• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.3-8
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• 2007

The purpose of this study is to grasp the characteristic of indoor thermal environment from large enclosures in connection with heating and cooling condition. This study has measured indoor thermal environment in winter and summer season. We examined indoor thermal environment of the large enclosures in this study which include vertical, horizontal temperature distribution and thermal comfort environment.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.15-20
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• 2006

Despite the fact that UFAD (Under Floor Air Distribution) systems have many benefits and are being applied in the field in increasing numbers, there is a strong need for an improved fundamental understanding of several key performance features of these systems. This study numerically investigates the effect of design parameters on the performance of UFAD, especially focused on thermal comfort. The design parameters considered in this study include supplied air temperature, supplied flow rate, diffuser shape, swirl, diffuser location, and floor-to-floor height. Also this study has compared UFAD with over head system, on the point of thermal comfort by evaluating PMV using radiative mean temperature, which shows how inadequate the evaluation of thermal comfort can be when radiation is neglected. Until now, the radiative temperature has been the missing link between CFD and thermal comfort, but the present study paves the way for overcoming this weakness.

• Current Optics and Photonics
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• v.3 no.5
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• pp.458-465
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• 2019

The thermal effect and the light output of a laser crystal under different pumping depths were reported., Based on the thermal model of a single-ended pumped Tm:YAP crystal, the thermal stress coupled model used Comsol to theoretically calculate the effect of changing the pump spot size and pump depth on crystal heat distribution and stress distribution. The experimental results showed that the laser output power first increased and then decreased with increasing pump spot size. As the depth of focus increased, the laser output power first increased and then decreased. The experimental results were consistent with the theoretical simulation results. The theory of pump spot radius and depth of focus in this paper provided an effective simulation method for mitigating thermal effects, and provided theoretical supports for laser crystals to obtain higher laser output power.

• Structural Engineering and Mechanics
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• v.87 no.1
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• pp.29-46
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• 2023

Critical thermal buckling of functionally graded porous (FGP) sandwich plates under various types of thermal loading is considered. It is assumed that the mechanical and thermal nonhomogeneous properties of FGP sandwich plate vary smoothly by distribution of power law across the thickness of sandwich plate. In this paper, porosity defects are modeled as stiffness reduction criteria and included in the rule of mixture. The thermal environments are considered as uniform, linear and nonlinear temperature rises. The critical buckling temperature response of FGM sandwich plates has been analyzed under various boundary conditions. By comparing several numerical examples with the reference solutions, the results indicate that the present analysis has good accuracy and rapid convergence. Further, the effects of various parameters like distribution shape of porosity, sandwich combinations, aspect ratio, thickness ratio, boundary conditions on critical buckling temperature of FGP sandwich plate have been studied in this paper.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• 한국기계연구소 소보
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• s.17
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• pp.29-38
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• 1987

A mechanical linkage system to measure the operating temperature of the piston is developed and installed to the engine. Actual temperature distribution is measured for comparison with the numerical results. Heat transfer at the piston is analyzed using an FEM program. Thermal boundary condition of piston surface is determined by analytical and empirical methods. The temperature distribution and the thermal deformation are obtained by the FEM program.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.4
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• pp.104-110
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• 2001

The objective of this study is structural analysis of continuous casting mold. A two-dimensional finite element model was developed to compute the temperature distribution, thermal stress and thermal strain behavior for continuous casting mold. Structural analysis was made using thermal analysis result, utilizing transient analysis of ANSYS. This structural analysis results, many variables such as casting speed, cooling condition film coefficient, convection and load condition are considered.

• Journal of the Korean Society for Nondestructive Testing
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• v.10 no.2
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• pp.50-55
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• 1990

Flaws in GFRP(Glass Fiber Reinforced Plastics) were thermally detected using cholesteric liquid crystals. Presence of flaws changes the thermal conductivity of GFRP, and disturbs heat flow. When a uniform heat source is applied, the surface temperature of flawed region is different from that of sound region. The surface temperature distributions were measured by thermo-optic properties of liquid crystal. Since the colors of liquid crystal indicate temperature distribution of GFRP surface, the thermal disturbance by flaws could be detected. The locations of flaws in GFRP could be determined from the distribution of liquid crystal colors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.447-450
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• 1997

Temperature distribution measurements in the mockup apparatus of reactor vessel were performed to determine the effective thermal conductivity of Al powder porous media where stainless steel tubes were installed with different geometry. The temperature distributions at four separated sections with different arrangements of porous media have different slopes according to the geometrical configuration. From the measured temperature distribution, effective thermal conductivity have been derived using the least square fitting method.

• Journal of the Korean Society for Nondestructive Testing
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• v.17 no.2
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• pp.89-99
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• 1997

Although discontinuously reinforced metal matrix composite(MMC) is one of the most promising materials for applications of aerospace, automotive industries, the thermal residual stresses developed in the MMC due to the mismatch in coefficients of thermal expansion between the matrix and the fiber under a temperature change has been pointed out as one of the serious problem in practical applications. There are very limited nondestructive techniques to measure the residual stress of composite materials. However, many difficulties have been reported in their applications. Therefore it is important to establish analytical model to evaluate the thermal residual stress of MMC for practical engineering application. In this study, an elastic model is developed to predict the average thermal residual stresses in the matrix and fiber of a misoriented short fiber composite. The thermal residual stresses are induced by the mismatch in the coefficient of the thermal expansion of the matrix and fiber when the composite is subjected to a uniform temperature change. The model considers two-dimensional in-plane fiber misorientation. The analytical formulation of the model is based on Eshelby's equivalent inclusion method and is unique in that it is able to account for interactions among fibers. This model is more general than past models to investigate the effect of parameters which might influence thermal residual stress in composites. The present model is to investigate the effects of fiber volume fraction, distribution type, distribution cut-off angle, and aspect ratio on thermal residual stress for in-plane fiber misorientation. Fiber volume fraction, aspect ratio, and distribution cut-off angle are shown to have more significant effects on the magnitude of the thermal residual stresses than fiber distribution type for in-plane misorientation.