• Proceedings of the Korean Nuclear Society Conference
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• 2005.05a
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• pp.719-720
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• 2005

• Proceedings of the Korean Nuclear Society Conference
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• 2005.05a
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• pp.639-640
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• 2005

• Proceedings of the Korean Nuclear Society Conference
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• 2003.10a
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• pp.155.1-155.1
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• 2003

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.10
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• pp.1177-1186
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• 2009

High temperature steam pipes of thermal power plant are subject to a severe thermal range and usually operates well into the creep range. Cyclic operation of the plant subjects the piping system to mechanical and thermal fatigue damages. Also, poor or malfunctional supports can impose massive loads or stress onto the piping system. In order to prevent the serious damage and failure of the critical piping system, various inspection methods such as visual inspection, computational analysis and on-line piping displacement monitoring were developed. 3-dimensional piping displacement monitoring system was developed with using the aluminum alloy rod and rotary encoder sensors, this system was installed and operated on the high temperature steam piping of "Y" thermal power plant successfully. It is expected that this study will contribute to the safety of piping system, which could minimize stress and extend the actual life of critical piping.

• The KSFM Journal of Fluid Machinery
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• v.18 no.5
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• pp.33-41
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• 2015

Organic Rankine cycle (ORC) has been used to generate electrical or mechanical power from low-grade thermal energy. Usually, this thermal energy is not supplied continuously at the constant thermal energy level. In order to optimally utilize fluctuating thermal energy, an axial-type turbine was applied to the expander of ORC and two supersonic nozzle were used to control the mass flow rate. Experiment was conducted with various turbine inlet temperatures (TIT) with the partial admission rate of 16.7 %. The tip diameter of rotor was to be 80 mm. In the cycle analysis, the output power of ORC was predicted with considering the load dissipating the output power produced from the ORC as well as the turbine efficiency. The predicted results showed the same trend as the experimental results, and the experimental results showed that the system efficiency of 2 % was obtained at the TIT of $100^{\circ}C$.

• Journal of KIISE:Computer Systems and Theory
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• v.35 no.7
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• pp.354-360
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• 2008

Power-related issues have become important considerations in current generation microprocessor design. One of these issues is that of elevated on-chip temperatures. This has an adverse effect on cooling cost and, if not addressed suitably, on chip reliability. In this paper we investigate the general trade-offs between temporal and spatial hot spot mitigation schemes and thermal time constants, workload variations and microprocessor power distributions. By leveraging spatial and temporal heat slacks, our schemes enable lowering of on-chip unit temperatures by changing the workload in a timely manner with Operating System (OS) and existing hardware support.

• 한국태양에너지학회:학술대회논문집
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• 2011.04a
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• pp.25-30
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• 2011

In this paper, we analyzed the electrical characteristics with Micro-cracks in Photovoltaic module. Micro cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. And The solar cells have to with stand the stress under out door operation in the finished module. Here the mechanical stress is induced by temperature changes and mechanical loads from wind and snow. So, we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because micro-cracks accelerated aging by thermal cycling test, according to IEC61215. Before every test, we checked output and EL image of PV module. As the result of first step, we detected little power loss(0.9%). But after thermal cycling test increased power loss about 3.2%.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.1-6
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• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.41 no.7
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• pp.703-711
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• 1992

As the underground area of the metropolitan becomes denser recently, an introduction of forced cooling system is under study to maximize the carrying capacity of existing cables in tunnels. Indirect water cooling system laid within trough will probably be adopted for the next 345KV class underground power cables in this country. The system covers a distance of 1.5-3.0Km for one water cooling interval and one water cooling interval is composed of several sub-sections that have different thermal analysis conditions. Thus the distribution of temperature in each sub-section is described by different conditions in general. In this paper a method that can accurately match the temperature of the coolant in the boundary between sub-sections has been suggested. An algorithm to find the temperature distributions effectively in the thermal system has also been presented. A computer program using this method has been tested in a smaple system and the results have shown the usefulness of this program.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.1
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• pp.17-22
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• 2016

The activation energy of a material is an important factor that significantly affects the lifetime and can be used to develop a degradation model. In this study, a thermal analysis was carried out to evaluate and collect quantitative data on the degradation of insulation materials like EPR and CSP used for nuclear power plant cables. The activation energy was determined from the relationship between log ${\beta}$ and 1/T based on the Flynn.Wall.Ozawa method, by a TGA test. The activation energy was also derived from the relationship between ln(t) and 1/T based on isothermal analysis, by an OIT test. The activation energy of EPR derived from thermal analysis was used to calculate the accelerated aging time corresponding to the number of years of use, employing the Arrhenius equation, and determine the elongation corresponding to the accelerated aging time.