• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.293.1-293.1
• /
• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.54-54
• /
• 2009

Ag thick film has been used for electrode materials with the excellent conductivity. Ag electrode is used in screen-printed silicon solar cells as a electrode material. Compared to photolithography and buried-contact technology, screen-printing technology has the merit of fabricating low-priced cells and enormous cells in a few hours. Ag paste consists of Ag powders, vehicles and additives such as frits, metal powders (Pb, Bi, Zn). Frits accelerate the sintering of Ag powders and induce the connection between Ag electrode and Si wafer. Thermophysical properties of frits and reactions among Ag, frits and Si influence on cell performance. In this study, Ag pastes were fabricated with adding different kinds of frits. After Ag pastes were printed on silicon wafer by screen-printing technology, the cells were fired using a belt furnace. The cell parameters were measured by light I-V to determine the short-circuit current, open-circuit voltage, FF and cell efficiency. In order to study the relationship between the reactivity of Ag, frit, Si and the electrical properties of cells, the reaction of frits and Si wafer on was studied with thermal properties of frits. The interface structure between Ag electrode and Si wafer were also measured for understanding the reactivity of Ag, frit and Si wafer. The excessive reactivity of Ag, frit and Si wafer certainly degraded the electrical properties of cells. These preliminary studies suggest that reactions among Ag, frits and Si wafer should optimally be controlled for cell performances.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.56 no.9
• /
• pp.1609-1613
• /
• 2007

(Ba,Sr,Ca)$TiO_3$ powders, which were prepared by sol-gel method using a solution of Ba-, Sr- and Ca-acetate and Ti iso-propoxide, were mixed with organic vehicle and the BSCT thick films were fabricated by the screen-printing techniques on high purity alumina substrates. The structural and dielectirc properties were investigated for various $Dy_2O_3$ doping contents. As a result of thermal analysis, the exothermic peak was observed at around 670^{\circ}C $ due to the formation of the polycrystalline perovskite phase. All BSCT thick films, sintered at $1420^{\circ}C$ for 2h, showed the typical XRD patterns of perovskite polycrystalline structure and no pyrochlore phase was observed. The average grain size of the specimens decreased with increasing amount of $Dy_2O_3$. The average grain size and thickness of the BSCT specimens doped with 0.1 mol% $Dy_2O_3$ were approximately $1.9{\mu}m$ and $70{\mu}m$, respectively. The relative dielectric constant decreased and dielectric loss increased with increasing amount of $Dy_2O_3$, the values of the BSCT thick films doped with 0.1 mol% $Dy_2O_3$ were 3697 and 0.4% at 1 kHz, respectively. The leakage current densities in all BSCT thick films were less than $10^{-9}A/cm^2$ at the applied electric field range of 0-20 kV/cm.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2011.10a
• /
• pp.25.1-25.1
• /
• 2011

Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.

• Journal of Powder Materials
• /
• v.24 no.3
• /
• pp.187-194
• /
• 2017

Selective laser melting (SLM) can produce a layer of a metal powder and then fabricate a three-dimensional structure by a layer-by-layer method. Each layer consists of several lines of molten metal. Laser parameters and thermal properties of the materials affect the geometric characteristics of the melt pool such as its height, depth, and width. The geometrical characteristics of the melt pool are determined herein by optical microscopy and three-dimensional bulk structures are fabricated to investigate the relationship between them. Powders of the commercially available Fe-based tool steel AISI H13 and Ni-based superalloy Inconel 738LC are used to investigate the effect of material properties. Only the scan speed is controlled to change the laser parameters. The laser power and hatch space are maintained throughout the study. Laser of a higher energy density is seen to melt a wider and deeper range of powder and substrate; however, it does not correspond with the most highly densified three-dimensional structure. H13 shows the highest density at a laser scan speed of 200 mm/s whereas Inconel 738LC shows the highest density at 600 mm/s.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.17 no.3
• /
• pp.102-107
• /
• 2007

Dielectric layer of phosphate glass for plasma display panel (PDP) device made by silk screen printing on soda-lime glass. For regulate thermal expansion coefficient (CTE) of between substrate glass and dielectric layer use addition of $Al_2O_3$ and $TiO_2$. The crystallization process of glass-ceramics for dielectric layer have been examined by DTA, XRD some of optical, electrical properties of the dielectric layer were evaluated by UV-spectrometer, dilatometer, impedance analyser. The principal crystalline phase was identified as zinc metaphosphate [$Zn(PO_3)_2$] and zinc pyrophosphate [$Zn_2P_2O_7$]. Reflectance and dielectric constance increased with the addition of $TiO_2$ filler, dielectric constant lower the out side reflectance unchanging of the adding of $Al_2O_3$ filler. Besides CTE was at about $62{\times}10^{-7}/^{\circ}C$.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.14 no.3
• /
• pp.15-20
• /
• 2015

After the US government declared 3D printing technology a next-generation manufacturing technology, there have been many practical studies conducted to expand 3D printing technology to manufacturing technologies, called AMERICA MAKES. In particular, the Keck Center, located at the University of Texas at El Paso, has studied techniques for easily combing the 3D stacking process with space mobility and expanded these techniques to simultaneous staking techniques for multiple materials. Additionally, it developed convergence manufacturing techniques, such as direct inking techniques, in order to produce a module structure that combines electronic circuits and components, such as CUBESET. However, in these studies, it is impossible to develop a unified system using traditional independent through simple sequencing connections. This is because there are many problems in the integration between the stacking modeling of 3D printers and post-machining, such as thermal deformations, the precision accuracy of 3D printers, and independently driven coordinate problems among process systems. Therefore, in this paper, the integration method is suggested, which combines these 3D printers and subsequent machining process systems through an Internet-based cloud. Additionally, the sequential integrated system of a 3D printer, an NC milling machine, machine vision, and direct inking are realized.

• Journal of the Korean Ceramic Society
• /
• v.50 no.3
• /
• pp.195-200
• /
• 2013

Here, we report preparation of cyan ceramic nano-pigment for inkjet printing and the Ni substitutional effects on the cyan color. $MgAl_2O_4$ was selected as the crystalline host network for the synthesis of nickel-based cyan ceramic nano-pigments. Various compositions of $Ni_xMg_{1-x}Al_2O_4$ ($0{\leq}x{\leq}1$) powders were prepared using the polymerized complex method. The powder was then preheated at $400^{\circ}C$ for 5 h and finally calcined at $1000^{\circ}C$ for 5 h. XRD patterns of $Ni_xMg_{1-x}Al_2O_4$ showed a single phase of the spinel structure in all the compositions. The particle sizes ranged from 20 to 50 nm in TEM observations. The characteristics of the color tones of $Ni_xMg_{1-x}Al_2O_4$ were analyzed by UV-Visible spectroscopy and CIE $L^*a^*b^*$ measurement. CIE $L^*a^*b^*$ measurement results indicate that the pigment color changes from light cyan to deep cyan due to the decrease of the $a^*$ and $b^*$ values with an increase of an Ni substitutional amount. In addition, the thermal stability and the binding nature of $Ni_xMg_{1-x}Al_2O_4$ are also discussed using TG-DSC and FT-IR results respectively.

• The Journal of Advanced Prosthodontics
• /
• v.12 no.4
• /
• pp.218-224
• /
• 2020

PURPOSE. The objectives of this study were to evaluate the fracture strength and fracture patterns of provisional crowns fabricated from different materials and techniques after receiving stress from a simulated oral condition. MATERIALS AND METHODS. A monomethacrylate-based resin (Unifast Trad) and a bis-acryl-based (Protemp 4) resin were used to fabricate provisional crowns using conventional direct technique. A milled monomethacrylate resin (Brylic Solid) and a 3D-printed bis-acrylate resin (Freeprint Temp) were chosen to fabricate provisional crowns using the CAD/CAM process. All cemented provisional crowns (n=10/group) were subjected to thermal cycling (5,000 cycles at 5°-55℃) and cyclic occlusal load (100 N at 4 Hz for 100,000 cycles). Maximum force at fracture was tested using a universal testing machine. RESULTS. Maximum force at fracture (mean ± SD, N) of each group was 657.87 ± 82.84 for Unifast Trad, 1125.94 ± 168.07 for Protemp4, 953.60 ± 58.88 for Brylic Solid, and 1004.19 ± 122.18 for Freeprint Temp. One-way ANOVA with Tamhane post hoc test showed that the fracture strength of Unifast Trad was statistically significantly lower than others (P<.01). No statistically significant difference was noted among other groups. For failure pattern analysis, Unifast Trad and Brylic Solid showed less damage than Protemp 4 and Freeprint Temp groups. CONCLUSION. Provisional crowns fabricated using the CAD/CAM process and the conventionally fabricated bis-acryl resins exhibited significant higher fracture strength compared to conventionally fabricated monomethacrylate resins after the aging regimen. Therefore, CAD/CAM milling and 3D printing of provisional restorations may be good alternatives for long term provisionalization.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.15 no.2
• /
• pp.666-671
• /
• 2014

Using positive temperature coefficient (PTC) heater as supplementary heating for diesel engine vehicles with low heat source is a good method to enhance the heating performance during cold start. In this study, the PTC elements were made by using screen printing process for forming ohmic contact layer, and prototype of PTC heater was designed and made for a diesel engine vehicle. In process of designing the PTC heater, the thermal flow analysis of PTC element modules was conducted for verifying the effect of the shapes of contact surface between each of the components (cooling fin, insulator, ceramic element). We also investigated the performance characteristic (heating capacity, energy efficiency, pressure drop) of the PTC heater through the experiments. Therefore, the experimental results indicated that prototype of PTC heater had satisfactory performance. This study will be basis for improving the manufacturing process and increasing the performance of the PTC element and heater.