• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.04b
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• pp.11-11
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• 2002

Plastic deformation was observed by TEM around the intragranular SiC particles in the $Al_2O_3$ matrix for $Al_2O_3/SiC$ nanocomposite system. The dislocations are generated at selected planes and there is a tendency for the dislocations to form a subgrain boundary structure with low-angel grain boundaries and networks. In this study, dislocation generated in the $Al_2O_3$ matrix during cooling down from sintering temperatures by the highly localized thermal stresses within and/or around SiC particles caused from the thermal expansion mismatch between $Al_2O_3$ matrix and SiC particle was observed. In monolithic $Al_2O_3$ and $Al_2O_3/SiC$ microcomposite system. These phenomena is closely related to the plastic relaxation of the elastic stress and strain energy associated with both thermal misfitting inclusions and creep behaviors. The plastic relaxation behavior was explained by combination of yield stress and internal stress.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.4
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• pp.396-403
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• 2004

The dielectric properties of Y-ray irradiated and thermally aged polyetheretherketone (PEEK) have been investigated. Results of the temperature dependency of dielectric properties indicated that the glass transition temperature of aged PEEK increased as radiative and thermal ageing. The frequency dependency of dielectric properties implied that the magnitude of radiation and thermal induced dipoles, ions increased as radiative and thermal ageing. The values of relaxation intensity calculated using Cole-Cole's circular arc can be useful for evaluation of degradation level of PEEK.

• Proceedings of the KIEE Conference
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• 1998.07c
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• pp.1003-1005
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• 1998

We present the implementation of a Lagrangian Relaxation based large scale thermal Unit Commitment problem. The problem is decomposed into thermal subproblem by using Lagrangian multipliers. The thermal subproblem is solved by using dynamic programmmg. we perform a numerical test using the thermal system of KEPCO over a week (168 hours) period. The programming language used for the test program is C. The result is compared with the priority list method.

• Steel and Composite Structures
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• v.48 no.6
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• pp.641-648
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• 2023

In this article, we explore the issue concerning semiconductors half-space comprised of materials with varying thermal conductivity. The problem is within the framework of the generalized thermoelastic model under one thermal relaxation time. The half-boundary space's plane is considered to be traction free and is subjected to a thermal shock. The material is supposed to have a temperature-dependent thermal conductivity. The numerical solutions to the problem are achieved using the finite element approach. To find the analytical solution to the linear problem, the eigenvalue approach is used with the Laplace transform. Neglecting the new parameter allows for comparisons between numerical findings and analytical solutions. This facilitates an examination of the physical quantities in the numerical solutions, ensuring the accuracy of the proposed approach.

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.8
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• pp.1165-1173
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• 2003

The effects of (1) phonon dispersion on thermal conductivity model and (2) differentiation of group velocity and phase velocity are examined for germanium. The results show drastic change of thermal conductivity regardless of the same relaxation time model. Also the contribution of transverse acoustic (TA) phonon and longitudinal acoustic (LA) phonon on the thermal conductivity at high temperatures is reassessed by considering more rigorous dispersion model. Holland model, which is commonly used for modeling thermal conductivity, underestimates the scattering rate for TA phonon at high frequency. This leads the conclusion that TA is dominant heat transfer mode at high temperatures. But according to the rigorous consideration of phonon dispersion, the reduction of thermal conductivity is much larger than the estimation of Holland model, thus the TA at high frequency is expected to be no more dominant heat transfer mode. Another heat transfer mechanism may exist at high temperatures. Two possible explanations we the roles of (1) Umklapp scattering of LA phonon at high frequency and (2) optical phonon.

• Steel and Composite Structures
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• v.21 no.4
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• pp.791-803
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• 2016

In this article, the problem of a two-dimensional thermoelastic half-space are studied using mathematical methods under the purview of the generalized thermoelastic theory with one relaxation time is studied. The surface of the half-space is taken to be thermally insulated and traction free. Accordingly, the variations of physical quantities due to by laser pulse given by the heat input. The nonhomogeneous governing equations have been written in the form of a vector-matrix differential equation, which is then solved by the eigenvalue approach. The analytical solutions are obtained for the temperature, the components of displacement and stresses. The resulting quantities are depicted graphically for different values of thermal relaxation time. The result provides a motivation to investigate the effect of the thermal relaxation time on the physical quantities.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.12
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• pp.1494-1500
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• 2004

A zero-dimensional direct simulation Monte Carlo(DSMC) model is developed for simulating diatomic gas including vibrational kinetics. The method is applied to the simulation of two systems: vibrational relaxation of a simple harmonic oscillator and translational-rotational-vibrational energy exchange process under heating and cooling. In the present DSMC method, the variable hard sphere molecular model and no time counter technique are used to simulate the molecular collision kinetics. For simulation of diatomic gas flows, the Borgnakke-Larsen phenomenological model is adopted to redistribute the translational and internal energies.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.10 s.181
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• pp.2552-2559
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• 2000

Most of ferrous b.c.c weld materials have martensitic transformation during rapid cooling after welding. It is well known that volume expansion due to the phase transformation could influence on the relaxation of welding residual stress. To apply this effect practically, it is necessary to establish a numerical model which is able to estimate the effect of phase transformation on residual stress relaxation quantitatively. For this purpose, the analysis is carried out in two regions, i.e., heating and cooling, because the variation of material properties following a phase transformation in cooling is different in comparison with the case in heating, even at the same temperature. The variation of material properties following phase transformation is considered by the adjustment of specific heat and thermal expansion coefficient, and the distribution of residual stress in analysis is compared with that of experiment by previous study. In this study, simplified numerical procedures considering phase transformation, which based on a commercial finite element package was established through comparing with the experimental data of residual stress distribution by other researcher. To consider the phase transformation effect on residual stress relaxation, the transition of mechanical and thermal property such as thermal expansion coefficient and specific heat capacity was found by try and error method in this analysis. In addition to, since the transformation temperature changes by the kind and control of alloying elements, the steel with many kinds of transformation temperature were selected and the effect of transformation on stress releasement was investigated by the numerical procedures considering phase transformation.

• Transactions of the Korean Society of Automotive Engineers
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• v.3 no.1
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• pp.1-12
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• 1995

Isothermal and thermal-mechanical fatigue characteristics of 12Cr heat resisting steel used for high temperature applications were investigated including hold time effects. Isothermal low cycle fatigue test at $600^{\circ}C$ and in-phase, out-of-phase thermal-mechanical fatigue test at 350 to $600^{\circ}C$ were conducted using smooth cylindrical hollow specimen under strain-control with total strain ranges from 0.006 to 0.015. Regardless of thermal-mechanical and isothermal fatigue tests, cyclic softening behavior was observed and much more pronounced in the thermal-mechanical fatigue tests with hold times due to the stress relaxation during the hold time. The phase difference between temperature and strain in thermal-mechanical fatigue tests resulted in significantly shorter fatigue life for out-of-phase compared to in-phase. The differences in fatigue lives were dependent upon the magnitudes of plastic strain ranges and mean stresses. During the hold time in the strain-controlled fatigue tests, the increase in the plastic strain range and the stress relaxation were observed. It appeared that the increase in plastic strain range per cycle and the introduction of creep damage made important contributions to the reduction of thermal-mechanical fatigue life with hold time, and the life reduction tendency was more remarkable in the in-phase than in the out-of-phase thermal-mechanical fatigue. Isothermal fatigue tests performed under the combination of fast and slow strain rates at $600^{\circ}C$ showed that the fatigue life decreased as the strain rate and frequency decreased,especially for the low strain ranges.