• Transactions on Electrical and Electronic Materials
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• v.1 no.4
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• pp.25-29
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• 2000

In this paper, PET(Ployethylene Terephthalate) films with semiconducting and interface layers were investigated, The electrical properties, such as volume resistivity, tan$\delta$(dissipation factor) and breakdown strength at various temperatures were measured. Thermal analysis of PET and semiconducting films were measured and compared by differential scanning calorimeter(DSC) of each film. It is found that the volume resistivity of films(dependence on semiconducting interface layers)and electrical properties of PET films are changed ,Breakdown strength and dissipation factor of PET films with semiconducting layer (PET/S/PET) are decreased more greatly than PET and PET/PET films, due to the increase of charge density of charges at two contacted interfaces between PET and semiconductor, The dissipation factor of each films in increased with temperature,. For PET/S/PET film, is depended on temperature more than PET of PET/PET. However, the breakdown strength is increased up to 85$\^{C}$ and then decreased over 100$\^{C}$The electrical properties of PET films with semiconducting/interface layer are worse than without it It is due to a result of temperature dependency, which deeply affects thermal resistance property of PET film more than semiconducting/interface layers.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.487-487
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• 2013

According to shrinkage of transistor, interface traps have been recognized as a major factor which limits the process development in manufacturing industry. The traps occur through spontaneous generation process, and spread into the forbidden band. There is a large change of current though a few traps are existed at the Si-SiO2 interface. Moreover, the increased temperature largely affects to the leakage current due to the interface trap. For this reason, we made an effort to find out the relationship between temperature and interface trap. The subthreshold swing (SS) was investigated to confirm the correlation. The simulated results show that the sphere of influence of trap is enlarged according to increase in temperature. To investigate the relationship between thermal energy and surface potential, we extracted the average surface potential and thermal energy (kT) according to the temperature. Despite an error rate of 6.5%, change rates of both thermal energy and average surface potential resemble each other in many ways. This allows that SS is affected by the trap within the range of the thermal energy from the surface energy.

• Journal of Welding and Joining
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• v.5 no.1
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• pp.34-41
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• 1987

To explore the possible application of thermal analysis technique as a probe for finding weld defects, Hydrogen trapping phenomena in Heat Affected Zone (HAZ) of the AISI 5160 spring steel were investigated. HAZ was divided into five parts, which were used as thermal analysis specimens. Two types of trap sites were found in HAZ, ferrite/cementin interface and microvoid. The thermal analysis peak due to the ferrite/cementite interface increased its height toward the weld deposit. The thermal analysis peak due to the microvoid was the highest where the grain size was the smallest. The correspondence between the cold cracking and hydrogen trap nature is also discussed.

• Journal of Industrial Technology
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• v.24 no.A
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• pp.9-15
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• 2004

The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

• Journal of the Korean Society of Safety
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• v.18 no.4
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• pp.39-43
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• 2003

An experimental study was conducted to develop and understanding of fracture behavior of ceramic thermal barrier coating when subjected to a thermal shock loading. The thermal loading was applied using a 1.5kW $CO_2$ laser. In the experiments, beam-shaped specimens were subjected to a high heat flux for 4sec and cooling of 7sec in air. The interface crack length was increased as the crack density, the surface pre-crack legth and the coating thickness were increased. The center surface crack length was increased as the maximum surface temperature got higher and the surface pre-crack length for shorter.

• Corrosion Science and Technology
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• v.14 no.4
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• pp.161-165
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• 2015

This paper presents an analysis of thermal stress induced along the interface between a polymeric coating layer and a steel substrate as a result of uniform temperature change. The epoxy layer is assumed to be a linear viscoelastic material and to be theromorheologically simple. The viscoelastic boundary element method is employed to investigate the behavior of interface stresses. The numerical results exhibit relaxation of interface stresses and large stress gradients, which are observed in the vicinity of the free surface. Since the exceedingly large stresses cannot be borne by the polymeric coating layer, local cracking or delamination can occur at the interface corner.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.3
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• pp.173-180
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• 2001

In the case of axisymmetric thermal analysis of drum brakes, the distribution of frictional heat produced on the interface and temperature difference between mating frictional faces are very interesting problems to computational researchers. In the first part, the influence of the s-cam load angles and elastic modulus of the pad on the contact pressure distribution between pad and drum was checked by a three dimensional model. In the second part heat conduction from the interface to the pad and the drum was modeled by using a thin interface element, so artificial division of the generated frictional heat between pad and drum is not necessary. Temperature difference between mating frictional faces is successfully modeled by using the interface element. The influence of some parameters on the thermal distribution is checked. The analysis was performed by ABAQUS/Standard code.

• Steel and Composite Structures
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• v.51 no.2
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• pp.127-138
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• 2024

In this paper, structural behavior under fire conditions is comprehensively examined, and a novel software interface for testing interfaces efficiently is developed and validated. In order to accurately assess the response of structures to fire scenarios, advanced simulation techniques and modeling approaches are incorporated into the study. This interface enables accurate heat transfer analysis and thermo-mechanical simulations by integrating software tools such as CSI ETABS, CSI SAP2000, and OpenSees. Heat transfer models can be automatically generated, simulation outputs processed, and structural responses interpreted under a variety of fire scenarios using the proposed technique. As a result of rigorous testing and validation against established methods, including Cardington tests on scales and hybrid simulation approaches, the software interface has been proven to be effective and accurate. The analysis process is streamlined by this interface, providing engineers and researchers with a robust tool for assessing structural performance under fire conditions.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.8
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• pp.1559-1565
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• Journal of computational fluids engineering
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• v.15 no.2
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• pp.28-34
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• 2010

Conductive and radiative thermal model configurations of an imager of a geostationary satellite are presented. A two-plane method is introduced for three dimensional conductive coupling which is not able to be treated by thin shell plate thermal modeling technique. Especially the two-plane method is applied to massive matters and PIP(Payload Interface Plate) in the imager model. Some massive matters in the thermal model are modified by adequate correction factors or equivalent thickness in order to obtain the numerical results of thermal modeling to be consistent with the analytic model. More detailed nodal breakdown is specially employed to the object which has the rapid temperature gradient expected by a rule of thumb. This detailed thermal model of the imager is supposed to be used for analyses and test predictions, and be correlated with the thermal vacuum test results before final in-flight predictions.