• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.7-15
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• 2008

In this paper, the Chip-On-Flex (COF) assembly process using anisotropic conductive films (ACFs) was investigated and the reliability of COF assemblies using ACFs was evaluated. Thermo-mechanical properties of ACFs such as coefficient of thermal expansion (CTE), storage modulus (E'), and glass transition temperature $(T_g)$ were measured to investigate the effects of ACF material properties on the reliability of COF assemblies using ACFs. In addition, the bonding conditions for COF assemblies using ACFs such as time, temperature, and pressure were optimized. After the COF assemblies using ACFs were fabricated with optimized bonding conditions, reliability tests were then carried out. According to the reliability test results, COF assemblies using the ACF which had lower CTE and higher $T_g$ showed better thermal cycling reliability. Consequently, thermo-mechanical properties of ACFs, especially $T_g$, should be improved for high thermal cycling reliability of COF assemblies using ACFs for compact camera module (CCM) applications.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.2
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• pp.54-61
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• 2004

The engine-out flow is highly transient and hot, and may place tremendous thermal and inertial loads on a closed-coupled catalyst. Therefore, time-dependent and detailed flow and thermal field simulation may be crucial. The aim of this study is to develop combined chemical reaction and multi-dimensional fluid dynamic mathematical model and to study the effect of unsteady pulsating thermal and flow characteristics on thermal reliability of closed-coupled catalyst. The effect of cell density on the conversion performance under real running condition is also investigated. Unlike previous studies, the present study focuses on coupling between the problems of pulsating flow pattern and catalyst thermal response and conversion efficiency. The results are expressed in terms of temporal evolution of flow, pollutant and temperature distribution as well as transient characteristics of conversion efficiency. Fundamental understanding of the flow and thermal phenomena of closed-coupled catalyst under real running condition is presented. It is shown that instants of significantly low values of flow uniformity and conversion efficiency exist during exhaust blowdown and the temporal varaition of flow uniformity is very similar in pattern to one of conversion efficiency. It is also found that the location of hot spot in monolith is directly affected by transient flow pattern in closed-coupled catalyst.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.630-633
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and BGA solder joint s failure. The first order Taylor series expansion of the limit state function incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. A model based on plastic-strain rate such as the Coffin-Manson Fatigue Model is utilized in this study. The effects of random variables such as frequency, maximum temperature, and temperature variations on the failure probability of the BGA solder joint are systematically investigated by using a failure probability model with the first order reliability method(FORM).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.8
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• pp.625-631
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• 2009

In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.

• Journal of Ocean Engineering and Technology
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• v.12 no.1
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• pp.58-64
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• 1998

An analysis method for the reliability of ceramic structures subjected to thermal shocks is presented. Flaws with the size of given probability distribution function are assumed to be distributed at random with a certain density per unit volume in the structures. Criterions for crack instability are derived for brittle solids under general thermal stresses. A probabilistic failure model is presented to study the probability of crack instability for brittle solids containing cracks with uncertain size. The reliabilities of brittle structures are evaluated based on the weakest-link hypothesis, which states that a structure fails when the cracks in any differential volume become unstable. A numerical example is given to demonstrate the application of the proposed method.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.678-682
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• 2007

It is conducted that study on corner crack protection for various thermal environment in a flat panel display. Most of the consumer electronics consist of a plastic and a metal structure. And different properties of materials could cause failure of structural reliability due to the various operating temperatures. Especially for front bezel with thin and slender structure, the effect of temperature is significant, and the design for crack protection is crucial for thermal reliability of displays. In this study, it is prescribed the behavior of the front bezel in flat panel display for various operation temperatures and proposed design parameters to ensure the structural reliability of displays.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.954-958
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• 1996

An analysis method for the reliability of ceramic structures subjected to thermal shocks is presented, Flaws with the size of given probability distribution function are assumed to be distributed at random with a certain density per unit volume in the structures. Criterions for crack instability are derived for brittle solids under general thermal stresses. A probabilistic failure model is presented to study the probability of crack instability for blittle solids containing cracks with uncertain crack size. The reliabilities of brittle structures are evaluated based on the weakest-link hypothesis, which states that a structure fails when the cracks in any differential volume become unstable. A numerical example is given to demonstrate the application of the proposed method.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• Polymer(Korea)
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• v.29 no.5
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• pp.508-517
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• 2005

The thermal degradation behavior and reliability analysis were investigated using dynamic thermogravimetric analysis (TGA) and accelerated degradation test (ADT) to characterize the dynamic parameters related to thermal degradation of plastic meterials for household electric appliances. In addition, the weathering of the plastic were performed by ADT using Xenon uc, and the color difference of the samples after ADT were measured with Color Eye 3010 specoophotometer. he activation energy for thermal degradation of the samples increased with increasing the rate of weight loss. The Kim-Park method was found to be more effective analysis in describing thermal degradation of plastic meterials. Plastic materials were very sensitive to ultra-violet rays in faster degradation.