp.327-332
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• 2013

일본 연구에서는 열충격 시험을 통한 태양전지의 파괴모드에 따른 전기적 특성을 분석하였다. 시편은 Photovoltaic Module을 만들기 전 3 line Ribbon을 Tabbing한 단결정 Solar Cell을 제작하였다. 열충격 시험 Test 1의 온도조건은 저온 $-40^{\circ}C$, 고온 $85^{\circ}C$, Test 2는 저온 $-40^{\circ}C$, 고온 $120^{\circ}C$에서 Ramping Time을 포함하여 각각 15분씩, 총 30분을 1사이클로 500사이클을 각각의 조건으로 수행하였다. 열충격 시험 후 Test 1에서는 4.0%의 효율 감소율과 1.5%의 Fill Factor 감소율을 확인하였으며, Test 2에서는 24.5%의 효율 감소율과 11.8%의 Fill Factor 감소율을 확인하였다. EL(Electroluminescence)촬영 및 단면을 분석한 결과, Test 1과 Test 2 시편 모두 Cell 표면 및 내부에서의 Crack이 발견되었다. 하지만, Test 2의 시험이 Test 1보다 가혹한 온도조건의 시험으로 인해 Test 1에서 나타나지 않았던, Cell 파괴를 Test 2에서 확인하였다. 결국, Test 1에서 효율의 직접적인 감소 원인은 Cell 내부에서의 Crack이며, Test 2에서는 Cell 내부에서의 Crack 및 Cell 파괴로 인한 Cell 자체의 성능저하로 효율이 크게 감소한다는 것을 본 실험을 통하여 규명하였다.

• Journal of the Korean Society of Safety
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• v.11 no.1
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• pp.53-59
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• 1996

To protect the damages or the disasters caused by overheating of industrial electric equipments or electric home appliances, a temperature sensitive thermal fuse is generally used in those equipments. Thermal fuses cutoff the current flow when the temperature of the electric equipments are abnormally overheated and over the certain temperature. Therefore thermal fuse is one of the most important elements in the sense of safety. Thermal fuses are classified into two types according to thermally sensitive materials, a low temperature melting alloy and an organic chemical compound. Domestic products of thermal fuses are now only with an organic chemical compound. Domestic products tested by using cutoff test and aging test etc. are satisfied UL specification. It's shown that the accuracy and the precision of the domestic products are as good as those of the overseas products obtained UL mark. However, some of domestic products show the reclosing problem which is mainly related the safety. This problem should be solved to make the reliable thermal fuses. In this paper, our Interest is to find out the causes of reclosing. In the comparison between thermally sensitive materials occurred reclosing and those occurred no reclosing, the test effects show that the characteristics of emitting heat and absorbing heat are different.