• 제목/요약/키워드: thermal oxide film

검색결과 425건 처리시간 0.037초

GaP 산화막 특성에 관하여 (On the Characteristics of Oxide Film on Gap)

  • 박재우;문동찬;김선태
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1988년도 추계학술대회 논문집 학회본부
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    • pp.193-195
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    • 1988
  • The native oxide films were thermally and anodically formed on the n-GaP substrates grown by SSD method and measured this oxide thickness and the chemical composition and the electrical properties with formation condition. The chemical composition of themally oxidized GaP film was composed of mostly $GaPO_4$ at temperature below $800^{\circ}C$ and mostly $\beta-Ga_{2}O_{3}$ above $800^{\circ}C$. But The chemical composition of anodically oxidized GaPfilm was composed of the mixture of $Ga_{2}O_{3}$ and $P_{2}O_{5}$. The barrier height of Al/oxide/n-Gap which was formed at $700^{\circ}C$ by thermal oxidation method were 1.10eV, 1.03eV in Current-Voltage measurement. Interface charge density were $4{\times}10^{12}q(C/cm^2)$ and $3{\times}10^{12}q(C/cm^2)$ in Capacitance-Voltage measurement respectively.

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얇은 산화막의 wear out에 관한 광 조사 효과 (The effect of irradiation on the wear out of thin oxide film)

  • 김재호;최복길;성영권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1989년도 추계학술대회 논문집 학회본부
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    • pp.114-118
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    • 1989
  • Due to the increased integration density of VLSI circuits a highly reliable thin oxide film is required to fabricate a small geometry MOS device. The behavior of thermal $SiO_2$ under high electric field and current condition has a major effect on MOS device degration and also the practical use of MOS device under irradiation has cause the degration of thin oxide films. In this paper, in order to evaluate the reliability of thin oxides with no stress applied and stressed by the irradiation under low electric field, the tests of TDDB (Time-dependent-dielectric breakdown) are used. Failure times against electric field are examined and acceleration factor is obtained for each case. Based on the experimental data, breakdown wear out limitation for thin oxide films is characterised.

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Conducting Metal Oxide Interdigitated Electrodes for Semiconducting Metal Oxide Gas Sensors

  • Shim, Young-Seok;Moon, Hi-Gyu;Kim, Do-Hong;Jang, Ho-Won;Yoon, Young-Soo;Yoon, Soek-Jin
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.65-65
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    • 2011
  • We report the application of conducting metal oxide electrodes for semiconducting metal oxide gas sensors. Pt interdigitated electrodes have been commonly used for metal oxide gas sensor because of the low resistivity, excellent thermal and chemical stability of Pt. However, the high cost of Pt is an obstacle for the wide use of metal oxide gas sensors compared with its counterpart electrochemical gas sensors. Meanwhile, relatively low-cost conducting metal oxides are widely being used for light-emitting diodes, flat panel displays, solar cell and etc. In this work, we have fabricated $WO_3$ and $SnO_2$ thin film gas sensors using interdigitated electrodes of conducting metal oxides. Thin film gas sensors based on conducting metal oxides exhibited superior gas sensing properties than those using Pt interdigitated electrodes. The result was attributed to the low contact resistance between the conducting metal oxide and the sensing material. Consequently, we demonstrated the feasibility of conducting metal oxide interdigitated electrodes for novel gas sensors.

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Growth and analysis of Copper oxide nanowire

  • Park, Yeon-Woong;Seong, Nak-Jin;Jung, Hyun-June;Chanda, Anupama;Yoon, Soon-Gil
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.245-245
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    • 2009
  • l-D nanostructured materials have much more attention because of their outstanding properties and wide applicability in device fabrication. Copper oxide(CuO) has been realized as a p-type metal oxide semiconductor with narrow band gap of 1.2 -1.5eV. Copper oxide nanostructures can be synthesized by various growth method such as oxidation reaction, thermal evaporation thermal decomposition, sol-gel. and Mostly CuO nanowire prepared on the Cu substrate such as Copper foil, grid, plate. In this study, CuO NWs were grown by thermal oxidation (at various temperatures in air (1 atm)) of Cu metal deposited on CuO (20nm)/$SiO_2$(250nm)/Si. A 20nm-thick CuO layer was used as an adhesion layer between Cu metal and $SiO_2$

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스핀코팅 및 급속열처리 공정을 통해 형성된 Y2O3:Eu3+ 박막의 발광특성 (Luminescent Properties of Y2O3:Eu3+ Thin Film Through Spin-coating and Rapid Thermal Annealing Process)

  • 박재홍;정용석
    • 반도체디스플레이기술학회지
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    • 제23권1호
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    • pp.88-91
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    • 2024
  • The europium doped yttrium oxide (Y2O3:Eu3+) thin film was formed on a Si substrate by the conventional spin-coating process followed by rapid thermal annealing (RTA) treatment. The spinning profiles such as rotation speed, acceleration and holding times were controlled during the spin-coating process for the best condition of the Y2O3:Eu3+ thin film. The RTA treatment was conducted for several temperature in order to crystallize the spin coated film. The Y2O3:Eu3+ thin film presented best performance in the conditions of 4000 rpm, 30 s and 10 s of rotation speed, acceleration time and holding time, respectively, at a fixed RTA temperature of 900 ℃.

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이종접합 실리콘 태양전지의 효율 개선을 위한 열처리의 효과 (Effect on the Thermal Treatment for Improving Efficiency in Silicon Heterojunction Solar Cells)

  • 박형기;이준신
    • 한국전기전자재료학회논문지
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    • 제37권4호
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    • pp.439-444
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    • 2024
  • This study investigates the post-thermal treatment effects on the efficiency of silicon heterojunction solar cells, specifically examining the influence of annealing on p-type microcrystalline silicon oxide and ITO thin films. By assessing changes in carrier concentration, mobility, resistivity, transmittance, and optical bandgap, we identified conditions that optimize these properties. Results reveal that appropriate annealing significantly enhances the fill factor and current density, leading to a notable improvement in overall solar cell efficiency. This research advances our understanding of thermal processing in silicon-based photovoltaics and provides valuable insights into the optimization of production techniques to maximize the performance of solar cells.

금속 산화물 박막 제작을 위한 산화 시스템의 평가 (Evaluation of Oxidation System for Metal Oxide Thin Film)

  • 임중관;김종서;박용필
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2003년도 춘계종합학술대회
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    • pp.590-593
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    • 2003
  • 금속 산화물 박막 제작에 유효한 산화가스로 오존가스를 채택했다. 고품질의 산화 박막을 얻기 위해 고농도 오존이 필요하여 오존 농축 시스템을 구축 및 평가하였다. 이 장치는 실리카겔로 오존의 선택 흡착을 이용해, 농축 공정 시작 후 유입 농도 8.5 mol%가 검출되는 2.5 h에서 농축이 완료되고, 진공 배기로 고농도 오존가스를 생성하였으며, 성막 장치까지 가스가 공급되는 몇 분 동안은 자연분해 효과를 무시할 수 있었다.

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열산화법을 이용한 산화구리 나노선 수직성장 (Synthesis of Vertically Aligned CuO Nanorods by Thermal Oxidation)

  • 김지민;정혁;김도진
    • 한국재료학회지
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    • 제23권1호
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    • pp.1-6
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    • 2013
  • A simple thermal oxidation of Cu thin films deposited on planar substrates established a growth of vertically aligned copper oxide (CuO) nanorods. DC sputter-deposited Cu thin films with various thicknesses were oxidized in environments of various oxygen partial pressures to control the kinetics of oxidation. This is a method to synthesize vertically aligned CuO nanorods in a relatively shorter time and at a lower cost than those of other methods such as the popular hydrothermal synthesis. Also, this is a method that does not require a catalyst to synthesize CuO nanorods. The grown CuO nanorods had diameters of ~100 nm and lengths of $1{\sim}25{\mu}m$. We examined the morphology of the synthesized CuO nanorods as a function of the thickness of the Cu films, the gas environment, the oxidation time, the oxidation temperature, the oxygen gas flow rate, etc. The parameters all influence the kinetics of the oxidation, and consequently, the volume expansion in the films. Patterned growth was also carried out to confirm the hypothesis of the CuO nanorod protrusion and growth mechanism. It was found that the compressive stress built up in the Cu film while oxygen molecules incorporated into the film drove CuO nanorods out of the film.

원거리 플라즈마 화학증착법으로 증착된 이산화규소박막의 물성 (Properties of $SiO_2$Deposited by Remote Plasma Chemical Vapor Deposition(RPCVD))

  • 박영배;강진규;이시우
    • 한국재료학회지
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    • 제5권6호
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    • pp.706-714
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    • 1995
  • 원거리 플라즈마 화학증착법을 이용하여 저온에서 이산화규소박막을 제조하였다. 본 연구 에서는 공정변수인 기판의 온도, 반응기체의 조성 및 분압과 플라즈마 전력에 따른 산화막의 재료적인 물성을 평가하였다. XPS결과에서 산화막은 양론비(O/Si=2)보다 약간 적어 실리콘이 많이 함유된 막으로 나타났다. 이 경우 굴절율과 ESR분석에 의해 미결합된 실리콘의 양이 증가함을 알 수 있었다. SIMS분석에 의해 미량의 질소성분이 계면에 존재하는 것과 실리콘 미결함을 관찰하였다. FT-IR로부터 막내 수소량을 정량화하였으며 결합각 분포는 20$0^{\circ}C$이상에서 열산화막과 비슷한 값을 얻었다. 하지만 열산화막에 비해 높은 식각율을 보여 계면 스트레스에 의해 막내의 결합력이 약해진 것으로 생각된다.

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