• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.245-245
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• 2009

l-D nanostructured materials have much more attention because of their outstanding properties and wide applicability in device fabrication. Copper oxide(CuO) has been realized as a p-type metal oxide semiconductor with narrow band gap of 1.2 -1.5eV. Copper oxide nanostructures can be synthesized by various growth method such as oxidation reaction, thermal evaporation thermal decomposition, sol-gel. and Mostly CuO nanowire prepared on the Cu substrate such as Copper foil, grid, plate. In this study, CuO NWs were grown by thermal oxidation (at various temperatures in air (1 atm)) of Cu metal deposited on CuO (20nm)/$SiO_2$(250nm)/Si. A 20nm-thick CuO layer was used as an adhesion layer between Cu metal and $SiO_2$

• 한국세라믹학회지
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• 제52권1호
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• pp.23-27
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• 2015

Recently, the use of ion-exchange strengthened glass has increased sharply, as it is now used as the cover glass for smart phone devices. Therefore, many researchers are focusing on methods that can be used to strengthen ion-exchange glass. However, research on how the improved strength can be maintained under thermal environment of device manufacturing is still insufficient. We tested the degradation of the characteristics of ion-exchange soda-lime glass samples, including their surface compressive stress characteristics, the depth of the ion-exchange layer (DOL), flexural strength, hardness, and modulus of rupture (MOR) values. Degradation of the characteristics of the ion-exchange glass samples occurred when they were heat-treated at a temperature that exceeded $350^{\circ}C$.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1857-1862
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• 2008

Resonant frequency tuning of micro devices is essential to achieve performance uniformity and high sensitivity. Previously reported frequency tuning methods using electrostatic force or mass deposition are not directly applicable to non-conducting polymer devices and have limitations such as dielectric breakdown or low tunable bandwidth. In this paper, thermally frequency-tunable microactuators with poly-dimethylsiloxane membranes are proposed. Permanent and/or nonpermanent frequency tunings are possible using a simple temperature control of the device. Resonant frequency and Q-factor variations of devices according to temperature change were studied using a micro heater and laser Doppler vibrometer. The initial resonant frequencies determined by polymer curing and hardening temperatures are reversibly tuned by thermal cycles. The measured resonant frequency of 9.7 kHz was tuned up by ${\sim}25%$ and Q-factor was increased from 14.5 to 27 as the micro heater voltage increased from 0 to 70 V.

• 한국안전학회지
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• 제28권3호
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• pp.69-73
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• 2013

The purpose of this paper is to analyze the carbonization pattern and operation characteristics of an MCCB. The MCCB is consisted of the actuator lever, actuator mechanism, bimetallic strip, contacts, up and down operator, arc divider or extinguisher, metal operation pin, terminal part, etc. When the actuator lever of the MCCB is at the top or the internal metal operation pin is in contact with the front part, the MCCB is turned on or off. It means trip state if the actuator lever or the internal metal operation pin moves to back side. In the UL 94 vertical combustion test, white smoke occurred from the MCCB when an average of 17~24 seconds elapsed after the MCCB was ignited and black smoke occurred when an average of 45~50 seconds elapsed. It took 5~6 minutes for the MCCB surface to be half burnt and took an average of 8~9 minutes for the MCCB surface to be entirely burnt. In the UL 94 test, the MCCB trip device operated when an average 7~8 minutes elapsed. If the MCCB trip has occurred, it may have been caused by an electrical problem such as a short-circuit, overcurrent, etc., as well as fire heat. From the entire part combustion test according to KS C 3004, it was found that the metal operation pin could be moved to the MCCB trip position without any electrical problems.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2005년도 춘계학술발표대회 논문집
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• pp.5-8
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• 2005

In this paper, the electromechanical displacements of curved piezoelectric actuators composed of PZT ceramic and laminated composite materials are calculated based on high performance computing technology and the optimal configuration of composite curved actuator is examined. To accurately predict the local pre-stress in the device due to the mismatch in coefficients of thermal expansion, carbon-epoxy and glass-epoxy as well as PZT ceramic are numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers increases the number of degrees of freedom, large-scale structural analyses are performed through the PEGASUS supercomputer, which is installed in our laboratory. In the first stage, the curved shape of the actuator and the internal stress in each layer are obtained by the cured curvature analysis. Subsequently, the displacement due to the piezoelectric force (which is resulted from applied voltage) is also calculated. The performance of composite curved actuator is investigated by comparing the displacements obtained by the variation of thickness and elastic modulus of laminated composite layers. In order to consider the finite deformation in the first analysis stage and include the pre-stress due to curing process in the second stage, nonlinear finite element analyses are carried out.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.19-26
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• 2010

포화 수증기압이 고출력 형광체 변환 백색 LED 패키지의 열화현상에 미치는 주요 스트레스 인자임을 확인하였다. 또한 LED 패키지의 가속 수명시험을 통하여 포화 수증기압이 효과적인 가속 스트레스 인자임을 확인하였다. 실험조건은 350 mA 전류를 인가한 것과 인가하지 않은 2가지 조건에 대해 $121^{\circ}C$, 100% R.H. 환경에서 최대 168 시간동안 진행하였다. 실험결과 두 실험 모두 광 출력 감소, 스펙트럼 세기의 감소, 누설전류 및 열 저항이 증가하였다. 고장분석 결과 광 특성의 열화는 봉지재의 변색과 기포에 의해 발생한 것으로 나타났다. LED 패키지의 변색과 흡습에 의해 유발되는 기계적 (hygro-mechanical) 스트레스에 의한 기포 발생은 패키지 열화의 중요한 인자로써, 포화 수증기압이 고출력 LED의 수명시험 시간을 단축하기 위한 스트레스 인자로 적합함을 알 수 있었다.

• 대한기계학회논문집A
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• 제34권2호
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• pp.153-160
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• 2010

인체의 심장 활동에 의해 발생되는 생체 자기 신호를 심자도(magnetocardio-gram, MCG)라고 부른다. 이러한 생체자기장은 극저온 상태에서 고감도 자장센서인 SQUID(Superconducting QUantum Interference Device)를 사용함으로서 측정할 수 있다. 이 심자도 장비의 냉각장치는 액체 헬륨을 냉매로 사용하며 이 냉매를 보관하는 방법이 장비의 성능을 좌우한다. 액체 저온 듀아가 극저온 4 K에서 초전도 특성을 유지하기 위하여 사용된다. 본 연구에서는 액체 헬륨 듀아의 온도분포 특성이 연구되었다. 본 연구에서 사용된 듀아는 액체헬륨 용량이 30 L이고 5일간 유지된다. 듀아에는 150 K와 40 K의 이중 차폐체가 설치되었다. 열차폐체 끝단에서의 온도가 측정되었으며 전산모델의 해석결과와 비교되었다. 기하 설계 변수에 대한 최적화 기법을 적용하여 냉각장치인 저온 듀아의 열전단율을 최소화하였으며 듀아의 응력분포에 영향을 갖는 설계 기하 변수들의 특성을 연구하였다. 냉각장치의 열해석 및 최적화해석을 위해 유한요소 코드 ANSYS 10을 사용하였다. 저온 듀아에 사용된 전산모델은 열복사에 의한 영향을 최소화 할 수 있는 분야에서 온도 분포를 예측하는데 유용하게 사용될 수 있다.

• 한국표면공학회지
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• 제42권6호
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• pp.287-293
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• 2009

The passivation films with epoxy layer on LiF, $SiN_x$ and LiF/$SiN_x$ inorganic layer were fabricated on OLED to protect device from the direct damage of $O_2$ and $H_2O$ and to apply for a buffer layer between OLED device and passivation multi-layer with organic/inorganic hybrid structure as to diminish the thermal stress and expansion. Red OLED doped with 1 vol.% Rubrene in $Alq_3$ was used as a basic device. The device structure was multi-layer of ITO(150 nm) / ELM200_HIL(50 nm) / ELM002_HTL(30 nm) / $Alq_3$: 1 vol.% Rubrene(30 nm) / $Alq_3$(30 nm) / LiF(0.7 nm) / Al(100 nm). LiF/epoxy applied as a protective layer didn't contribute to the improvement of life time. While in case of $SiN_x$/epoxy, damage was done in the passivation process because of difference in heat expansion between films which could occur during the formation of epoxy film. Using LiF/$SiN_x$/epoxy improved lifetime significantly without suffering damage in the process of forming films, therefore, the best structure of passivation film with inorganic/epoxy layers was LiF/$SiN_x$/E1.

• 한국재료학회지
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• 제3권2호
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• pp.166-174
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• 1993

반도체 소자의 표면 보호용으로 사용되는 상압 CVD 방법에 의한 PSG(Phosposilicate glass)막 및 플라즈마 CVD방법에 의한 PE-SiN(Plasma enhanced CVD S${i_2}{N_4}$)막의 항균열 특성을 알루미늄박막이 증착되어 있는 실리콘 기판위에서 조사했다. 45$0^{\circ}C$에서 30분간으 열처리를 반복하면서 균열 발생 유무 및 그 형태를 조사하여 이러한 균열의 생성을 각 막의 막응력과 관련하여 검토하였다. 이들 박막에서의 균열 발생은 하부 조직인 알루미튬배선과의 열팽창계수차에 의한 것임을 알 수 있었다. PSG막 두께가 증가할수록 인장응력이 증가하여 항균열성이 저하되었다. PSG막의 P농도가 증가할수록 막응력은 압축응력쪽으로 이동하였고 균열 발생은 억제되었다. PE-SiN 막도 높은 압축응력을 갖게 함으로써 항균열성을 향상시킬 수 있었다. 본 실험의 결과로부터 반복 열처리시 균열 발생여부에 대한 실험식을 제시하였다.

• 한국표면공학회지
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• 제48권2호
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• pp.33-37
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• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.