• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.29-30
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.487-488
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.173-174
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• 2007

• 한국정밀공학회지
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• 제24권12호
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• pp.36-41
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• 2007

• 한국정밀공학회지
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• 제19권5호
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• pp.19-24
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• 2002

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.851-852
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• 2009

• 한국광학회:학술대회논문집
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• 한국광학회 2008년도 동계학술발표회 논문집
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• pp.97-98
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• 2008

• JSTS:Journal of Semiconductor Technology and Science
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• 제10권3호
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• pp.225-231
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• 2010

In this paper, we investigate the channel thermal noise in nanoscale MOSFETs. Simple analytical model of thermal noise factor in nanoscale MOSFETs is presented and it is verified with accurately measured noise data. The noise factor is expressed in terms of the channel conductance and the electric field in the gradual channel region. The proposed noise model can predict the channel thermal noise behavior in all operating bias regions from the long-channel to nanoscale MOSFETs. From the measurement results, we observed that the thermal noise model for the long-channel MOSFETs does not always underestimate the short-channel thermal noise.

• 한국군사과학기술학회지
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• 제11권1호
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• pp.102-111
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• 2008

This paper describes the basic model and simulation results of thermal battery. Voltage and thermal analysis is a critical part of thermal-battery design because of the need to maintain the inner temperature above the electrolyte melting point. Traditionally, battery design has depended on an empirical approach, in which prototype batteries are outfitted with thermocouples and the design of subsequent batteries is refined accordingly. We have developed the basic model that allows the design engineer to configure or modify a battery, quickly conduct a thermal analysis, and efficiently review the results. Based on performance tests, the thermal-battery model was established and the effect of design parameters on battery performance was analyzed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.375-379
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• 1997

Thermal drift of the machine tool spindle due to temperature increase dominates the major source of the machine tool error. To compensate the thermal errors, software based error correction methods could be implemented. In th~s case, we need model to map the relationship between temperature and thermal distortion. Traditionally, two or three different methods have been trled: step increase of spindle speed, constant, random. The latter two methods are described in the document of ISOlDIS230-3. In this research, three different methods were verified through the experiments from the viewpoint of compensation of thermal distortion. Constant spindle speed turned out good enough for monitoring the behavior of the thermal drift and modeling the relationship between temperature and thermal distortion.