• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.71-74
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• 2012

Uniformity of the wafer temperature is one of the important factors in etching process. Plasma, chucking force, backside helium pressure and the surface temperature of ESC(electrostatic chuck) affect the wafer temperature. ESC consists of several layers of structure. Each layer has own thermal resistance and the Si-adhesive layer has highest thermal resistance among them. In this work, the temperature distribution of ESC was analyzed by 3-D FEM with various defects and the thickness deviation of the Si-adhesive layer. The result with Si-adhesive layer with the low center thickness deviation shows modified temperature distribution of ESC surface.

• 전기학회논문지P
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• 제64권4호
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• pp.256-260
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• 2015

In this paper, achieved rise temperature distribution about degradation phenomenon of 24 MVA distribution cast resin transformer using CFD(Computational Fluid Dynamics). Usually, life of transformer is depended on temperature distribution of specification region than thermal special quality of transformer interior. Specially, life of transformer by decline of dielectric strength decreases rapidly in case rise by strangeness transformer interior hot spot temperature value permits. Because calculating high-voltage(HV) winding and low-voltage(LV) winding of cast resin transformer and Joule's loss of core for improvement these life, forecasted heat source, and HV winding and LV winding of cast transformer rise temperature distribution of core for supply of electric power and temperature distribution of highest point on the basis of the results. Also, calculated temperature rise limit of cast resin transformer and permission maximum temperature using analysis by electromagnetic heat source. Calculated and forecasted rise temperature distribution by heat source of thermal analysis with calculated result.

• 태양에너지
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• 제17권3호
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• pp.3-11
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• 1997

Recently the construction of atrium buildings has increased but along with it many problems in thermal environment have arised. since the exterior wall of glass, indoor temperature is greatly influenced by weather conditions and since the space volume is very large, the vertical air temperature is not uniform. So, in this study, a Vertical Temperature Distribution Model was developed to predict the vertical air temperature of an atrium and evaluate the effects of the design parameters on the air temperature distribution of an atrium. To consider the characteristics of the vertical air temperature distribution in an atrium, the Satosh Togari's Macroscopic Model was used basically for the calculation of the vertical air temperature distribution in large space and the solar radiation analysis model and natural ventilation analysis model in atrium. And to calculate the unsteady-state inside wall surface temperature(boundary condition), the finite difference method was used. For the verification of the developed temperature distribution program, numerical evaluation of air flow by the ${\kappa}-{\varepsilon}$ turbulence model and in-situ test was conducted in parallel. The results of this study, the developed temperature distribution program was seen to predict the thermal condition of the atrium very accurately.

• Advances in aircraft and spacecraft science
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• 제10권1호
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• pp.19-49
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• 2023

The present study proposes a theoretical and numerical investigation on the dynamic response behaviour of a functional graded (FG) ceramic-metal tapered rotor shaft system, by the differential quadrature finite elements method (DQFEM) to identify the natural frequencies for modelling and analysis of the structure with suitable validations. The purpose of this paper is to explore the influence of heat gradients on the natural frequency of rotation of FG shafts via three-dimensional solid elements, as well as a theoretical examination using the Timoshenko beam mode, which took into account the gyroscopic effect and rotational inertia. The functionally graded material's distribution is described by two distribution laws: the power law and the exponential law. To simulate varied thermal conditions, radial temperature distributions are obtained using the nonlinear temperature distribution (NLTD) and exponential temperature distribution (ETD) approaches. This work deals with the results of the effect on the fundamental frequencies of different material's laws gradation and temperature gradients distributions. Attempts are conducted to identify adequate explanations for the behaviours based on material characteristics. The effect of taper angle and material distribution on the dynamic behaviour of the FG conical rotor system is discussed.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2000년도 특별강연 및 춘계학술발표대회 개요집
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• pp.228-231
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• 2000

Based on the principle of complementary energy an analytical method is developed for determining thermal stress distribution in an thermal barrier coating. This method gives the stress distributions which satisfy the stress-free boundary conditions at the edge. Numerical examples are given in order to verify the method and to investigate the thickness effects of the ZrO$_2$-8wt％Y$_2$O$_3$ top coat on the integrity of thermal barrier coating consisted of IN738LC substrate and MCrAlY bond coat.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2000년도 추계학술대회 논문집
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• pp.84-89
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• 2000

Thermal simulation of typical stack-type and newly proposed planar-type micro-gas sensors were studied by FEM method. The thermal analyses for the proposed planar structure including temperatur distribution over the sensing layer and power consumption of the heater were carried using finite element method by computer simulation and well compared with those of typical stack-type micro-gas sensor. The thermal properties of the microsensor from thermal simulation were compared with those of a actual device to investigate the acceptability of the computer simulation.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.969-974
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• 2002

Thermal characteristics according to the cooling methods are studied for the three type spindles with high frequency motor. For the analysis, three dimensional mode]s are built considering heat transfer characteristics such as natural and force convection coefficients. Unsteady-state temperature distributions and thermal deformations according to the cooling conditions are analyzed by using the finite element method.

• 대한설비공학회지:설비저널
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• 제4권3호
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• pp.183-190
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• 1975

Most Korean houses are heated by the Ondol heating system. There has been, however, no reasonable design procedure availabe yet for the system. The conventional design should be improved to have auniform floor surface. temperature distribution and to have a high thermal efficiency. Thermal efficiencies of the ondol were defined and the method of experimentation was studied. An experiment, using a life-size model which was well insulated, was performed to observe the variation in thermal efficiency as the length of fuel burning time was varied.

• Journal of Welding and Joining
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• 제13권2호
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• 제어로봇시스템학회논문지
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• 제6권5호
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• pp.396-403
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• 2000

A thermal imaging system is implemented for the measurement and the analysis of the thermal distribution of the target objects. The main part of the system is a thermal camera in which a focal plane array typed sensor is introduced. The sensor detects the mid-range infrared spectrum of target objects and then it outputs a generic video signal which should be processed to form a frame thermal image. Here, a digital signal processor(DSP) is applied for the high speed processing of the sensor signals. The DSP controls analog-to-digital converter, performs correction algorithms and outputs the frame thermal data to frame buffers. With the frame buffers can be generated a NTSC signal and transferred the frame data to personal computer(PC) for the analysis and a monitoring of the thermal scenes. By performing the signal processing functions in the DSP the overall system achieves a simple configuration. Several experimental results indicate the performance of the overall system.