• 한국산업융합학회 논문집
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• 제23권3호
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• pp.427-431
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• 2020

In this Study, as the structure of IT module for smart phone display becomes thin to catch up with slim product trend, the reliability of display module is on the rise as a issue for product design. Especially, almost part of cellular phone should undergo thermal dissipation test. thus many manufacturers have considered design guide line using CAE and simulation for more effective usage of limited resources on the market. This test simulates the case when cellular phone slips through user's fingers while he is talking on the phone. This paper studies a thermal simulation of display module in smart phone. This design for reliability improvements are suggested on the basis of the results of FVM Analysis and display of IT module and smart phone design.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.1215-1216
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.1483-1484
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• 2011

• 반도체디스플레이기술학회지
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• 제11권1호
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• pp.13-19
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• 2012

Thermal performance of an impinging cooling module for 150 W class high power LEDs have been investigated numerically and experimentally. Parametric studies were performed to compare the effect of several design parameters such as nozzle number, nozzle spacing, coolant flow rate, and impinging distance. The experiments were also carried out in order to validate the numerical results and the comparison between the experimental and numerical results showed good agreement. It is found that the overall thermal resistance of impinging cooling module strongly depends on the nozzle number, nozzle spacing, flow rate, and impinging distance. This results showed the optimized operating condition when number of nozzles is 25, nozzles spacing is 4mm, flow rate is 2.70 lpm, distance between nozzles and impinging surface is 2 mm.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2004년도 전력전자학술대회 논문집(2)
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• pp.704-708
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• 2004

Recently, many nation have released standard such as IEC 61000-3-2 and IEEE 59, which impose a limit on the harmonic current drawn by equipment connected to AC line in order to prevent the distortion of an AC Line. Therefore, Plasma Display Panel (PDP) which is highlightened in digital display device also has the Power Factor Correction (PFC) circuit to meet the harmonic requirements. In PDP power module, the conventional boost converter is usually used for the PFC circuit. However, it comes serious thermal problem on it's bridge diode due to heat of PDP, and therefore the system stability is not guaranteed. In this paper, the bridgeless boost converter, which is used for PFC circuit of the PDP power module, is designed and verified the possibility of the application in a practical product in a view of efficiency, component count, temperature and etc.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1436-1441
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• 2006

Each type of optical sheets in a LCD module experiences a characteristic behavior for thermal loading and unloading. During thermal cycling, a polymeric behavior is reversible and recyclable, depending on a material stiffness critically affected by temperature and time. Some critical issues on temperature- and time-dependent themomechanical deformation of the polymeric sheet are addressed by finite-element thermal results, followed by structural simulation results in this study.

• 감성과학
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• 제15권4호
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• pp.441-452
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• 2012

최근 들어 청각 장애인들에게 정상인들이 소리로부터의 느끼는 청감과 유사한 느낌을 전달하기 위한 방안으로써 시각은 물론 진동감과 같은 촉감을 활용하는 연구가 시도되고 있다. 특히 시각 정보의 보조 감각으로써 스피커나 진동 모터를 이용한 촉감이 제공되는 경우 생동감은 상당히 개선되는 측면이 있으나 정서감 측면에서는 그 효과가 거의 없는 것으로 보고되었다. 따라서 본 연구에서는 유사 청감을 재현할 수 있는 또 하나의 보조 감각으로서 열감을 설정하고 열감이 유사 청감 재현 효과를 가질 수 있는가에 관하여 조사하였다. 이를 위해 열감을 효과적으로 재현할 수 있는 열감 재현 모듈을 구현하였다. 그리고 실험 대상자들에게 시각 정보와 더불어 청각 정보, 진동 촉감, 그리고 열감을 혼합한 다양한 형태의 자극을 제공한 실험을 수행하였다. 실험에서 얻어진 데이터 통계 분석을 통하여 i) 영상과 함께 열감 자극을 제공하거나 또는 ii) 영상과 함께 열감 자극과 진동 자극을 동시에 제공하는 경우가 영상만을 제공하는 경우보다 실험 대상자들이 영상과 소리로부터 느끼는 실제 열감에 더 가까운 유사 열감을 느낄 수 있다는 사실을 확인하였다. 결론적으로 실험 대상자의 피부에 제공되는 열감이 유사 청감 재현 보조 매체로서의 활용 가능성이 있음을 확인할 수 있었다.

• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.18-22
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• 2022

Photovoltaics (PV) power generation efficiency is affected by meteorological factors such as temperature and wind speed. In general, it is known that the power generation amount decreases because photovoltaics panel temperature rises and the power generation efficiency decreases in summer. Photovoltaics Thermal (PVT) power generation has the ad-vantage of being able to produce heat together with power, as well as preventing the reduction in power generation efficien-cy and output due to the temperature rise of the panel. In this study, the amount of heat collected by season and time was calculated for photovoltaics thermal modules using the International Weather for Energy Calculations (IWEC) data provided by the American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE). Based on this, we propose a method of predicting the temperature of the photovoltaics panel using thermal analysis and then calculating the flow rate of coolant to improve power generation efficiency. As the results, the photovoltaics efficiencies versus time on January, April, July, and October in Jeju of the Republic of Korea were calculated to the range of 15.06% to 17.83%, and the maxi-mum cooling load and flow rate for the photovoltaics thermal module were calculated to 121.16 W and 45 cc/min, respec-tively. Though this study, it could be concluded that the photovoltaics thermal system can be composed of up to 53 modules with targeting the Jeju, since the maximum capacity of the coolant circulation pump of the photovoltaics thermal system applied in this study is 2,400 cc/min.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.443-444
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• 2006

We present a low temperature thermal process for the color photoresist on the flexible substrate for the LCD color filter module by the $TruNano^{TM}$ processor in combination with a compositional modification to the conventional color photoresist. By this method the curing temperature can be lowered by more than $100^{\circ}C$, and the curing process time also can be shortening by more than 20 min.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.149-153
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• 2019

The technology of electronic packaging among semiconductor technologies is evolving as an axis of the market in its own field beyond the simple assembly process of the past. In the field of electronic packaging technology, the packaging of power modules plays an important role for green electric vehicles. In this power module packaging, the thermal reliability is an important factor, and silicon nitride plays an important part of package substrates, Silicon nitride is a compound that is not found in nature and is made by chemical reaction between silicon and nitrogen. In this study, this core material, silicon nitride, was fabricated by reaction bonded silicon nitride. The fabricated silicon nitride was studied for thermo-mechanical properties, and through this, the structure of power module packaging was made using reaction bonded silicon nitride. And the characteristics of stress were evaluated using finite element analysis conditions. Through this, it was confirmed that reaction bonded silicon nitride could replace the silicon nitride as a package substrate.