• Title/Summary/Keyword: thermal stress analysis

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Finite Element Analysis of Thermal Stresses on a Hearth Roll Surface Depending on Changes in the Neck Shape (허스롤 목 부위 형상 변화에 따른 열응력 분포 변화 유한요소해석)

  • Na, D.H.;Lee, Y.
    • Transactions of Materials Processing
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    • v.25 no.3
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    • pp.169-175
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    • 2016
  • The hearth roll, which transfers the cold-rolled strip sheet in a Continuous Annealing Line (CAL), is always subjected to changes in the surface temperature and subsequently experiences thermal stress in service. These variations lead to the generation of thermal cracks on the hearth roll surface as well local plastic deformation. We performed finite element analysis to predict the thermal stress changes on the hearth roll surface and designed the collar shape of the hearth roll to minimize these thermal stresses. Results show that the hearth roll with a collar having an obtuse angle is much more effective than a hearth roll with collar having a right angle when the tangential stress, which is one of main causes leading to surface cracks, is compared for the various conditions. It was found that the tangential stress and the temperature on the surface of hearth roll can be reduced by 51.9% and 26℃ if the shape of roll on collar is re-designed.

Fatigue Life Analysis on Multi-Stacked Film Under Thermal and Residual Stresses (열응력과 잔류응력하의 다층박막의 피로수명 해석)

  • Park Jun-Hyub
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.4 s.235
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    • pp.526-533
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    • 2005
  • Reliability problem in inkjet printhead, one of MEMS devices, is also very important. To eject an ink drop, the temperature of heater must be high so that ink contacting with surface reaches above $280^{o}C$ on the instant. Its heater is embedded in the thin multi-layer in which several materials are deposited. MEMS processes are the main sources of residual stresses development. Residual stress is one of the factors reducing the reliability of MEMS devices. We measured residual stresses of single layers that consist of multilayer. FE analysis is performed using design of experiment(DOE). Transient analysis for heat transfer is performed to get a temperature distribution. And then static analysis is performed with the temperature distribution obtained by heat transfer analysis and the measured residual stresses to get a stress distribution in the structure. Although the residual stress is bigger than thermal stress, thermal stress is more influential on fatigue life.

Thermal Stress Analysis of Spent Fuel Vol-oxidizer Furnace on the Internal Pressure (내부 압력변화에 대한 사용후핵연료 분말화장치 가열로의 열 응력 해석)

  • Kim, Y.H.;Jung, J.H.;Hong, D.H.;Park, B.S.;Lee, J.K.;Yoon, J.S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2006.05a
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    • pp.136-140
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    • 2006
  • We are developing a vol-oxidizer which transforms the spent $UO_2$ pellets into the $U_3O_8$ power through oxidizing process. The vol-oxidizer consists of furnace, filter, heater and valve etc. When the filter is blocked by the powder, the internal pressure of the furnace is increased owing to the air flow restriction. Then, the furnace vessel is swelled and deformed by it. In this paper, we proposed a procedure of the thermal analysis for furnace vessel design of spent fuel vol-oxidizer. In this work, we determined the thickness of the furnace through analyzing the internal pressure and the thermal stress of the furnace with respect to various pressure and temperature. To analyze the thermal stress, we used ANSYS 8.0 for constructing a FEM model of the furnace, and then analyzed it based on the ASME code. We also surveyed the material property and yield stress of SUS304 with various temperature. Analysis results are compared with the yield stress of the material. We manufactured the furnace and conduct the verification experiments.

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Evaluation of the Residual Stress on the Multi-layer Thin Film made of Different Materials (이종재료를 사용한 다층 박막에서의 잔류응력 평가)

  • 심재준;한근조;김태형;안성찬;한동섭;이성욱
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.9
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    • pp.135-141
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    • 2003
  • MEMS structures generally have been fabricated using surface-machining method, but the interface failure between silicon substrate and evaporated thin film frequently takes place due to the residual stress inducing by the applied the various loads. And the very important physical property in the heated environment is the linear coefficient of thermal expansion. Therefore this paper studied the residual stress caused the thermal loads in the thin film and introduced the simple method to measure the trend of the residual stress by the indentation. Specimens were made of materials such as Al, Au and Cu and thermal load was applied repeatedly. The residual stress was measured by nano-indentation using AFM and FEA. The existence of the residual stress due to thermal load was verified by the experimental results. The indentation length of the thermal loaded specimens increased minimum 11.8% comparing with the virgin thin film caused by tensile residual stress. The finite element analysis results are similar to indentation test.

N.M.for the Effect of P.T. on Resicual Stress Relaxation (잔류응력 완화에 미치는 상변태의 수치적 모델링)

  • 장경복;손금렬;강성수
    • Journal of Welding and Joining
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    • v.17 no.6
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    • pp.84-89
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    • 1999
  • Most of ferrous b.c.c weld materials may experience martensitic transformation during rapid cooling after welding. It is well known that volume expansion due to the phase transformation could influence on the relaxation of welding residual stress. To apply this effect practically, it is a prerequisite to establish a numerical model which is able to estimate the effect of phase transformation on residual stress relaxation quantitatively. For this purpose, the analysis is carried out in two regions. i.e., heating and cooling, because the variation of material properties following a phase transformation in cooling is different in comparison with the case in heating, even at the same temperature. The variation of material properties following phase transformation is considered by the adjustment of specific heat and thermal expansion coefficient, and the distribution of residual stress in analysis is compared with that of experiment by previous study. consequently, in this study, simplified numerical procedures considering phase transformation, which based on a commercial finite element package was established through comparing with the experimental data of residual stress distribution by other researcher. To consider the phase transformation effect on residual stress relaxation, the transition of mechanical and thermal property such as thermal expansion coefficient and specific heat capacity was found by try and error method in this analysis.

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Thermal Stress Analysis of Piping Systems in Steam-driven Power Engines (증기 동력기관 내 배관시스템의 열응력 해석)

  • Kim, C.H.;Chung, H.T.;Bae, J.S.;Jung, I.S.;Lee, S.S.
    • Journal of Power System Engineering
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    • v.13 no.6
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    • pp.35-42
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    • 2009
  • The piping systems in the steam-driven power engines lie under the cyclic condition of thermal expansion and contraction by superheated steam. These phenomena might cause some severe damages on the pipes and the accessory devices. To avoid these damages, the calculation of the proper strength and the consideration of the reduced resultant forces on the materials are needed. In the present study, numerical investigations on the effects of the thermal deformation of the industrial piping system were performed with comparison of the design data. Commercial software, ABAQUS with the thermal-fluidic loadings based on the design conditions was used for the thermal stress analysis of the piping system. From the analysis of the initially-designed pipe supporters, the rearrangement was suggested to improve the piping design.

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Analysis of the fluid-solid-thermal coupling of a pressurizer surge line under ocean conditions

  • Yu, Hang;Zhao, Xinwen;Fu, Shengwei;Zhu, Kang
    • Nuclear Engineering and Technology
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    • v.54 no.10
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    • pp.3732-3744
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    • 2022
  • To investigate the effects of ocean conditions on the thermal stress and deformation caused by thermal stratification of a pressurizer surge line in a floating nuclear power plant (FNPP), the finite element simulation platform ANSYS Workbench is utilized to conduct the fluid-solid-thermal coupling transient analysis of the surge line under normal "wave-out" condition (no motion) and under ocean conditions (rolling and pitching), generating the transient response characteristics of temperature distribution, thermal stress and thermal deformation inside the surge line. By comparing the calculated results for the three motion conditions, it is found that ocean conditions can significantly improve the thermal stratification phenomenon within the surge line, but may also result in periodic oscillations in the temperature, thermal stress, and thermal deformation of the surge line. Parts of the surge line that are more susceptible to thermal fatigue damage or failure are determined. According to calculation results, the improvements are recommended for pipeline structure to reduce the effects of thermal oscillation caused by ocean conditions. The analysis method used in this study is beneficial for designing and optimizing the pipeline structure of a floating nuclear power plant, as well as for increasing its safety.

The Temperature Distribution and Thermal Stress Analysis of Mold transformer (주상용 몰드변압기의 온도분포와 열응력 해석)

  • 조한구;이운용;한세원
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.387-390
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    • 2000
  • The life of transformer is significantly dependent on the thermal behavior in windings. To analyse winding temperature rise, many transformer designer have calculated temperature distribution and hot spot point by finite element method(FEM). Recently, numerical analyses of transformer are studied for optimum design, that is electric field analysis, magnetic field, potential vibration, thermal distribution and thermal stress. Therefore design time and design cost are decreased by numerical analysis. In this paper, the temperature distribution and thermal stress analysis of 50kVA pole cast resin transformer for power distribution are investigated by FEM program. The temperature change according to load rates of transformer also have been investigated. We have carried out temperature rise test and test results are compared with simulation data.

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Thermal Ratchetting of the Conductive Adhesives Joints Subjected to the Thermal Cycles (전도성 접착제의 열경화 응력에 대한 해석)

  • 박주혁;서승호
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.208-213
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    • 2002
  • When a thermoset conductive adhesive joints are subjected to the thermal cycles, the thermal stresses are developed around the joints. Most of in-plane, hi-axial components of these residual stresses induces large tensile peel stresses and weakens adhesive joints. Also these stresses vary with thermal cycles, and result in thermal fatigue loading and debonding propagation. In this study, the thermal ratchetting effect in conductive adhesive joints are evaluated by the finite element analysis with the viscoelastic material model. In order to Investigate the relationship between thermal ratchetting and glass transition temperature, the mathematical material model has been developed experimentally by dynamic mechanical analysis. These material models are implemented to the finite element analysis with thermal loading cycles. And the stress profiles around the conductive adhesive joints are calculated. It has been observed that the thermal ratchetting occurs when the maximum temperature of thermal cycles is above the glass transition temperature. The peel and shear stress components increase as the thermal loading time increases. This will contributes to thermal fatigue fracture of the joints.

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A Study on the Mechanical Properties of EMC and Thermal Stress Anlaysis in Electronic Packagings (전자패키지용 EMC의 기계적 성질 및 패키지내의 열응력해석)

  • Shin, Dong-Kil;Lee, Jung-Ju
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.11
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    • pp.3538-3548
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    • 1996
  • In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.