• Computers and Concrete
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• 제17권2호
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• pp.173-188
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• 2016

Generally, thermal stress induced by hydration heat causes cracking in mass concrete structures, requiring a thorough control during the construction. The prediction of the thermal stress is currently undertaken by means of numerical analysis despite its lack of reliability due to the properties of concrete varying over time. In this paper, a method for the prediction of thermal stress in concrete structures by adjusting thermal stress measured by a thermal stress device according to the degree of restraint is proposed to improve the prediction accuracy. The ratio of stress in concrete structures to stress under complete restraint is used as the degree of restraint. To consider the history of the degree of restraint, incremental stress is predicted by comparing the degree of restraint and the incremental stress obtained by the thermal stress device. Furthermore, the thermal stresses of wall and foundation predicted by the proposed method are compared to those obtained by numerical analysis. The thermal stresses obtained by the proposed method are similar to those obtained by the analysis for structures with internally as well as externally strong restraint. It is therefore concluded that the prediction of thermal stress for concrete structures with various boundary conditions using the proposed method is suggested to be accurate.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2006년도 춘계학술발표회 논문집(I)
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• pp.474-477
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• 2006

To predict thermal stress independent of uncertain material properties of early age concrete, such as elastic modulus and creep, thermal stress device is used. In order to verify the application of various degree of constraint in the thermal stress device, a series of experiments were performed on mass concrete followed by numerical simulation. The application of various degrees of constraint can be achieved by using constraint frame material with different thermal expansion coefficient, length, and cross sectional area. Temperature development in the real structure has been simulated using temperature and humidity control chamber. The results from experiments and numerical analysis show that the thermal stresses estimated from simulation agree well with the general stress variations in the real structure even though the properties of concrete are uncertain.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.129-130
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• 2005

The electrical stress has a major effect on the long-term reliability of the thyristor. Therefore, it is needed to analyze the relationship between reliability and stress. In this paper, we investigate the device failure mechanism which induced by the stress. And also investigate the effect of the thermal stress on the device failure and relationship between electrical and thermal stress. Two-dimensional process simulator ATHENA and device simulator ATLAS are used to analyze the failure mechanism of the device.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.39-47
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• 2002

Heat is always the root of stress acting upon the electronic package, regardless of the heat due to the device itself during operation or working under the adverse environment. Due to the significant mismatch in coefficient of thermal expansion (CTE) and the thermal conductivity (K) of the packaging components, on one hand intensive research has been conducted in order to enhance the device reliability by minimizing the mechanical stressing and deformation within the package. On the other hand the effectiveness of different thermal enhancements are pursued to dissipate the heat to avoid the overheating of the device. However, the interactions between the thermal-mechanical loading has not yet been address fully. in articular when the temperature gradient is considered within the package. To address the interactions between the thermal loading upon the mechanical stressing condition. coupled-field analysis is performed to account the interaction between the thermal and mechanical stress distribution. Furthermore, process induced defects are also incorporated into the analysis to determine the effects on thermal conducting path as well as the mechanical stress distribution. It is concluded that it feasible to consider the thermal gradient within the package accompanied with the mechanical analysis, and the subsequent effects of the inherent defects on the overall structural integrity of the package are discussed.

• 한국융합학회논문지
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• 제11권7호
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• pp.361-368
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• 2020

본 연구는 근육통 환자들의 척주온열마사지 기기 사용이 근육통 개선에 효과가 있는지를 살펴보고, 정서적 부분인 우울감, 스트레스 개선에도 효과가 있는지 검증하는데 목적이 있다. 이를 위해 연구참여자 16명(남자, 31.25%)은 온열 마사지 기기에 대한 처치로 4주간 주 5회, 1회당 40분을 실시하였다. 연구결과, 주관적 통증정도는 VAS -46.32%, PDI -44.86%의 변화율을 보였으며, VAS, PDI 모두 유의한 감소를 보였다. 기타 우울감 및 스트레스 정도에서는 BDI -21.84%, SRI -11.48%의 변화율을 보였으며, BDI, SRI 모두 유의한 감소를 나타내었다. 따라서 근육통 환자 치료 시 온열마사지 기기를 활용한다면 주관적 근육통, 우울감 및 스트레스 개선에서 긍정적인 효과가 있을 것으로 기대된다.

• 한국주조공학회지
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• 제40권1호
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• pp.1-6
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• 2020

Many studies involving a thermal stress analysis using computational methods have been conducted, though there have been relatively few experimental attempts to investigate thermal stress phenomena. Casting products undergo thermal stress variations during the casting process as the temperature drops from the melting temperature to room temperature, with gradient cooling also occurring from the surface to the core. It is difficult to examine thermal stress states continuously during the casting process. Therefore, only the final states of thermal stress and deformations can be detemined. In this study, specimens sensitive to thermal stress, were made by a casting process. After which the residual stress levels in the specimens were measured by a hole drilling method with Electron Speckle-Interferometry technique. Subsequently, we examined the thermal stresses in terms of deformation during the casting process by means of a numerical analysis. Finally, we compared the experimental and numerical analysis results. It was found that the numerical thermal stress analysis is an effective means of understanding the stress generation mechanism in casting products during the casting process.

• 한국전기전자재료학회논문지
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• 제17권4호
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• pp.439-442
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• 2004

In this study, we investigated about electrooptics characteristic of three kinds of TN cell on the polyimide surface. Monodomain alignments of thermal stressed TN cell over temperature of liquid crystal isotropic phase were almost the same as that of no thermal stressed TN cells. However, the thermal stressed TN cells have many defects. Also, threshold voltage and response time of thermal stressed TN cells show the same performances as no thermal stressed TN cells. There were little changes of value in these TN cells. However, transmittances of TN cells on the polyimide surface decrease with increasing thermal stress time. Finally, the residual DC voltage of the thermal stressed TN cell on the polyimide surface shows decrease of characteristics as increasing thermal stress time. Therefore, the thermal stability of TN cell was decreased by high thermal stress for the long times.

• 한국재료학회지
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• 제8권8호
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• pp.744-750
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• 1998

마이크로 머신 소자는 일반전자 소자와 달리 소자 자체에 미세한 기계적 구조물을 갖고 있으며, 이의 구동을 통하여 센서 또는 엑츄에이터의 기능을 갖게 된다. 이 소자들은 그 작동 요구특성에 따라 패키지의 기계적, 환경적 격리를 요구하거나 분위기조절이 요구되는 등 까다로운 패키지 특성을 필요로 한다. 또한 미세한 작동소자들로 인하여 열 및 열응력에 매우 민감하며, 패키지방법에 따라 구동부위의 작동 특성이 크게 변화할 수 있다. 본 연구에서는 마이크로 머신 소자가 패키지 상에 접촉되어 패키지 될 때, 소자의 접촉 재료 및 공정온도, 크기 등이 마이크로 머신 소자에 미치는 열응력을 연구하였다. 유한요소해석법을 사용하여 소자에 미치는 열응력과 이로 인한 마이크로머신 소자의 물리적 변형을 예측하고, 이를 통하여 마이크로 머신 소자 패키지에 최소한의 열응력을 미치는 소자접속 재료의 선별과 패키지 설계의 최적화를 이루고자 하였다.

• 한국정밀공학회지
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• 제27권9호
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• pp.58-66
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• 2010

This study examines thermal safety on three-way catalyst that dominates 70 % among whole exhaust gas purification device in 2003. Three-way catalyst durability in the Korea requires 5 years/80,000 km in 1988 but require 10 years/120,000 km after 2002. Three-way catalyst durability in the USA requires 7 years/120,000 km but require 10 years/160,000 km after 2004. Three-way catalyst maintains high temperature in interior domain but maintains low temperature on outside surface. Therefore this device shows tensile stress on outside surface. Temperature distribution of three-way catalyst was acquired by thermal flow analysis for predicted thermal flow parameter. Thermal stress analysis for three-way catalysis was performed based on this temperature distribution. Thermal safety of three-way catalyst was estimated by power law dynamic fatigue life estimation and strength reduction methods for thermal stress.

• 콘크리트학회논문집
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• 제13권3호
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• pp.228-236
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• 2001

매스콘크리트 구조물에서 발생하는 온도응력을 예측하기 위해 많은 연구가 해석적인 방법과 실험적인 방법을 통해 수행되어왔다. 그러나 이러한 해석적인 방법과 실험적인 방법으로 온도응력을 예측하는 것은 한계가 있다. 해석적인 방법은 콘크리트의 탄성계수, 열팽창계수와 같은 물성치를 정확히 알아야 한다. 그리고 실험적인 방법은 대부분이 실제 구조물이나 모형구조물을 통하여 직접 온도응력을 측정한다. 그러나 이와 같은 방법은 경제적인 문제뿐만 아니라 현장의 불확실한 조건들을 감수해야 한다. 본 연구에서는 온도응력을 실내에서 직접적으로 측정할 수 있는 시험장치를 개발하였다. 개발된 온도응력 시험장치는 콘크리트와 다른 열팽창계수를 갖는 재료를 이용하여 실제 구조물에서 발생할 수 있는 콘크리트의 내/외부 구속에 의한 온도응력의 변화를 구현할 수 있으며, 이를 정량적으로 예측할 수 있다. 실험은 해석을 통해 얻은 온도이력을 구현할 수 있는 항온항습조에서 수행하였고, 온도응력은 장비에 부착된 변형률게이지를 통해 얻은 변형률을 이용하여 계산하였다. 개발된 장비의 검증을 위해 매립게이지를 이용하여 온도응력을 측정하는 실험을 동시에 수행하였고, 이 결과에 의하면 개발된 시험장치는 불확실한 콘크리트의 초기재령 물성치를 고려하여 보다 정확하게 온도응력을측정할 수 있으며, 검증실험 결과에 의해 그 객관성과 타당성을 입증할 수 있었다.