• 한국신뢰성학회지:신뢰성응용연구
• /
• 제7권2호
• /
• pp.45-55
• /
• 2007

In this study, two types of fatigue tests were conducted. Firs, cyclic bending tests were performed using the micro-bending tester. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. Creep deformation was dominant in thermal fatigue and plastic deformation was main parameter for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• 대한기계학회논문집A
• /
• 제33권4호
• /
• pp.380-387
• /
• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• 마이크로전자및패키징학회지
• /
• 제21권2호
• /
• pp.23-29
• /
• 2014

Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.

• 한국신뢰성학회:학술대회논문집
• /
• 한국신뢰성학회 2011년도 춘계학술발표대회 논문집
• /
• pp.99-106
• /
• 2011

In this study, the analysis technique, which can estimate the temperature rise and thermal deformation of the ventilated disc considering the vehicle information, braking condition and properties of the disc and pad, is developed. The analytical process of the braking power generation during braking is mathematically derived. The thermal energy, which is applied to the surface of a disc as heat flux, is calculated. Then, the temperature rise and thermal deformation of a disc are estimated using FE software, SAMCEF. Shape of the cross section of the disc is optimized according to the response surface analysis method in order to minimize the temperature rise and thermal deformation. The hot judder analysis is done using the optimized disc, and the analysis results are discussed.

• 한국신뢰성학회지:신뢰성응용연구
• /
• 제6권2호
• /
• pp.173-186
• /
• 2006

This paper presents a study on the failure mechanism for optical engine of Projection TV. The lenses of which optical engine composes are failed by various environmental conditions, that is, thermal effect, moisture effect, mechanical shock or chemical effect. By surveying on actual TV working condition, the major factor of failure was turned out the thermal effect. Because the actual surface temperature of optical engine rose at max. $51^{\circ}C$ during it worked, the relative humidity around optical engine was kept at less than 20% that is difficult to do chemical reaction with humidity. Therefore we can make a conclusion that the major failure of optical engine resulted from thermal effect.

• 한국신뢰성학회지:신뢰성응용연구
• /
• 제18권3호
• /
• pp.260-270
• /
• 2018

Purpose: The purpose of this study is to evaluate the life of the capsule, which is a core part of the heat storage cooling system. This paper will develop a life test mode that can reproduce environment conditions through the analysis of capsule shrinkage and expansion characteristics. Methods: In order to determine the life test mode of the capsule, this paper analyzed the case of field failures and analyzed the deformation characteristics according to the pressure fluctuation of the capsule. The method to find out whether the field failure and deformation analysis results are consistent is the testing with the construction of the repetition pressure test equipment and the thermal cycle test to reproduce the freezing and thawing characteristics. Results: In this study, failure mode analysis and analysis of freezing and thawing characteristics regarding to the capsule positions were completed. Based on this test & analysis results, this paper have been able to determine the main parameters for determining the life test mode, the freezing and thawing time. Conclusion: Determining the lifetime mode of the capsule can be used to improve the life and performance of the thermal storage system.

• 한국군사과학기술학회지
• /
• 제20권1호
• /
• pp.40-47
• /
• 2017

To classify the vehicle targets automatically using thermal images, there are usually two main categories of feature extraction method, local and shape feature extraction methods. Since thermal images have less texture information than color images, the shape feature extraction method is useful when the segmentation results are correct. However, if there are some errors in target segmentation, the shape feature may contain some errors, then the classification accuracy can be decreased. To overcome these problems, in this paper, we propose the segmentation reliability estimation method for target classification. The segmentation reliability can be estimated by using the difference information of average intensities and edge energies between the target and the background area. The estimated segmentation reliability is applied in the decision level fusion method of classification results using both shape and local features. Experiment results using the thermal images of the vehicle targets (main battle tank, armored personnel carrier, military truck, and an estate car) show that the proposed classification method and the segmentation reliability estimation method have a good performance in classification accuracy.

• Journal of Welding and Joining
• /
• 제24권6호
• /
• pp.21-27
• /
• 2006

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

• Journal of Welding and Joining
• /
• 제17권1호
• /
• pp.124-132
• /
• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• 폴리머
• /
• 제29권1호
• /
• pp.96-101
• /
• 2005

PTFE 및 PFA 등의 불소수지는 최대 연속 사용 온도가 260$^{\circ}C$에 달하는 고온 내열성 고분자 소재로서, 본 연구에서 수행된 280 $^{\circ}C$, 7주 간의 열노화에 의해서도 충분한 열적 안정성이 유지됨을 관측하였다. 그러나 기계적 강도, 융점 및 열분해 개시 온도 등의 소재적 물성이 유지됨을 의미하는 상기한 열적 안정성은 본 연구에서 수행된 코팅막으로서의 표면접촉각, 미세 모폴로지, 내스크래치성 분석에 의한 방법을 기준하면 충분하지 못하다는 것이 확인 되었다. 공기 치환율이 제어되는 기어식 노화시험기로 진행된 불소수지 코팅막의 280 $^{\circ}C$ 열노화에 대한 분석의 결과는 심각한 표면 모폴로지의 손상과 금속기재에 대한 접착력의 손실을 지적하고 있다.