• 제목/요약/키워드: thermal processes

검색결과 1,091건 처리시간 0.024초

휘발성 유기물질의 고효율 열산화 시스템 개발 연구 (Study on the Development of Recuperative Thermal Oxidation System for the Volatile Organic Compounds)

  • 현주수;이시훈;이종섭;민병무
    • 한국연소학회:학술대회논문집
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    • 한국연소학회 2004년도 제29회 KOSCI SYMPOSIUM 논문집
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    • pp.225-230
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    • 2004
  • Volatile organic compounds (VOCs) are low calorific value gases (LCVG) emitted from chemical processes such as painting booth, dye works and drying processes etc. Characteristics of VOCs are low calorific values less than 150 kcal/$m^3$, high activation energy for ignition and low energy output. These characteristics usually make combustion unstable and its treatment processes needs high-energy consumption, The cyclone combustion system is suitable for LCVG burning because it can recirculate energy through a high swirling flow to supply the activation energy for ignition, increases energy density to make a combustion temperature higher than usual swirl combustor and also increases mixing intensity, This research was conducted to develop optimized cyclone combustion system for thermal oxidation of VOCs. This research was executed to establish the effect of swirl number with respect to the combustion temperature and composition of exhausted gas in the specific combustor design.

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Unsteady heat exchange at the dry spent nuclear fuel storage

  • Alyokhina, Svitlana;Kostikov, Andrii
    • Nuclear Engineering and Technology
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    • 제49권7호
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    • pp.1457-1462
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    • 2017
  • Unsteady thermal processes in storage containers with spent nuclear fuel were modeled. The daily fluctuations of outer ambient temperatures were taken into account. The modeling approach, which is based on the solving of conjugate and inverse heat transfer problems, was verified by comparison of measured and calculated temperatures in outer channels. The time delays in the reaching of maximal temperatures for each spent fuel assembly were calculated. Results of numerical investigations show that daily fluctuation of outer temperatures does not have a large influence on the maximal temperatures of stored spent fuel, so that fluctuation can be neglected and only daily average temperature should be considered for safety estimation using the "best estimation" approach.

Characterization of Artificial Graphite Electrodes

  • Park, Sei-Min;Han, Sang-Moo;Oh, Seh-Min
    • Carbon letters
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    • 제1권2호
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    • pp.76-81
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    • 2000
  • Physical properties of artificial graphite electrodes were evaluated along three different directions; circumferential (X), radial (Y), and axial (Z) directions. Four kinds of commercial electrode products were used in this study for the evaluation; pole (AP) and nipple (AN) of manufacturer A, pole (BP) and nipple (BN) of manufacturer B. The mechanical, electrical, and thermal properties in X and Y directions were very similar to each other. In Z direction, however, the mechanical properties, including flexural strength and compressive strength, were higher, and electric resistance and thermal expansion were much lower than those in the other directions. The microstructures observed by optical microscope and scanning electron microscope revealed that the differences in properties by the measuring direction were caused by the preferential alignment of needle cokes along the Z direction. When comparing the properties of the electrode samples in the same direction, the mechanical properties mainly depended on the bulk density or porosity of the samples as well as preferential alignment of needle cokes.

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Characterizations of Interface-state Density between Top Silicon and Buried Oxide on Nano-SOI Substrate by using Pseudo-MOSFETs

  • Cho, Won-Ju
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제5권2호
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    • pp.83-88
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    • 2005
  • The interface-states between the top silicon layer and buried oxide layer of nano-SOI substrate were developed. Also, the effects of thermal treatment processes on the interface-state distributions were investigated for the first time by using pseudo-MOSFETs. We found that the interface-state distributions were strongly influenced by the thermal treatment processes. The interface-states were generated by the rapid thermal annealing (RTA) process. Increasing the RTA temperature over $800^{\circ}C$, the interface-state density considerably increased. Especially, a peak of interface-states distribution that contributes a hump phenomenon of subthreshold curve in the inversion mode operation of pseudo-MOSFETs was observed at the conduction band side of the energy gap, hut it was not observed in the accumulation mode operation. On the other hand, the increased interface-state density by the RTA process was effectively reduced by the relatively low temperature annealing process in a conventional thermal annealing (CTA) process.

용탕유동과 응고를 고려한 주조공정의 유한요소해석

  • 윤석일;김용환
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 춘계학술대회 논문집
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    • pp.620-625
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    • 1995
  • Finite element analysis tool was developed to analyze the casting process. Generally, casting processes consists of mold filling and solifification. In order to investigate the effects of process variables and to predict the defects, both filling and solidiffication process were simulated simultaneously. At filling process, especiallywe consider thermal coupling to investigate thermal history of material during the filling stage. And thermal condition at the final stage of filling is used as the initial conditions in a solidification process for the exact simulation of the actual casting processes. At mold filling process, Lagrangian-type finite element method with automatic remashing scheme was used to find the material flow. To avoid numerical instability in low viscous fluid, a perturbation method with artificial viscosity is adopted. At solififfication process, enthalpy-based finite element method was used to solve the heat transfer problem with phase change. And elastic stress analysis has been performed to predict the thermal residual stress. Through the FE analysis, solidiffication time, position of solidus line, liquidus line and thermal residual stress are studied. Finite element tools developed in this study will be used process design of casting process and maybe basic structure for total CAE system of castigs which will be constructed afterward.

비흡입시 연소하는 담배의 열분해 작용에 관한 수학적 모델 (A Mathematical Model for Pyrolysis Processes During Unforced Smoldering of Cigarette)

  • 이성철
    • 한국연초학회지
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    • 제17권2호
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    • pp.160-169
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    • 1995
  • A mathematical model for the pyrolysis processes during unforced smoldering of cigarette was proposed in this study by analyzing the physical model of the smoldering cigarette (including the establishment of burning front between burning zone and pyrolysis zone, and analyzing the involvement of main factors such as pyrolysis of virgin tobacco, evaporation of water, and internal heat transport in the processes). Thermal conduction of cigarette paper and convective and radiative heat transfer at the outer surface were also considered via the thermal resistance law for the competitive heat transfer mechanisms. The governing partial differential equations were solved using an integral method. Model predictions of smoldering speed, or linear burn rate, as well as temperature and density profiles in the pyrolysis zone for different kinds of cigarettes were found to be close to the experimental data in the literature (Muramatsu, 1981). The model provides a relatively fast and efficient way to simulate the pyrolysis processes and offers a practical tool for exploring important parameters for a smoldering cigarette, such as blended tobacco composition, properties of cigarette paper, and heat flux from the burning zone to the pyrolysis zone.

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Electro-Micromechanical 시험법을 이용한 탄소 섬유 강화 에폭시아크릴레이트 복합재료의 자외선과 열경화에 따른 경화 모니터링 및 비파괴적 계면 평가 (Nondestructive Interfacial Evaluation and Cure Monitoring of Carbon Fiber/Epoxyacrylate Composite with UV and Thermal Curing Using Electro-Micromechanical Technique)

  • 박종만;공진우;김대식;이재락
    • 폴리머
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    • 제27권3호
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    • pp.189-194
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    • 2003
  • Electro-micromechanical 시험법을 이용하여 탄소 섬유 강화 열경화성 수지 복합재료의 경화 방법에 따른 계면 평가와 손상 감지능 및 경화 모니터링에 대해 고찰하였다. 경화 후 잔류 응력은 전기 저항 측정을 통해 모니터링 하였으며, 경화 방법에 따라 상호 비교하였다. 기지 재료의 인장 강도, 탄성률 및 계면 전단 강도는 열 경화의 경우가 자외선 경화보다 더 크게 나타났으며, 열 경화에서 경화 수축은 열팽창 계수 차이에 의한 잔류 응력 및 기지 재료의 수축에 의해 자외선 경화와 비교하여 더 크게 나타났다. 열 경화 시의 경화 중 전기 저항은 자외선 경화보다 더 큰 범위에서 변하였으며, 기지 재료의 기계적 물성과 계면 접착력에 의해 다르게 나타나는 겉보기 탄성률 또한 더 컸고, 같은 응력까지 더 빠르게 도달하였다.

국부가열에 의한 Tension Mask 의 열변형 해석 및 전자빔의 오착 예측 (Analysis of Tension Mask Thermal Deformations under Localized Heating and Prediction of Electron Beam Landing Shifts)

  • 신운서;유세준;장보웅
    • 한국정밀공학회지
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    • 제16권8호
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    • pp.138-148
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    • 1999
  • Thermal deformations of tension mask under localized heating are analyzed using finite element method and electron beam landing shifts are predicted by the analysis results. In CRT, electron beam landing shifts due to thermal deformations of the tension mask make the color purity of screen worse. In order to get the final results of thermal deformations, firstly the tension processes of the mask and following welding processes between the tensional mask and rail must be analyzed sequentially. And then, nonlinear transient thermo-elastic finite element analysis is performed on every part inside CRT including tension mask, wherein thermal radiation is a main heat transfer mechanism. Because the tension mask has numerous slits, the effective thermal conductivity and effective and effective elastic modulus is calculated, and the tension mask is modeled as a shell without slits. From the displacement results of tension mask, electron beam landing shifts is calculated directly. Experiments are performed to confirm our analysis results. Temperature distributions and beam landing shifts of tension mask are measured and the results are in good agreement with those of analyses.

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SOI 웨이퍼의 열적거동 해석 (Thermal Behaviors Analysis for SOI Wafers)

  • 김옥삼
    • 한국마린엔지니어링학회:학술대회논문집
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    • 한국마린엔지니어링학회 2000년도 춘계학술대회 논문집(Proceeding of the KOSME 2000 Spring Annual Meeting)
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    • pp.105-109
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    • 2000
  • Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor the size of the pressure sensor diaphragm have become smaller year by year and a microaccelerometer with a size less than 200-300${\mu}m$ has been realized. In this paper we study some of the micromachining processes of SOI(silicon on insulator)for the microaccelerometer and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in structural engineering discipline for design of SOI wafers. Successful thermal behaviors analysis and design of the SOI wafers based on the tunneling current concept using SOI wafer depend on the knowledge abut normal mechanical properties of the SCS(single crystal silicon)layer and their control through manufacturing process

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우유와 유제품의 살균기술 (Pasteurization of dairy products)

  • 최효수;오남수
    • 식품과학과 산업
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    • 제53권3호
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    • pp.256-263
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    • 2020
  • Milk pasteurization is used to destroy harmful bacteria present in the raw milk for improvement of the keeping quality of dairy products. It is generally carried out in dairy industries as the heating process of raw milk in properly designed and operated equipment to a specific temperature for a specified a specified period. However, thermal processing may cause quality changes in milk as well as significant nutritional losses. Hence, many researchers have started work to design alternative strategies to produce safer foods with minimal thermal treatments for pasteurization. Therefore, the present paper shows the current status of commercial pasteurization system of dairy products in korean industry and the research efforts carried out by researchers on novel milk pasteurization system that could be an alternative to traditional thermal processes for maintaining the freshness of dairy products.