• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1651-1656
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• 2003

The present study has been conducted to analytically investigate the thermal control performance of variable conductance heat pipe(YCHP) with axial grooves. The condenser port of the YCHP is occupied by a inert gas in which the concentration of gas is varied with the operation temperature and the heat transport capacity is thus varied with the operating temperature due to the variation of inert gas concentration. In this study, numerical evaluation for the thermal control of the YCHP with axial grooves is made from the 1st order diffusion model that considers the diffusive expansion of inert gas by concentration gradient. Ammonia is used as a working fluid and Nitrogen as a control gas in the Aluminum tube. As a result, the thermal performance of YCHP based on diffusion model has been compared with that of YCHP from flat front model. Additionally, it is found that the concentration of inert gas is distributed in the condenser region of YCHP with axial grooves.

• Proceedings of the Korean Nuclear Society Conference
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• 1998.05b
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• pp.273-278
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• 1998

The phase stability of atomized U-10wt. ％Mo powder and the thermal compatibility of dispersed fuel meats at 40$0^{\circ}C$ and 50$0^{\circ}C$ have been characterized. Atomized U-10Mo powder has a good \ulcorner-U phase stability, and excellent thermal compatibility with aluminum matrix in a dispersion fuel. It is thought that the good phase stability is related to th large supersaturation of Mo atoms in the atomized particles. The reasons for the excellent thermal compatibility have been considered to be as follows. Before thermal decomposition of ${\gamma}$-U in particle, supersaturated Mo atoms at ${\gamma}$-U grain boundaries inhibit the diffusion of Al atoms. After thermal decomposition of ${\gamma}$-U into ${\gamma}$-U and U$_2$Mo, the intermetallic compound of U$_2$Mo seems to retard the penetration of Al atoms. The penetration mechanisms of aluminum atoms in the atomized particles are assumed be classified as (a) diffusion through the reacted layer between fuel particles and Al matrix leaving a kernel-like unreacted island and (b) diffusion along grain boundaries showing several unreacted islands and more reacted regions.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.5
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• pp.1042-1046
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• 2007

In this study, we investigated the mechanism responsible for the thermal stability of CoSi by addition of a foreign chemical element. Addition of W was found to increase the heat of formation of CoSi. This increase was claimed to inhibit the glass formation, which is preferred by silicide formation kinetics depicted by the maximum system energy degradation rate. In this case, there forms at the interface between CoSi and Si wafer a crystalline structure, the effective diffusion coefficient of which is much less than the self-diffusion rate provided by the glass. It was stated that the phase transition requires a higher thermal energy as the consequence, thereby enhancing the thermal stability of CoSi.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.30-33
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• 2004

Shallow p+-n junctions were formed by low-energy ion implantation and dual-step annealing processes The dopant implantation was performed into the crystalline substrates using $BF_2$ ions. The annealing was performed with a rapid thermal processor and a furnace. FA+RTA annealing sequence exhibited better junction characteristics than RTA+FA thermal cycle from the viewpoint of junction depth. A new simulator is designed to model boron diffusion in silicon, which is especially useful for analyzing the annealing process subsequent to ion implantation. The model which is used in this simulator takes into account nonequilibrium diffusion, reactions of point defects, and defect-dopant pairs considering their charge states, and the dopant inactivation by introducing a boron clustering reaction. Using a resonable parameter values, the simulator covers not only the equilibrium diffusion conditions but also the nonequilibrium post-implantation diffusion. Using initial conditions and boundary conditions, coupled diffusion equation is solved successfully. The simulator reproduced experimental data successfully.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.1
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• pp.15-21
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• 2015

The purpose of this paper is to analyze thermal characteristics of the heat sinks to maximize the thermal diffusivity for LED floodlight. The 2 kind of samples were prepared by vapor chamber manufacturing technology using the heat pipe principle. It was analyzed the maximum temperature reduction effect and the thermal diffusion from the heat source depending on the types of chambers with 3 kind of working fluids. As a result, it was confirmed that thermal conductivity 23% increased, GVC-R type than IVC-R type.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Progress in Superconductivity and Cryogenics
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• v.14 no.2
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• pp.32-35
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• 2012

The objective of the present work is to develop a precise instrument for measuring the thermal property of insulating material over a temperature range from 30 K to near room temperature by utilizing a cryocooler. The instrument consists of two thermal links, a test sample, heat sink, heat source and vacuum vessel. The cold head of the cryocooler as a heat sink is thermally anchored to the thermal link and used to bring the apparatus to a desired temperature in a vacuum chamber. An electric heater as a heat source is placed in the middle of test sample for generating uniform heat flux. The entire apparatus is covered by thermal shields and wrapped in multi-layer insulation to minimize thermal radiation in a vacuum chamber. For a supplied heat flux the temperature distribution in the insulating material is measured in steady and transient state. The thermal conductivity of insulating material is measured from temperature difference for a given heat flux. In addition, the specific heat of insulating material is obtained by solving one-dimensional heat diffusion equation.

• Proceedings of the SAREK Conference
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• 2008.06a
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• pp.970-975
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• 2008

This study considers indoor thermal comfort in an ondol space by supply vent configurations to prevent cold draft in winter. A specially-designed vent cap has been investigated in comparison with a round pan-type vent and a simple opening without a cap. Numerical simulations have been conducted using CFD to analyze thermal comfort indices such as Predicted Mean Vote (PMV) and Effective Draft Temperature (EDT) as well as air distribution index i.e. Air Diffusion Performance Index (ADPI). Results show the new vent cap provides improved thermal comfort conditions especially near ondol heated floor, as the cold outdoor air spreads upwards along the vertical wall before reaching occupant region near floor. This paper includes discussions on the flow and comfort distributions created by the thermal jets from the vents.

• Journal of the Korean Society of Combustion
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• v.4 no.2
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• pp.97-108
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• 1999

This numerical study was to investigate the effect of $CO_2$ addition on the structures and NOx formation characteristics in $CH_4$ counterflow diffusion flame. The importance of radiation effect was identified and $CO_2$ addition effect was investigated in terms of thermal and chemical reaction effect. Also the causes of NOx reduction were clarified by separation method of each formation mechanisms. The results were as follows : The radiation effect was intensified by $CO_2$ addition. Thermal effect mainly contributed to the changes in flame structure and the amount of NO formation but the chemical reaction effect also cannot be neglected. The reduction of thermal NO was dominant with respect to reduction rate, but that of prompt NO was dominant with respect to total amount.

• Steel and Composite Structures
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• v.36 no.3
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• pp.249-259
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• 2020

In this work, a novel three-dimensional model in the generalized thermoelasticity for a homogeneous an isotropic medium was investigated with diffusion, under the effect of thermal loading due to laser pulse in the context of Green-Lindsay theory was investigated. The normal mode analysis technique is used to solve the resulting non-dimensional equations of the problem. Numerical results for the displacement, the thermal stress, the strain, the temperature, the mass concentration, and the chemical potential distributions are represented graphically to display the effect of the thermal loading due to laser pulse and the relaxation time on the resulting quantities. Comparisons are made within the theory in the presence and absence of laser pulse.