• 한국추진공학회지
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• 제20권4호
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• pp.87-93
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• 2016

직접 연결식(DC) 고도모의 엔진시험 수행 시, 공기 흡입 덕트와 항공용 엔진 사이에 래버린스 씰이 설치된다. 래버린스 씰은 이 둘을 기계적으로 격리시킴으로써 주추력 및 측추력을 보다 정확하게 측정할 수 있도록 돕는다. 하지만 덕트 내부 공급공기에 높은 수직 온도구배가 발생할 경우, 래버린스 씰의 격리가 파괴되어버린다. 본 논문에서는 이러한 접촉 문제를 해결하기 위한 노력의 일환으로 래버린스 씰 온도 제어장치를 제작/설치하였다. 본 장치를 실제 항공용 엔진시험에 적용한 결과, 높은 수직 온도구배가 생성되어도 래버린스 씰의 격리가 잘 유지되는 것을 확인할 수 있었다.

• Smart Structures and Systems
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• 제23권3호
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• pp.227-242
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• 2019

Seismic isolation systems employ structural control that protect both buildings and vibration-sensitive contents from destructive effects of earthquakes. Structural control is divided into three main groups: passive, active, and semi-active. Among them, semi-active isolation systems, which can reduce floor displacements and accelerations concurrently, has gained importance in recent years since they don't require large power or pose stability problems like active ones. However, their seismic performance may vary depending on the variations that may be observed in the mechanical properties of semi-active devices and/or seismic isolators. Uncertainties relating to isolators can arise from variations in geometry, boundary conditions, material behavior, or temperature, or aging whereas those relating to semi-active control devices can be due to thermal changes, inefficiencies in calibrations, manufacturing errors, etc. For a more realistic evaluation of the seismic behavior of semi-active isolated buildings, such uncertainties must be taken into account. Here, the probabilistic behavior of semi-active isolated buildings under historical pulse-like near-fault earthquakes is evaluated in terms of their performance in preserving structural integrity and protecting vibration-sensitive contents considering aforementioned uncertainties via Monte-Carlo simulations of 3-story and 9-story semi-active isolated benchmark buildings. The results are presented in the form of fragility curves and probability of failure profiles.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 춘계학술대회 논문집
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• pp.227-229
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• 1995

Using thermal oxide SiO$_2$ as a dielectrical isolation layer, SOI Hall sensors without pn junction isolation have been fabricated on Si/SiO$_2$/Si structures. The SOI structure was formed by SDB (Si- wafer direct bonding) technology. The Hall voltage and the sensitivity of Si Hall devices implemented on the SDB SOI structure show good linearity with respect to the appled magnetic flux density and supplied current. The product sensitivity of the SDB SOI Hall device is average 600V/V.T. In the trmperature range of 25 to 300$^{\circ}C$, the shifts of TCO(Temperature Coefficient of the Offset Voltage) and TCS(Temperature Coefficient of the Product Sensitivity) are less than ${\pm}$ 6.7x10$\^$-3/ C and ${\pm}$8.2x10$\^$04/$^{\circ}C$, respectively. These results indicate that the SDB SOI structure has potential for the development of Hall sensors with a high-sensitivity and high-temperature operation.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1999년도 봄 학술발표회 논문집(I)
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• pp.187-190
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• 1999

This study is intended to present the properites of planting concrete using the light-weight aggregate and crushed aggregate. According to the result of experiment, the concrete using orchid stone shows a better performance in voids volume, unit weight, absorbtion, thermal conductivity and pH, which are helpful for planting and heat isolation. Therefore, if planting concrete used with orchid stone are utilized to be the planting base on the building's roof, it will be effective to reduced the cost of construction and heating due to the redution of building's self weight and heat isolation effection.

• 한국전산유체공학회지
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• 제20권3호
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• pp.87-93
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• 2015

In this study, a numerical analysis was performed to simulate the thermal-hydraulic response of the secondary side of a steam generator(SG) model equipped with an orifice-type SG outlet flow restrictor to a main steam line break(MSLB) at a pressurized water reactor(PWR) plant. The SG analysis model includes the SG upper steam space and the part of the main steam pipe between the SG outlet and the broken pipe end. By comparing the numerical calculation results for the present SG model to those obtained for a simple SG model having no flow restrictor, the effects of the flow restrictor on the thermal-hydraulic response of SG to the MSLB were investigated.

• Molecular & Cellular Toxicology
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• 제2권3호
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• pp.170-175
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• 2006

The extensive isolation of genes responsive to stressful conditions from a soft coral Scleronephthya gracillimum was described. Soft coral colonies were exposed to thermal and chemical stressors to induce the expression of stress related genes. Differentially expressed genes by natural or anthropogenic stressors were identified by construction of standard and stress exposed-paired subtractive cDNA library. Thirty-two and thirty-seven kinds of candidate genes were identified from thermal or benzo[a]pyrene stress exposed group, respectively, which are associated with cell cycle, cell signaling, transcription, translation, protein metabolism, and other cellular functions. The expected function of each gene was described. The isolated and identified differentially expressed genes have a great potential to identify environmental stressors in global environmental changes and could act as molecular biomarkers for biological responses against environmental changes. Finally, it may open a new paradigm on soft coral health assessment.

• 센서학회지
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• 제27권1호
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• pp.40-46
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• 2018

In this paper, we focus on optimization of a boron ($^{11}B$)-implanted n type Si epi substrate for obtaining near-zero temperature coefficient of resistance (TCR) at temperature range from 25 to $125^{\circ}C$. The $^{11}B$-implantation on the N type-Si epi substrate formed isolation from the rest of the N-type Si by the depletion region of a PN junction. The TCR increased as the temperature of rapid thermal anneal (RTA) was increased at the temperature range from $900^{\circ}C$ to $1000^{\circ}C$ for the $p^+$ contact with implantation at dose of $1E16/cm^2$, but sheet resistance of this film was decreased. After the optimization of anneal process condition, the TCR of $1126.7{\pm}30.3$ (ppm/K) was obtained for the $p^-$ resistor-COB package chips contained $p^+$ contact with the implantation of $5E14/cm^2$. This shows the potential of the $^{11}B$-implanted n type Si epi substrate as a resistor for pressure sensor in thermal stable environment applications..

• 센서학회지
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• 제5권6호
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• pp.51-59
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• 1996

실리콘기판과의 스트레스균형이 이루어진 150 nm-$Si_{3}N_{4}$/300 nm-$SiO_{2}$/150 nm-$Si_{3}N_{4}$ 다이아프레임위에 백금 박막히터 및 Bi-Sb 열전대배열을 형성하여 히터에서 실리콘기판으로 전달되는 열량의 차단효과가 현저히 개선된 유체센서를 제작하였다. 백금 박막히터는 유전체 다이아프레임의 열차단 효과때문에 비선형 전류-전압 특성을 나타내었고, 이 히터의 저항온도계수는 약 $0.00378\;/^{\circ}C$였으며, 또한 Bi-Sb 열전대의 Seebeck계수는 약 $97\;{\mu}V/K$였다. 기체의 열전도도가 증가할수록 유체센서가 나타내는 열기전력은 감소하였으며, 히터온도가 증가하거나 히터와 열전대사이의 거리가 감소할수록 센서의 감도는 증가하였다. 히터전압을 약 2.5V로 하였을 때 유체센서의 $N_{2}$유량에 대한 감도는 약 $1.27\;mV{\cdot}(sccm)^{-1/2}$였고, 열응답시간은 약 0.13 초였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.99.1-99.1
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• 2016

The materials for an electronic packaging provide diverse important functions including electrical contact to transfer signals from devices, isolation to protect from the environment and a path for heat conduction away from the devices. The packaging materials composed of metals, ceramics, polymers or combinations are crucial to the device operating properly and reliably. The demand of effective charge and heat transfer continuous to be challenge for the high-speed and high-power devices. Nanomaterials including graphene, carbon nanotube and boron nitride, have been designed for the purpose of exploiting the high thermal, electrical and mechanical properties by combining in the matrix of metal or polymer. In addition, considering the inherent electrical and surface properties of graphene, it is expected that graphene would be a good candidate for the surface layer of a template in the electroforming process. In this talk, I will present recent our on-going works in nanomaterials for microelectronic packaging: 1) porous graphene/Cu for heat dissipations, 2) carbon-metal composites for interconnects and 3) nanomaterials-epoxy composites as a thermal interface materials for electronic packaging.

• 한국정밀공학회지
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• 제19권11호
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• pp.24-30
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• 2002

본 글에서는 정밀 전자 소자등을 극저온으로 냉동시키는 데 필요불가결한 극저온 단열 기술에 대하여 간단히 알아보았다. 역사가 가장 오래되고 기본적인 진공 단열 기술로 시작하여, 공간에 고형의 물질을 삽입하는 다층 단열 기술과 분말 단열 기술에 대하여 토의하였다. 실제 응용시에는 요구되는 열적 성능과 경제적 제한 조건을 고려하여 가장 적합한 단열 방법을 선정하도록 하여야한다 또한 극저온 단열 용기의 실제 열해석 예로서 적외선 센서의 극저온 용기에 대한 정상 및 과도 열전달 해석에 대하여 간단히 기술하였다. 정상상태의 경우는 많은 경우 해석적인 해를 구할 수 있지만, 시간에 따라 온도가 변하는 과도 상태의 경우는 수치해석적인 방법이 요구된다. 열해석에서 일반적으로 쓰이는 유한차분법이 극저온 단열 용기의 열해석에도 유용하게 쓰일 수 있음을 보였다.