• Journal of the Korean Society of Industry Convergence
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• v.23 no.3
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• pp.427-431
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• 2020

In this Study, as the structure of IT module for smart phone display becomes thin to catch up with slim product trend, the reliability of display module is on the rise as a issue for product design. Especially, almost part of cellular phone should undergo thermal dissipation test. thus many manufacturers have considered design guide line using CAE and simulation for more effective usage of limited resources on the market. This test simulates the case when cellular phone slips through user's fingers while he is talking on the phone. This paper studies a thermal simulation of display module in smart phone. This design for reliability improvements are suggested on the basis of the results of FVM Analysis and display of IT module and smart phone design.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.1215-1216
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1483-1484
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• 2011

• Journal of the Semiconductor & Display Technology
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• v.11 no.1
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• pp.13-19
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• 2012

Thermal performance of an impinging cooling module for 150 W class high power LEDs have been investigated numerically and experimentally. Parametric studies were performed to compare the effect of several design parameters such as nozzle number, nozzle spacing, coolant flow rate, and impinging distance. The experiments were also carried out in order to validate the numerical results and the comparison between the experimental and numerical results showed good agreement. It is found that the overall thermal resistance of impinging cooling module strongly depends on the nozzle number, nozzle spacing, flow rate, and impinging distance. This results showed the optimized operating condition when number of nozzles is 25, nozzles spacing is 4mm, flow rate is 2.70 lpm, distance between nozzles and impinging surface is 2 mm.

• Proceedings of the KIPE Conference
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• 2004.07b
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• pp.704-708
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• 2004

Recently, many nation have released standard such as IEC 61000-3-2 and IEEE 59, which impose a limit on the harmonic current drawn by equipment connected to AC line in order to prevent the distortion of an AC Line. Therefore, Plasma Display Panel (PDP) which is highlightened in digital display device also has the Power Factor Correction (PFC) circuit to meet the harmonic requirements. In PDP power module, the conventional boost converter is usually used for the PFC circuit. However, it comes serious thermal problem on it's bridge diode due to heat of PDP, and therefore the system stability is not guaranteed. In this paper, the bridgeless boost converter, which is used for PFC circuit of the PDP power module, is designed and verified the possibility of the application in a practical product in a view of efficiency, component count, temperature and etc.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1436-1441
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• 2006

Each type of optical sheets in a LCD module experiences a characteristic behavior for thermal loading and unloading. During thermal cycling, a polymeric behavior is reversible and recyclable, depending on a material stiffness critically affected by temperature and time. Some critical issues on temperature- and time-dependent themomechanical deformation of the polymeric sheet are addressed by finite-element thermal results, followed by structural simulation results in this study.

• Science of Emotion and Sensibility
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• v.15 no.4
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• pp.441-452
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• 2012

Recently, various researches have been attempted to effectively display pseudo-aural senses to the hearing-impaired or the deaf, using vibro-tactile stimulus as well as visual sense. Particularly, it is reported that as complementary senses to support the visual sense, tactile senses displayed by either speakers or vibration motors improve the reality sense significantly but do not nearly improve the emotional sense. Thus, in this study, the thermal sense is selected as another complementary sense to support the pseudo-aural sense display and it is investigated whether the thermal sense could generate a pseudo-aural sense or not. For this purpose, a thermal display module which could effectively display the desired thermal sense is implemented. Then, experiments have been conducted to subjects, which provide them with various types of stimuli combined with the aural, the vibrotactile, and the thermal stimuli along with the visual information. It can be confirmed, through statistical analysis on the data collected from experiments, that subjects could feel a pseudo-thermal sense closer to the real thermal sense which the normal subject feel from both the visual and the aural information, particularly either i) with the thermal stimulus along with the visual information or ii) with both the thermal and the vibrotactile stimuli along with the visual information than only with the visual information. Conclusively, it can be confirmed that the thermal stimulus applied to the skin of the subjects could play a role of effectively displaying pseudo-aural sense related to the thermal sense, as an complementary media for the pseudo-aural display.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.18-22
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• 2022

Photovoltaics (PV) power generation efficiency is affected by meteorological factors such as temperature and wind speed. In general, it is known that the power generation amount decreases because photovoltaics panel temperature rises and the power generation efficiency decreases in summer. Photovoltaics Thermal (PVT) power generation has the ad-vantage of being able to produce heat together with power, as well as preventing the reduction in power generation efficien-cy and output due to the temperature rise of the panel. In this study, the amount of heat collected by season and time was calculated for photovoltaics thermal modules using the International Weather for Energy Calculations (IWEC) data provided by the American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE). Based on this, we propose a method of predicting the temperature of the photovoltaics panel using thermal analysis and then calculating the flow rate of coolant to improve power generation efficiency. As the results, the photovoltaics efficiencies versus time on January, April, July, and October in Jeju of the Republic of Korea were calculated to the range of 15.06% to 17.83%, and the maxi-mum cooling load and flow rate for the photovoltaics thermal module were calculated to 121.16 W and 45 cc/min, respec-tively. Though this study, it could be concluded that the photovoltaics thermal system can be composed of up to 53 modules with targeting the Jeju, since the maximum capacity of the coolant circulation pump of the photovoltaics thermal system applied in this study is 2,400 cc/min.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.443-444
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• 2006

We present a low temperature thermal process for the color photoresist on the flexible substrate for the LCD color filter module by the $TruNano^{TM}$ processor in combination with a compositional modification to the conventional color photoresist. By this method the curing temperature can be lowered by more than $100^{\circ}C$, and the curing process time also can be shortening by more than 20 min.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.149-153
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• 2019

The technology of electronic packaging among semiconductor technologies is evolving as an axis of the market in its own field beyond the simple assembly process of the past. In the field of electronic packaging technology, the packaging of power modules plays an important role for green electric vehicles. In this power module packaging, the thermal reliability is an important factor, and silicon nitride plays an important part of package substrates, Silicon nitride is a compound that is not found in nature and is made by chemical reaction between silicon and nitrogen. In this study, this core material, silicon nitride, was fabricated by reaction bonded silicon nitride. The fabricated silicon nitride was studied for thermo-mechanical properties, and through this, the structure of power module packaging was made using reaction bonded silicon nitride. And the characteristics of stress were evaluated using finite element analysis conditions. Through this, it was confirmed that reaction bonded silicon nitride could replace the silicon nitride as a package substrate.